Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2013
04/24/2013CN103069542A Extended life deposition ring
04/24/2013CN103069541A Sapphire substrate and semiconductor light emitting device
04/24/2013CN103069341A Positive photosensitive siloxane composition
04/24/2013CN103069339A Resin composition for photoresist
04/24/2013CN103069329A Apparatus and method for heat treating a glass substrate
04/24/2013CN103069056A Oxide substrate, and manufacturing method for same
04/24/2013CN103069049A Texture etching solution compositon and texture etching method of crystalline silicon wafers
04/24/2013CN103069042A Al alloy film, wiring structure having Al alloy film, and sputtering target used in producing Al alloy film
04/24/2013CN103068939A 液态金属乳液 Emulsion liquid metal
04/24/2013CN103068914A Moisture-proof insulating material
04/24/2013CN103068556A Resin mold for nanoimprinting and manufacturing method thereof
04/24/2013CN103066169A Thick window layer LED manufacture
04/24/2013CN103066129A Thin film transistor growth technology
04/24/2013CN103066128A Semiconductor device and method for manufacturing same
04/24/2013CN103066124A Semiconductor device with multiple stress structures and method of forming the same
04/24/2013CN103066123A FinFET device and method of manufacturing same
04/24/2013CN103066122A Metal-oxide-semiconductor field effect transistor (MOSFET) and manufacturing method thereof
04/24/2013CN103066121A Transistor and method of manufacturing same
04/24/2013CN103066119A Germanium silicon heterojunction bipolar transistor and manufacturing method thereof
04/24/2013CN103066118A Vertical parasitic PNP transistor and manufacturing method thereof in germanium silicon heterojunction bipolar transistor (HBT) technology
04/24/2013CN103066117A Half self alignment bipolar transistor and manufacturing method thereof
04/24/2013CN103066116A Bipolar transistor device and manufacturing method thereof
04/24/2013CN103066115A Vertical parasitic type PNP triode and manufacture method
04/24/2013CN103066111A Transistor with self-aligned channel width
04/24/2013CN103066110A Super junction transistor and fabrication method thereof
04/24/2013CN103066109A Semiconductor structure and formation method thereof
04/24/2013CN103066108A Preparation method and application of ferrous acid terbium positive-negative (p-n) heterostructure
04/24/2013CN103066106A Transistor isolation structure and manufacture method thereof
04/24/2013CN103066103A Substrate breakdown voltage improvement method for group III-nitride on silicon substrate
04/24/2013CN103066102A Groove-type power semiconductor device for boosting breakdown voltage and manufacturing method thereof
04/24/2013CN103066101A Germanium silicon heterojunction bipolar transistor (HBT) component and manufacturing method thereof
04/24/2013CN103066099A Organic light emitting display and method for manufacturing same
04/24/2013CN103066080A Manufacture method of optical sensing module
04/24/2013CN103066079A Semiconductor element spacing structure and forming method thereof
04/24/2013CN103066078A 显示面板及其制造方法 Display panel and manufacturing method thereof
04/24/2013CN103066077A HIMOS FLASH memory cell structure and manufacturing method thereof
04/24/2013CN103066076A 3-D nonvolatile memory device and method of manufacturing same, and memory system
04/24/2013CN103066075A Semiconductor device and method of fabricating same
04/24/2013CN103066074A Double capture-silicon oxide nitride oxide semiconductor (SONOS) memorizer with double layer dielectric charge trapping layer and preparation method thereof
04/24/2013CN103066073A Metal gate structure of semiconductor device
04/24/2013CN103066072A Positive-intrinsic-negative (PIN) diode array structure and manufacturing method thereof
04/24/2013CN103066070A Integrated circuit method with triple patterning
04/24/2013CN103066069A Thin film transistor (TFT) array substrate and electronic paper display panel and formation method thereof
04/24/2013CN103066064A Semiconductor encapsulation piece and manufacturing method thereof
04/24/2013CN103066059A Semiconductor structure having through substrate via (TSV) and method for forming
04/24/2013CN103066058A Semiconductor device and method
04/24/2013CN103066057A Vertical parasitic type precision navigation processor (PNP) device and manufacturing method thereof in bipolar complementary metal-oxide-semiconductor transistor (BiCMOS) technology
04/24/2013CN103066056A Vertical parasitic type precision navigation processor (PNP) device and manufacturing method thereof in bipolar complementary metal-oxide-semiconductor transistor (BiCMOS) technology
04/24/2013CN103066055A Semiconductor device and method for forming the same
04/24/2013CN103066054A Metal layout and method of integrated power transistor
