| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/07/2013 | US20130032882 Bi-directional blocking voltage protection devices and methods of forming the same |
| 02/07/2013 | US20130032881 Asymmetric Source-Drain Field Effect Transistor and Method of Making |
| 02/07/2013 | US20130032880 High voltage device and manufacturing method thereof |
| 02/07/2013 | US20130032877 N-channel transistor comprising a high-k metal gate electrode structure and a reduced series resistance by epitaxially formed semiconductor material in the drain and source areas |
| 02/07/2013 | US20130032876 Replacement Gate ETSOI with Sharp Junction |
| 02/07/2013 | US20130032874 Method for manufacturing nonvolatile semiconductor memory device and nonvolatile semiconductor memory device |
| 02/07/2013 | US20130032873 Semiconductor memory device and method for manufacturing the same |
| 02/07/2013 | US20130032872 Non-volatile Memory Cell Having A High K Dielectric And Metal Gate |
| 02/07/2013 | US20130032870 Methods of forming a multi-tiered semiconductor device and apparatuses including the same |
| 02/07/2013 | US20130032869 Split-gate flash memory with improved program efficiency |
| 02/07/2013 | US20130032868 Trench capacitor with spacer-less fabrication process |
| 02/07/2013 | US20130032864 Transistor with boot shaped source/drain regions |
| 02/07/2013 | US20130032863 Integrated gate controlled high voltage divider |
| 02/07/2013 | US20130032862 High Voltage Resistor with High Voltage Junction Termination |
| 02/07/2013 | US20130032860 HFET with low access resistance |
| 02/07/2013 | US20130032859 Epitaxial extension cmos transistor |
| 02/07/2013 | US20130032858 Rare earth oxy-nitride buffered iii-n on silicon |
| 02/07/2013 | US20130032857 Silicon-Germanium Hydrides and Methods for Making and Using Same |
| 02/07/2013 | US20130032832 Display device and method for manufacturing display device |
| 02/07/2013 | US20130032822 Substrate, semiconductor device, and method of manufacturing the same |
| 02/07/2013 | US20130032821 Schottky barrier diode and method for manufacturing the same |
| 02/07/2013 | US20130032818 Semiconductor device and method for manufacturing semiconductor device |
| 02/07/2013 | US20130032816 High electron mobility transistors and methods of manufacturing the same |
| 02/07/2013 | US20130032814 Method and system for formation of p-n junctions in gallium nitride based electronics |
| 02/07/2013 | US20130032813 Method and system for doping control in gallium nitride based devices |
| 02/07/2013 | US20130032812 Method and system for a gan vertical jfet utilizing a regrown channel |
| 02/07/2013 | US20130032811 Method and system for a gan vertical jfet utilizing a regrown gate |
| 02/07/2013 | US20130032809 Semiconductor Devices with Non-Implanted Barrier Regions and Methods of Fabricating Same |
| 02/07/2013 | US20130032807 Circuit board, method of manufacturing circuit board, display, and electronic unit |
| 02/07/2013 | US20130032801 Electronic device and method for manufacturing same |
| 02/07/2013 | US20130032799 Apparatus and Methods for De-Embedding Through Substrate Vias |
| 02/07/2013 | US20130032797 Field-effect transistor and method for manufacturing the same |
| 02/07/2013 | US20130032793 Thin film transistor array panel and manufacturing method thereof |
| 02/07/2013 | US20130032784 Thin film transistor including a nanoconductor layer |
| 02/07/2013 | US20130032783 Non-planar germanium quantum well devices |
| 02/07/2013 | US20130032781 Epitaxial substrate and method for manufacturing epitaxial substrate |
| 02/07/2013 | US20130032777 Semiconductor Device and Manufacturing Method thereof |
| 02/07/2013 | US20130032767 Octapod shaped nanocrystals and use thereof |
| 02/07/2013 | US20130032716 Electron beam apparatus and a device manufacturing method by using said electron beam apparatus |
| 02/07/2013 | US20130032701 Inputting module and submount thereof and manufacturing method of the submount |
| 02/07/2013 | US20130032509 Substrate storage container |
| 02/07/2013 | US20130032508 Tray for semiconductor integrated circuits |
| 02/07/2013 | US20130032179 Substrate processing apparatus, substrate processing method and storage medium |
| 02/07/2013 | DE112011101215T5 Metall-Gate-Stapel mit hoher Dielektrizitätskonstante K Metal gate stack with a high dielectric constant K |
| 02/07/2013 | DE112010000667T5 Vorrichtung zum Aufbringen von Kunstharz und Vorrichtung zum Erzeugen von Daten zum Aufbringen von Kunstharz Apparatus for applying synthetic resin and apparatus for generating data for applying synthetic resin |
| 02/07/2013 | DE112007000010B4 Halbleitervorrichtung mit IGBT-Zelle und Diodenzelle, sowie Verfahren zur Gestaltung hiervon A semiconductor device comprising IGBT cell and diode cell, and methods thereof for the design of |
| 02/07/2013 | DE10362334B4 Halbleitervorrichtung mit epitaktisch gefülltem Graben und Verfahren zur Herstellung einer Halbleitervorrichtung mit epitaktisch gefülltem Graben A semiconductor device comprising epitaxially filled trench and method of manufacturing a semiconductor device having epitaxially filled trench |
