| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/24/2013 | CN102148211B Semiconductor assembly, semiconductor device and manufacturing method |
| 04/24/2013 | CN102132376B Adhesive injection device |
| 04/24/2013 | CN102130168B Isolated LDMOS (Laterally Diffused Metal Oxide Semiconductor) device and manufacturing method thereof |
| 04/24/2013 | CN102130087B Three-dimensional integrated circuit metallic conductor rail and preparation method thereof |
| 04/24/2013 | CN102129996B Manufacturing method of DDDMOS (Double Diffused Drain MOS (Metal-Oxide-Semiconductor)) device |
| 04/24/2013 | CN102129964B Method for manufacturing resistor end effect curves of thick-film integrated circuit |
| 04/24/2013 | CN102124550B Metal nano-ink, process for producing the metal nano-ink, and die bonding method and die bonding apparatus using the metal nano-ink |
| 04/24/2013 | CN102122634B Method for etching through hole and metal wire trench |
| 04/24/2013 | CN102117764B Method for performing photolithographic process on deep hole substrate |
| 04/24/2013 | CN102109721B Method for manufacturing pixel array of liquid crystal display |
| 04/24/2013 | CN102104008B Chip packaging method |
| 04/24/2013 | CN102104002B Method for preparing metal-oxide-semiconductor field effect transistors (MOSFETs) with extremely short-gate length bulk-silicon surrounding gates |
| 04/24/2013 | CN102097491B Sonos及其制造方法 Sonos and manufacturing method thereof |
| 04/24/2013 | CN102097463B Semi self-aligned bipolar transistor and manufacturing method thereof |
| 04/24/2013 | CN102097390B Manufacturing method of pixel structure |
| 04/24/2013 | CN102082172B Polycrystalline triode manufactured by applying germanium silicon technology and manufacture method thereof |
| 04/24/2013 | CN102082113B Manufacturing method for deep isolation slot with air gaps |
| 04/24/2013 | CN102064128B Method for improving rounding of shallow trench isolation top angle by twice back-etching on silicon nitride |
| 04/24/2013 | CN102060865B Synthesis method of amide gadolinium complexes and application of gadolinium complexes in preparation of high-K material precursor |
| 04/24/2013 | CN102054782B Method for etching interpoly dielectric |
| 04/24/2013 | CN102054764B Method for manufacturing rectangular hole of semiconductor device by using KrF process and other processes in which linewidth is less than KrF |
| 04/24/2013 | CN102039638B Cutting method for cutting substrate by utilizing cutting line |
| 04/24/2013 | CN102036496B Installation method and device of an electronic component |
| 04/24/2013 | CN102027570B Water-repellant composition for substrate to be exposed, method of forming resist pattern, electronic device produced by the formation method, method of imparting water repellency to substrate to be exposed, water-repellant set for substrate to be ex |
| 04/24/2013 | CN102017104B Process for making doped zinc oxide |
| 04/24/2013 | CN102017080B Method of manufacturing Si(1-v-w-x)CwAlxNv substrate, method of manufacturing epitaxial wafer, Si(1-v-w-x)CwAlxNv substrate, and epitaxial wafer |
| 04/24/2013 | CN102013390B Sorting apparatus for semiconductor device |
| 04/24/2013 | CN102005440B 集成电路结构及其形成方法 Integrated circuit structure and method of forming |
| 04/24/2013 | CN101996866B Method for protecting overlay mark graph |
| 04/24/2013 | CN101983417B Plasma etching method |
| 04/24/2013 | CN101981710B Semiconductor light emitting element and method for manufacturing the same |
| 04/24/2013 | CN101969050B Silicon integrated high-current N type combined semiconductor device on insulator |
| 04/24/2013 | CN101964335B Packaging member and production method thereof |
| 04/24/2013 | CN101964330B Array substrate and method of fabricating the same |
| 04/24/2013 | CN101958153B Semiautomatic IC (Integrated Circuit) recorder |
| 04/24/2013 | CN101952778B Photosensitive resin laminate |
| 04/24/2013 | CN101944538B Semiconductor structures and manufacturing method thereof |
| 04/24/2013 | CN101908505B Method for manufacturing light-emitting diode chip |
| 04/24/2013 | CN101901766B Integrated circuit structure and method of forming the same |
| 04/24/2013 | CN101887919B Semiconductor device and manufacturing method thereof |
| 04/24/2013 | CN101884015B Resist underlayer film forming composition and method for forming resist pattern |
| 04/24/2013 | CN101878451B Blocked isocyanato bearing silicon containing composition for the formation of resist undercoat |
| 04/24/2013 | CN101863667B Ceramics and production method therefor, and ferroelectric capacitor, semiconductor device, other elements |
| 04/24/2013 | CN101859064B Method for forming resist pattern and method for manufacturing semiconductor device |
| 04/24/2013 | CN101853801B Method and apparatus of holding a device |
| 04/24/2013 | CN101847773B Method for making integrated rectangular-wave resonant cavity in integrated circuit chip |
