| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/08/2015 | DE102013011139A1 Dosierverfahren und Dosierventil zur Jetdosierung schwer dosierbarer Medien Dosing and metering valve for Jetdosierung difficult to dose media |
| 01/08/2015 | DE102011100056B4 Verfahren zur Festphasen-Kristallisation einer amorphen oder polykristallinen Schicht Method for solid-phase crystallization of amorphous or polycrystalline layer |
| 01/08/2015 | DE102011051112B4 Verfahren zur Messung der Hochspannungsdegradation von zumindest einer Solarzelle oder eines Photovoltaik-Moduls sowie dessen Verwendung Method for measuring the Hochspannungsdegradation of at least one solar cell or a photovoltaic module and the use thereof |
| 01/08/2015 | DE102010016455B4 Halbleiterbauelement, Herstellungsverfahren für ein Halbleiterbauelement, sowie integrierte Leistungsschaltung A semiconductor device manufacturing method for a semiconductor device, and power integrated circuit |
| 01/08/2015 | DE102007020249B4 Halbleiterbauelement, Halbleitersensorstruktur sowie Vorrichtung und Verfahren zum Herstellen eines Halbleiterbauelement Semiconductor device, the semiconductor sensor structure as well as apparatus and method for manufacturing a semiconductor device |
| 01/08/2015 | DE102006029682B4 Halbleiterstruktur und Verfahren zur Herstellung der Struktur Semiconductor structure and method for making the structure |
| 01/08/2015 | DE102005038939B4 Halbleiterspeicherbauelement mit oberseitig selbstjustiert angeordneten Wortleitungen und Verfahren zur Herstellung von Halbleiterspeicherbauelementen The semiconductor memory device with self-aligned on the upper side disposed word lines and methods for the production of semiconductor memory devices |
| 01/08/2015 | DE102004060444B4 Verfahren zum Bilden einer Polysiliziumschicht in einem Halbleiterbauelement A method of forming a polysilicon layer in a semiconductor device |
| 01/07/2015 | EP2822040A1 Nanodevice and manufacturing method for same |
| 01/07/2015 | EP2822039A1 Semiconductor device |
| 01/07/2015 | EP2822030A1 Manufacturing method for array substrate, array substrate and display |
| 01/07/2015 | EP2822029A1 Power semiconductor device, method for manufacturing same, and bonding wire |
| 01/07/2015 | EP2822028A1 Method for electrical activation of dopant species in a GaN film |
| 01/07/2015 | EP2822027A2 Method for manufacturing a double-gate electronic memory cell and related memory cell |
| 01/07/2015 | EP2822026A1 Composite substrate |
| 01/07/2015 | EP2821532A1 Method for processing group-iii nitride substrate and method for manufacturing epitaxial substrate |
| 01/07/2015 | EP2820677A1 Memristor with channel region in thermal equilibrium with containing region |
| 01/07/2015 | EP2820675A1 Integrated circuit with electromagnetic energy anomaly detection and processing |
| 01/07/2015 | EP2820672A2 Wire arrangement for an electronic circuit and method of manufacturing the same |
| 01/07/2015 | EP2820671A1 Structure and method for strain-relieved tsv |
| 01/07/2015 | EP2820670A1 Methods and apparatus for depositing and/or etching material on a substrate |
| 01/07/2015 | EP2820669A1 Method for producing a monocrystalline metal/semiconductor compound |
| 01/07/2015 | CN204090289U 线路板的列引脚封装结构和线路板 PCB column pin package and board structure |
| 01/07/2015 | CN204088352U 一种槽式湿法设备用插片盒 Slotted wet equipment insert the cassette |
| 01/07/2015 | CN204088329U 双向触发二极管芯片 DIAC chip |
| 01/07/2015 | CN204088324U 一种高压驱动电路的隔离结构 A high voltage driving circuit isolation structure of |
| 01/07/2015 | CN204088323U 全局曝光方式的图像传感器像素结构 The image sensor pixel structure global exposure system |
| 01/07/2015 | CN204088322U 全局曝光方式的图像传感器像素结构 The image sensor pixel structure global exposure system |
| 01/07/2015 | CN204088305U 新型高密度可堆叠封装结构 New high-density stackable package |
