Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2013
02/06/2013CN102915984A Semiconductor packaging structure and manufacturing method therefor
02/06/2013CN102915983A Packaging substrate having embedded interposer and fabrication method thereof
02/06/2013CN102915981A Semiconductor device and packaging method thereof
02/06/2013CN102915979A Chip package structure and production method thereof
02/06/2013CN102915977A Circuit substrate, circuit substrate device, and method for manufacturing circuit substrate
02/06/2013CN102915975A Method for manufacturing BJT (bipolar junction transistor) and BiCMOS (bipolar complementary metal oxide semiconductor)
02/06/2013CN102915974A Junction field-effect transistor (JFET) pipe compatible process with double pole and P-ditch aligning automatically
02/06/2013CN102915973A Manufacturing method of dual stress film and semiconductor device
02/06/2013CN102915972A Method for nickel base silicide horizontal inrush during processing of self-alignment polycrystal silicide
02/06/2013CN102915971A Manufacturing method of semiconductor device
02/06/2013CN102915970A Manufacturing method of semiconductor device
02/06/2013CN102915969A Semiconductor device and manufacturing method thereof
02/06/2013CN102915968A Manufacturing method of CMOS (Complementary Metal oxide Semiconductor) transistor
02/06/2013CN102915967A Method for compatible integrated manufacture of silicon crystal diodes and triodes
02/06/2013CN102915966A Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies
02/06/2013CN102915965A Apparatus and method for manufacturing a flexible display device
02/06/2013CN102915964A Method of manufacturing an IC comprising a plurality of bipolar transistors and IC comprising a plurality of bipolar transistors
02/06/2013CN102915963A Thin film transistor substrate, display device employing same and manufacturing method of thin film transistor
02/06/2013CN102915962A Method for preparing copper metal coating layer
02/06/2013CN102915961A Manufacturing method of electronic programmable fuse device
02/06/2013CN102915960A Production method of metal interconnection structure
02/06/2013CN102915959A Method for simplifying etching and forming techniques for word line dielectric film in storage
02/06/2013CN102915958A Copper interconnection structure and making method thereof
02/06/2013CN102915957A Method for making air bridge and inductance
02/06/2013CN102915956A Method for manufacturing benzocyclobutene resin dielectric layer on silicon through hole wall
02/06/2013CN102915955A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/06/2013CN102915954A Low-K dielectric layer and porogen
02/06/2013CN102915953A Amorphous carbon film processing method and opening forming method
02/06/2013CN102915952A Manufacturing method for semiconductor device
02/06/2013CN102915951A Manufacturing method of connecting hole
02/06/2013CN102915950A Method for simultaneously manufacturing through holes and grooves on semiconductor devices
02/06/2013CN102915949A Method for embedding metal material in substrate
02/06/2013CN102915948A Forming method of a shallow-groove isolation structure
02/06/2013CN102915947A Method for forming silicon-on-insulator structure for active pixel sensor
02/06/2013CN102915946A Method for forming silicon-on-insulator structure
02/06/2013CN102915945A Method for manufacturing integrated circuit
02/06/2013CN102915944A Substrate connecting method
02/06/2013CN102915943A Electrostatic chuck and semiconductor equipment
02/06/2013CN102915942A Precise wafer fixing device of optical coupler
02/06/2013CN102915941A Automatic wafer conversion machine
02/06/2013CN102915940A Substrate surface processing system having compact structure and substrate surface treatment method
02/06/2013CN102915939A Method for detecting migration distance of carriers in ion well under optical radiation
02/06/2013CN102915938A Device for detecting defects at back of wafer and method therefor
02/06/2013CN102915937A Device and method for preventing wafer from slipping off
02/06/2013CN102915936A Method and apparatus for inspecting a semiconductor chip prior to bonding
02/06/2013CN102915935A 晶片加工方法 Wafer processing method
02/06/2013CN102915934A High-precision BGA (ball grid array) ball mounting device
02/06/2013CN102915933A Surface mounting welding process for wafer-level chip
02/06/2013CN102915932A Method for manufacturing semiconductor device and semiconductor device
02/06/2013CN102915931A Non-film jig and application of non-film process in manufacturing process of chip on board (COP)
02/06/2013CN102915930A Method for changing mutual inductance between radio-frequency spiral inductors and radio-frequency circuit