04/24/2013CN103066051A Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof
04/24/2013CN103066049A Package substrate and manufacture method thereof
04/24/2013CN103066048A Packaging substrate and packaging structure provided with supporting body and manufacture method thereof
04/24/2013CN103066047A Lead frame strip and packaging method for semiconductor packing
04/24/2013CN103066046A System and method for lead frame locking design features
04/24/2013CN103066044A Rewiring high-density quad flat no-lead (QFN) packaging component and manufacturing method thereof
04/24/2013CN103066043A 半导体封装件 Semiconductor package
04/24/2013CN103066041A Chip stacking structure and manufacturing method of the same
04/24/2013CN103066040A Wafer level penetrating silicon transmission structure and manufacturing method for microwave frequency band
04/24/2013CN103066035A Radiating block of liquid cooling type central processing unit (CPU) radiator and manufacturing method of the radiating block
04/24/2013CN103066032A Packages and methods for forming same
04/24/2013CN103066031A Coupling nodular technique applied before lead frame type product package
04/24/2013CN103066029A Packaging substrate strip structure and manufacturing method thereof
04/24/2013CN103066026A High-breaking-strength semiconductor wafer improved structure and manufacture method thereof
04/24/2013CN103066025A Method for coupling of top source line of separating grid flash memory
04/24/2013CN103066024A Method for fabricating nonvolatile memory device
04/24/2013CN103066023A Method for improving reliability performance of silicon oxide nitride oxide silicon (SONOS) memorizer
04/24/2013CN103066022A Method for fabricating single-sided buried strap
04/24/2013CN103066021A Semiconductor device having metal gate electrode and method of fabrication thereof
04/24/2013CN103066020A Complementary metal-oxide-semiconductor transistor (CMOS) and manufacturing method thereof, and P-channel metal oxide semiconductor transistor (PMOS) and manufacturing method thereof
04/24/2013CN103066019A Complementary metal-oxide-semiconductor transistor (CMOS) and manufacturing method thereof, and N-channel metal oxide semiconductor field effect transistor (NMOS) and manufacturing method thereof
04/24/2013CN103066018A Semiconductor unit separation method
04/24/2013CN103066017A Preparing method of array substrate
04/24/2013CN103066016A Wafer autocollimation silicon through hole connecting method
04/24/2013CN103066015A Manufacture method of metal interlamination capacitor
04/24/2013CN103066014A Copper/ air gap preparation method
04/24/2013CN103066013A Method of improving etching morphology of dual damascene structure dielectric film
04/24/2013CN103066012A Localized, in-vacuum modification of small structures
04/24/2013CN103066011A Semiconductor device manufacturing method
04/24/2013CN103066010A Metal oxide semiconductor (MOS) transistor and manufacturing method thereof
04/24/2013CN103066009A Technique of filling tungsten plug in through silicon vias (TSV)
04/24/2013CN103066008A Method for improving groove dielectric medium pore-filling capacity in flash memory shallow groove isolation technology
04/24/2013CN103066007A Manufacture method of complete isolation structure
04/24/2013CN103066006A Shallow trench isolation structure, manufacturing method thereof and non-volatile random access memory (RAM) manufacturing method
04/24/2013CN103066005A Method of forming integrated circuit
04/24/2013CN103066004A Surface treatment method
04/24/2013CN103066003A Mechanical-type chip clamping-pressing device for vacuum plasma technology
04/24/2013CN103066002A Chip substrate bearing device used for vacuum plasma technology
04/24/2013CN103066001A Universal leveling suction nozzle for collecting co-crystallizing welding machine chips
04/24/2013CN103066000A Wafer bearing device and method of wafer bearing
04/24/2013CN103065999A Thimble, chip and suction nozzle of semiconductor mounting equipment three-point on-line detecting method
04/24/2013CN103065998A Processing bench device and coating processing device using same
04/24/2013CN103065997A Wafer bearing device and method of wafer bearing
04/24/2013CN103065996A Wafer surface treatment device
04/24/2013CN103065995A Substrate unloading device and plasma enhanced chemical vapor deposition (PECVD) machine including that
04/24/2013CN103065994A Device for cleaning silicon chip and method for cleaning silicon chip utilizing the same
04/24/2013CN103065993A Detection system and method for wafer defects
04/24/2013CN103065992A Semiconductor surface structure side wall characterization method
04/24/2013CN103065991A Semiconductor device repeated defect detection method
04/24/2013CN103065990A Wafer level inversion interconnection method