| 01/07/2015 | CN204088290U 风冷系统及uv设备 Uv air-cooled systems and equipment |
| 01/07/2015 | CN204088289U 铝质压环 Aluminum pressure ring |
| 01/07/2015 | CN204088288U 一种用于蓝膜粘片的顶针帽 A piece of blue sticky film thimble cap |
| 01/07/2015 | CN204088287U 一种具均匀冷却效果的承载板 One kind of cooling effect of having a uniform carrier plate |
| 01/07/2015 | CN204088286U 一种太阳能电池载片花篮的校正装置 A solar cell calibration device slides baskets |
| 01/07/2015 | CN204088285U 一种新型芯片自动焊接装置 A new chip automatic welding equipment |
| 01/07/2015 | CN204088284U 芯片卷带限位装置 Chip tape stopper |
| 01/07/2015 | CN204088283U 用于rfid芯片封装中的载带 Rfid chip package for the carrier tape |
| 01/07/2015 | CN204088282U 一种多晶硅片清洗机自动提篮装置 One kind of polycrystalline silicon wafer cleaning device automatically basket |
| 01/07/2015 | CN204088281U 紫外线固化装置 UV curing device |
| 01/07/2015 | CN204088280U 用于再熔焊料沉积物的装置 Means for re-welding material deposits |
| 01/07/2015 | CN204088279U 一种双点胶四邦定头倒封装装置 A dual dispensing head down four bonding packaging unit |
| 01/07/2015 | CN204088278U 晶圆倒封装单翻转头取晶装置 Single wafer packaging flip head down to take crystal device |
| 01/07/2015 | CN204088277U 中小尺寸液晶基板吸附翻转装置 Small and medium-size LCD substrate adsorption turning device |
| 01/07/2015 | CN204088276U 智能卡封装机 Smart card packaging machines |
| 01/07/2015 | CN204088275U 硅片自动吹片装置 Automatic blowing piece of silicon devices |
| 01/07/2015 | CN204088274U 探针台的晶圆芯粒自动对准装置 Wafer probe station core tablets automatic alignment apparatus |
| 01/07/2015 | CN204088273U 半导体元件焊线检验工装 Semiconductor component test fixture wire bonders |
| 01/07/2015 | CN204088272U 一种半导体激光器阵列连接界面表征装置 A semiconductor laser array device connection interface characterization |
| 01/07/2015 | CN204088271U 一种光伏单片测试装置 A monolithic photovoltaic testing device |
| 01/07/2015 | CN204088270U 一种太阳能电池板的湿热测试装置 A solar cell panel moist heat test apparatus |
| 01/07/2015 | CN204088269U 一种用于sot89-3l引线框架键合的新型治具 The new fixture for sot89-3l lead frame bonding |
| 01/07/2015 | CN204088268U 芯片接合装置 Chip bonding device |
| 01/07/2015 | CN204088267U 一种快速热退火装置 A rapid thermal annealing apparatus |
| 01/07/2015 | CN204088266U 一种电容电阻及晶片类电子元件的粉体封装机构 Powder package body resistance and capacitance of a chip electronic components |
| 01/07/2015 | CN204088265U 一种二极管双洗转换自动化设备 Conversion to a diode double wash automation equipment |
| 01/07/2015 | CN204086808U 一种应用在涂胶机上的光刻胶过滤回收循环系统 An application on a photoresist coater recycled filtration system |
| 01/07/2015 | CN204078848U 致冷件成型机自动进料轮 Refrigeration molding machine automatic feeding wheel |
| 01/07/2015 | CN204075494U 一种芯片封装中铜球焊接的控制结构 A chip package structure for controlling the welding of copper balls |
| 01/07/2015 | CN204074597U 一种硅片清洗废水回收再利用系统 One kind of wafer cleaning waste water recycling system |
| 01/07/2015 | CN104272489A 衬底的功能化 Functionalized substrates |
| 01/07/2015 | CN104272462A 氧化物半导体薄膜晶体管的制备方法、使用该晶体管的有源操作显示装置和有源操作传感器装置 Preparation oxide semiconductor thin film transistor, using the active transistor operation display device and an active operation sensor means |
| 01/07/2015 | CN104272457A 具有偏移再分布层固位焊盘的晶片级封装管芯 Wafer level package having an offset die redistribution layer retention pad |
| 01/07/2015 | CN104272454A 半导体模块以及半导体装置 The semiconductor module and semiconductor device |
| 01/07/2015 | CN104272452A 互补金属氧化物半导体(cmos)器件和方法 Complementary metal oxide semiconductor (cmos) devices and methods |
| 01/07/2015 | CN104272451A 用于定位具有纵横比的纳米对象的方法和装置 Method and apparatus for positioning an object having an aspect ratio of the nano- |
| 01/07/2015 | CN104272450A 静电夹具和静电夹具的制造方法 Electrostatic chuck manufacturing method and electrostatic chuck |
| 01/07/2015 | CN104272449A 端部处理器 Ends Processor |
| 01/07/2015 | CN104272448A 用于从基体移除覆层的装置及方法 Apparatus and method for removing coating from the substrate for |