| 02/07/2013 | DE102012211344A1 Verfahren zum Vergraben leitfähiger Netze in transparente Elektroden A method of burying conductive networks in transparent electrodes |
| 02/07/2013 | DE102012014428A1 Kontaktanschluss Contact Termination |
| 02/07/2013 | DE102011109647A1 Apparatus for displacing and/or pivoting of gripper used for holding disk-shaped substrates, has a specific moving unit which is controlled such that pivoting of specific support unit is caused relative to the other support unit |
| 02/07/2013 | DE102011109444A1 Spacing element for clamping unit used in plates of wafer boat, has communication port that is extended along transverse direction to base portion through hole which is extended between front ends of base portion in length direction |
| 02/07/2013 | DE102011109226A1 Method for establishing interconnection layer between e.g. ceramic carrier and LED chip, involves providing mixture with particulate sinter material and solvent, and supplying heat for fusion of sinter material in inert gas atmosphere |
| 02/07/2013 | DE102011108981A1 Struktureinrichtung mit einem Bauelement, Vorrichtung zur Applikation des Bauelements, Verfahren zur Herstellung der Struktureinrichtung und Verfahren zur Applikation des Bauelements Structure means with a component, device for applying the device, method of manufacturing the device structure, and methods of application of the component |
| 02/07/2013 | DE102011080534A1 Verfahren zum Ultraschallbonden A method for ultrasonic bonding |
| 02/07/2013 | DE102011080440A1 Verfahren zur Herstellung von Metallgateelektrodenstrukturen mit großem ε mittels einer frühen Deckschichtanpassung A process for the production of metal gate electrode structures with large ε cover layer by means of an early adaptation |
| 02/07/2013 | DE102011080439A1 Halbleiterbauelement mit Metallgateelektrodenstrukturen und Nicht-FET's mit unterschiedlicher Höhe durch frühe Anpassung einer Gatestapeltopographie A semiconductor device with metal gate electrode structures and non-FETs with different heights by early adaptation of a gate stack topography |
| 02/07/2013 | DE102011080323A1 Method for simultaneously abrasive processing e.g. front surface of single crystalline silicon wafer in semiconductor industry, involves locating wafer and ring in recess of rotor disk such that edge of recess of disk guides wafer and ring |
| 02/07/2013 | DE102011080299A1 Circuit substrate for mounting semiconductor chip of e.g. semiconductor device, has filler metal that is partially filled in intermediate space provided between the ceramic materials |
| 02/07/2013 | DE102011080202A1 Vorrichtung und Verfahren zur Herstellung von dünnen Schichten Device and method for the production of thin layers |
| 02/07/2013 | DE102011076696B4 Verfahren zur Leistungssteigerung in Transistoren durch Vorsehen eines eingebetteten verformungsinduzierenden Halbleitermaterials auf der Grundlage einer Saatschicht und entsprechendes Halbleiterbauelement Performance improvement processes in transistors by providing an embedded strain-inducing semiconductor material on the basis of a seed layer and corresponding semiconductor device |
| 02/07/2013 | DE102011052444A1 Verfahren zur linearen Strukturierung eines beschichteten Substrats zur Herstellung von Dünnschicht-Solarzellenmodulen Method for linear structuring of a coated substrate for the production of thin-film solar cell modules |
| 02/07/2013 | DE102011003006B4 Verfahren zur Bereitstellung jeweils einer ebenen Arbeitsschicht auf jeder der zwei Arbeitsscheiben einer Doppelseiten-Bearbeitungsvorrichtung A method for providing a level each work shift on each of the two work pane of a double sided machining device |
| 02/07/2013 | DE102010040071B4 Verfahren zur Wiederherstellung von Oberflächeneigenschaften empfindlicher Dielektrika mit kleinem ε in Mikrostrukturbauelementen unter Anwendung einer in-situ-Oberflächenmodifizierung A process for the recovery of surface properties of sensitive dielectrics with small ε in microstructure devices using an in-situ surface modification |
| 02/07/2013 | DE102010038259B4 Verfahren und Vorrichtung zum Gravieren eines flexiblen Bands Method and apparatus for engraving a flexible tape |
| 02/07/2013 | DE102010013520B4 Verfahren zur beidseitigen Politur einer Halbleiterscheibe Method for two-sided polishing a semiconductor wafer |
| 02/07/2013 | DE102009035438B4 Verwendung von Dielektrika mit großem ε als sehr selektive Ätzstoppmaterialien in Halbleiterbauelementen, sowie Halbleiterbauelemente Use of dielectrics with large ε as a highly selective etch stop in semiconductor devices, and semiconductor devices |
| 02/07/2013 | DE102008054074B4 Verfahren zum Verringern von Ungleichmäßigkeiten während des chemisch-mechanischen Polierens von Mikrostrukturbauelementen durch Verwenden von CMP-Belägen in einem glasierten Zustand A method for reducing non-uniformities during the chemical-mechanical polishing of microstructure devices by using CMP pads in a glazed state |