| 04/24/2013 | CN101826556B Thin film transistor, method of fabricating the same, and organic light emitting diode display device having the same |
| 04/24/2013 | CN101818047B Silicon oxide-cerium oxide nuclear shell compounded abrasive granules, and preparation and application thereof |
| 04/24/2013 | CN101815661B Floating transfer apparatus, and treating system having the floating transfer apparatus |
| 04/24/2013 | CN101814457B High mobility channel device on the dislocation barrier layer |
| 04/24/2013 | CN101814456B IC circuit device and a fabricating method thereof |
| 04/24/2013 | CN101809712B Gas feeding device for semiconductor manufacturing facilities |
| 04/24/2013 | CN101807545B Diode and producing method of resistance converting storage |
| 04/24/2013 | CN101802988B Chip package with pin stabilization layer |
| 04/24/2013 | CN101795530B Circuit board and method for constructing the same |
| 04/24/2013 | CN101794088B Composition for removing photoresist and/or etching residue from a substrate and use thereof |
| 04/24/2013 | CN101779284B Method to fabricate adjacent silicon fins of differing heights |
| 04/24/2013 | CN101777522B Semiconductor device and method for manufacturing semiconductor device |
| 04/24/2013 | CN101770973B Plasma process equipment and static chuck device |
| 04/24/2013 | CN101743610B Treatment system for flat substrates |
| 04/24/2013 | CN101719477B Alignment mark and defect detection method |
| 04/24/2013 | CN101685825B Integrated circuit including diode memory cells |
| 04/24/2013 | CN101676220B Ozonated water flow and concentration control apparatus and method |
| 04/24/2013 | CN101667531B Vertical thermal processing apparatus and substrate supporter |
| 04/24/2013 | CN101661874B Thermal processing apparatus and thermal processing method |
| 04/24/2013 | CN101652846B Heat cycle-able connection |
| 04/24/2013 | CN101615615B Memory device and manufacturing method thereof |
| 04/24/2013 | CN101583562B A cold-walled vessel process for compounding, homogenizing and consolidating semiconductor compounds |
| 04/24/2013 | CN101583449B Silver fine powder, method for producing the same, and ink |
| 04/24/2013 | CN101572226B Method of forming fine patterns of semiconductor device |
| 04/24/2013 | CN101552210B Semiconductor device and manufacturing method thereof |
| 04/24/2013 | CN101540299B Device mounting board, semiconductor module and manufacturing method thereof , and portable equipment |
| 04/24/2013 | CN101540290B Resin encapsulation and manufacturing method thereof |
| 04/24/2013 | CN101518887B Adhesive sheet for grinding back surface of semiconductor wafer and method for grinding back surface of semiconductor wafer using the same |
| 04/24/2013 | CN101516970B Silicone resin composition and method for forming trench isolation |
| 04/24/2013 | CN101496294B Dual inductor circuit for multi-band wireless communication device |
| 04/24/2013 | CN101494200B Dual-work function semiconductor device and method for fabricating the same |
| 04/24/2013 | CN101490824B Method and system for continuous large-area scanning implantation process |
| 04/24/2013 | CN101436540B Methods of minimizing etch undercut and providing clean metal liftoff |
| 04/24/2013 | CN101432931B Electroconductive particle placement sheet and anisotropic elctroconductive film |
| 04/24/2013 | CN101429651B Multi-port pumping system for substrate processing chambers |
| 04/24/2013 | CN101429048B Chemical vapor deposited silicon carbide articles |
| 04/24/2013 | CN101422874B Polishing apparatus |
| 04/24/2013 | CN101395707B Method of stacking part |
| 04/24/2013 | CN101373790B Patterning method and field effect transistors |
| 04/24/2013 | CN101336156B Resin sealing mold assembly and method of resin sealing |
| 04/24/2013 | CN101233605B Methods for fabricating a stressed MOS device |
| 04/23/2013 | US8428286 MEMS microphone packaging and MEMS microphone module |
| 04/23/2013 | US8427844 Widebody coil isolators |
| 04/23/2013 | US8427568 Solid-state image pickup device, method for manufacturing the same, and electronic apparatus |
| 04/23/2013 | US8426982 Structure and manufacturing method of chip scale package |
| 04/23/2013 | US8426976 Non-volatile semiconductor storage device and method of manufacturing the same |
| 04/23/2013 | US8426973 Integrated circuit of decreased size |
| 04/23/2013 | US8426972 Semiconductor device and method for manufacturing the same |
| 04/23/2013 | US8426969 Semiconductor device having active region and dummy wirings |
| 04/23/2013 | US8426967 Scaled-down phase change memory cell in recessed heater |
| 04/23/2013 | US8426963 Power semiconductor package structure and manufacturing method thereof |
| 04/23/2013 | US8426961 Embedded 3D interposer structure |
| 04/23/2013 | US8426954 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
| 04/23/2013 | US8426950 Die package including multiple dies and lead orientation |