| 01/07/2015 | CN104272447A 半导体晶片的评价方法及半导体晶片的评价装置 Evaluation device semiconductor wafer and semiconductor wafer evaluation method |
| 01/07/2015 | CN104272446A 电子部件封装体及其制造方法 The electronic component package manufacturing method thereof |
| 01/07/2015 | CN104272445A 用于弹性体带的安装固定架及其使用方法 Installation bracket and methods of use for elastomeric band |
| 01/07/2015 | CN104272444A 具突变结的隧穿晶体管的制造方法 With abrupt junction tunneling transistor manufacturing method |
| 01/07/2015 | CN104272442A 半导体器件的制造方法 The method of manufacturing a semiconductor device |
| 01/07/2015 | CN104272441A 钨特征填充 Feature filled tungsten |
| 01/07/2015 | CN104272440A 用核化抑制的钨特征填充 Filled with tungsten nucleation suppression characteristics |
| 01/07/2015 | CN104272439A 硅晶圆用研磨液组合物 Silicon wafer with a polishing solution composition |
| 01/07/2015 | CN104272438A 用于清洁电镀衬底保持器的方法和装置 Method and apparatus for cleaning the plated substrate holder |
| 01/07/2015 | CN104272437A 半导体加工用粘合胶带 Semiconductor processing with adhesive tape |
| 01/07/2015 | CN104272436A 用于形成光电子装置的技术 Technique for forming optoelectronic devices |
| 01/07/2015 | CN104272435A 具有几何电解液流动路径的电镀处理器 Plating processor having an electrolyte flow path geometry |
| 01/07/2015 | CN104272434A 激光退火装置及激光退火方法 Laser annealing device and laser annealing method |
| 01/07/2015 | CN104272433A 用于改善注入束和源寿命性能的碳掺杂剂气体和协流 Beam injection to improve the performance and longevity of carbon source dopant gas and co-flow |
| 01/07/2015 | CN104272432A 放热基板及其制造方法 Exothermic substrate and manufacturing method |
| 01/07/2015 | CN104272431A 制造设备的监视装置以及监视方法 The monitoring device and a monitoring method of manufacturing equipment |
| 01/07/2015 | CN104272430A 外延衬底、用于制造外延衬底的方法和具有外延衬底的光电子半导体芯片 Epitaxial substrate, a method for manufacturing an epitaxial substrate and the optoelectronic semiconductor chip having an epitaxial substrate |
| 01/07/2015 | CN104272428A 用于多植入的对位基板的系统与方法 System and method for implantation of multiple bits for the substrate |
| 01/07/2015 | CN104272372A 显示装置、制造方法和电子设备 Display device, and electronic equipment manufacturing method |
| 01/07/2015 | CN104272193A 稀释剂组合物 Diluent composition |
| 01/07/2015 | CN104272189A 化学增幅型抗蚀剂组合物,使用化学增幅型抗蚀剂组合物的抗蚀剂膜,涂布抗蚀剂的掩模坯,形成光掩模和图案的方法,以及制造电子器件的方法和电子器件 Chemically amplified resist composition, a resist film using a chemically-amplified resist composition, a resist coated mask blank, a photomask and a method for forming a pattern, and a method of manufacturing an electronic device, and electronic devices |
| 01/07/2015 | CN104272188A 感光性树脂组合物、硬化膜的形成方法、硬化膜、有机el显示装置及液晶显示装置 The photosensitive resin composition, cured film forming method, cured film, an organic el display device and liquid crystal display device |
| 01/07/2015 | CN104272057A 使用红外探测的用于处理系统的原位基板探测 Using infrared detection probe for in situ substrate processing system |
| 01/07/2015 | CN104271804A 铝的电子束抛光 Electron beam polished aluminum |
| 01/07/2015 | CN104271798A 用于对衬底进行表面处理的装置和方法和用于制造光电子构件的方法 Method of fabricating an optoelectronic component apparatus and method for the surface treatment of the substrate and a |
| 01/07/2015 | CN104271694A 带粘接性树脂层的片和半导体装置的制造方法 The method of manufacturing a semiconductor device with a sheet and the adhesive resin layer |
| 01/07/2015 | CN104271675A 膜状热固性有机硅密封材料 Membranous thermosetting silicone sealant |
| 01/07/2015 | CN104271468A 基板箱、基板搬运箱、箱覆盖体、基板搬运系统及基板搬运方法 Board boxes, board totes, boxes covering the body, substrate handling system and a substrate transfer method |
| 01/07/2015 | CN104271332A 转印方法及热纳米压印装置 Thermal nanoimprint transfer method and apparatus |
| 01/07/2015 | CN104271323A 电子元件保持头、电子元件检测方法及裸片供给机 Electronic component holding head, the electronic component feeder detection method and die |
| 01/07/2015 | CN104271321A 工业用机器人 Industrial robot |
| 01/07/2015 | CN104271300A 用于制备金属化的由铝组成的基材的方法 Methods for preparing the metallized substrate composed of aluminum for |