| 02/07/2013 | DE102008026133B4 Verfahren zum Verringern der Metallunregelmäßigkeiten in komplexen Metallisierungssystemen von Halbleiterbauelementen A method for reducing irregularities in the metal complex metallization systems of semiconductor devices |
| 02/07/2013 | DE102007063765B3 Integrated circuit's layout designing method, involves providing cells, where maximum expansions of cells are equal in direction, and placing cells for providing layout of integrated circuit, where external boundary line has form of polygon |
| 02/07/2013 | DE102007011163B4 Verbindungsstruktur und Verfahren zum Herstellen derselben, nicht-flüchtige Halbleiterspeichervorrichtung, elektrische Speicherkarte und elektrisches Gerät Connection structure and method of manufacturing the same, non-volatile semiconductor memory device, memory card and electrical electrical device |
| 02/07/2013 | DE102006062035B4 Verfahren zum Entfernen von Lackmaterial nach einer Implantation mit hoher Dosis in einem Halbleiterbauelement A method for removing resist material after implantation with a high dose in a semiconductor device |
| 02/07/2013 | DE102006040585B4 Verfahren zum Auffüllen eines Grabens in einem Halbleiterprodukt A method for filling a trench in a semiconductor product |
| 02/07/2013 | DE102006001253B4 Verfahren zur Herstellung einer Metallschicht über einem strukturierten Dielektrikum mittels einer nasschemischen Abscheidung mit einer stromlosen und einer leistungsgesteuerten Phase A process for producing a metal layer over a patterned dielectric by means of a wet chemical deposition with an electroless plating and a power-controlled phase |
| 02/07/2013 | DE102005062921B4 System und Verfahren zum Zuschneiden von Flüssigkristalldisplay-Tafeln sowie Herstellverfahren für ein Flüssigkristalldisplay unter Verwendung derselben System and method for cutting of liquid crystal display panels as well as production method for a liquid crystal display using the same |
| 02/07/2013 | DE102005034120B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 02/07/2013 | DE102004041619B4 Vorrichtung und Verfahren zum Entfernen eines Beschichtungsfilmes Apparatus and method for removing a coating film |
| 02/07/2013 | DE102004014744B4 Halbleiterbaugruppe mit einem Graben zum Treiben eines Schaltselement und Vermeiden eines Latch-up Durchbruchs Semiconductor device having a trench for driving a switching element and avoiding a latch-up breakdown |
| 02/07/2013 | CA2844535A1 Apparatuses, systems and methods for cleaning photovoltaic devices |
| 02/07/2013 | CA2843918A1 Working electrode printed on a substrate |
| 02/07/2013 | CA2837164A1 Method and apparatus for measuring temperature of semiconductor layer |
| 02/06/2013 | EP2555594A1 Donor substrate for transfer, device manufacturing method and organic element |
| 02/06/2013 | EP2555256A2 Semiconductor template substrate, light-emitting element using a semiconductor template substrate, and a production method therefor |
| 02/06/2013 | EP2555250A1 Paste composition for solar cell, method for producing same, and solar cell |
| 02/06/2013 | EP2555246A1 Semiconductor device and method for producing same |
| 02/06/2013 | EP2555242A1 Enhancement-/depletion-PHEMT device and manufacturing method thereof |
| 02/06/2013 | EP2555235A1 Method of manufacturing an IC comprising a plurality of bipolar transistors and IC comprising a plurality of bipolar transistors |
| 02/06/2013 | EP2555234A2 Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp |
| 02/06/2013 | EP2555233A1 Exhaust air system and method therefor |
| 02/06/2013 | EP2555232A1 Epitaxial substrate for semiconductor element and semiconductor element |
| 02/06/2013 | EP2555231A1 Field effect transistor |
| 02/06/2013 | EP2555230A2 Method of manufacturing power device |
| 02/06/2013 | EP2555229A1 Polishing agent, polishing method and method for manufacturing semiconductor integrated circuit device |
| 02/06/2013 | EP2555228A1 Light source apparatus, optical apparatus, exposure apparatus, device manufacturing method, illuminating method, exposure method, and method for manufacturing optical apparatus |
| 02/06/2013 | EP2555227A1 Silicon epitaxial wafer and method for producing the same, as well as bonded soi wafer and method for producing the same |
| 02/06/2013 | EP2555053A1 Positive-type photosensitive resin composition |
| 02/06/2013 | EP2555052A1 Photomask unit and method of manufacturing same |
| 02/06/2013 | EP2555001A1 Contact probe, contact probe connecting body and methods for manufacturing same |
| 02/06/2013 | EP2554719A1 Epitaxial substrate and method for manufacturing epitaxial substrate |
| 02/06/2013 | EP2554718A1 Method for producing single crystal 3c-sic substrate and resulting single-crystal 3c-sic substrate |
| 02/06/2013 | EP2554711A1 Plated article having metal thin film formed by electroless plating, and manufacturing method thereof |