02/06/2013CN102915929A Method for manufacturing graphene field-effect device
02/06/2013CN102915928A Method of manufacturing power device
02/06/2013CN102915927A Wet etching method for metal layer on front surface of high inverse-voltage Schottky diode
02/06/2013CN102915926A AlN (aluminum nitride) substrate based graphene transfer and annealing method and manufactured device
02/06/2013CN102915925A Method for depositing an amorphous carbon film with improved density and step coverage
02/06/2013CN102915924A Manufacturing method of dual stress film and semiconductor device
02/06/2013CN102915923A Manufacturing method of dual stress film and semiconductor device
02/06/2013CN102915922A Method for manufacturing semiconductor devices
02/06/2013CN102915921A Protection of reactive metal surfaces of semiconductor devices during shipping by providing an additional protection layer
02/06/2013CN102915920A Method for lowering particle defects after chemical mechanical polishing
02/06/2013CN102915919A Integrated circuit device having defined gate spacing and method of designing and fabricating thereof
02/06/2013CN102915918A Metal silicide forming method
02/06/2013CN102915917A Method for preparing complementary metal-oxide-semiconductor type field effect transistor
02/06/2013CN102915916A Semiconductor device and forming method thereof
02/06/2013CN102915915A Implantation method utilizing additional mask
02/06/2013CN102915914A Source bottle liquid level conduction temperature control system and control method for phosphorous source diffusion
02/06/2013CN102915913A Graphene CVD (chemical vapor deposition) direct epitaxial growth method based on sapphire substrate and device fabricated with method
02/06/2013CN102915912A Method for forming sacrifice oxide layer on silicon carbide surface
02/06/2013CN102915911A Etching method for improving bottom of silicon carbide table board
02/06/2013CN102915910A Method of manufacturing semiconductor device and substrate processing apparatus
02/06/2013CN102915909A Method for improving internal environment of acid tank type silicon wafer rinsing equipment
02/06/2013CN102915908A Pretreatment method for silanization and silanization method comprising the method
02/06/2013CN102915907A Semiconductor device manufacturing method
02/06/2013CN102915899A Method and equipment for regulating parallelism of ion beams in ion implantation device
02/06/2013CN102915819A Active laser trimming substrate bearing table
02/06/2013CN102915818A Method for controlling resistance of thick-film resistor
02/06/2013CN102914951A Pre-aligning device for photoetching device
02/06/2013CN102914950A Dry re-stripping method for metal layer photoetching
02/06/2013CN102914927A Array substrate and method for manufacturing same
02/06/2013CN102914919A Method and device for fabricating multidimensional electric filed mode liquid crystal display
02/06/2013CN102914139A Wafer drying equipment and forming method thereof
02/06/2013CN102912447A Processing method for improving single crystal quality of zinc oxide
02/06/2013CN102912350A Etching solution and method for forming patterned multilayer metal layer
02/06/2013CN102912319A Liquid material vaporizer
02/06/2013CN102912316A Deposition source assembly and organic layer deposition apparatus
02/06/2013CN102912176A High-end packaging silver alloy bonding wire and method for manufacturing same
02/06/2013CN102911618A Dicing die-bonding film
02/06/2013CN102911617A Dicing die-bonding film
02/06/2013CN102911616A Die-bonding film, dicing / die-bonding film and semiconductor device
02/06/2013CN102911614A Adhesive tape for manufacturing semiconductor devices and method for manufacturing semiconductor devices by using adhesive tape
02/06/2013CN102909980A Transfer substrate and method of manufacturing a display apparatus
02/06/2013CN102909825A Independent multi-cylinder, isobaric and synchronous hydraulic injection molding system for semiconductor plastic packaged mould
02/06/2013CN102909639A Surface treatment method of semiconductor substrate
02/06/2013CN102909268A Concave pit notching and cutting composite mould for integrated chip lead frame
02/06/2013CN102909205A Exhaust air system and method therefor
02/06/2013CN102909204A Method for cleaning wafer after deep silicon etching process
02/06/2013CN102909156A Structure of chip dispensing jig and dispensing method
02/06/2013CN102290352B Introducing technology of local stress of MOS (Metal Oxide Semiconductor) transistor
02/06/2013CN102280454B Semiconductor transistor structure and making method thereof
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