| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/24/2013 | CN103065989A Processing method of multi-path electrostatic discharge protection device |
| 04/24/2013 | CN103065988A Discrete type pressing jaw mechanism |
| 04/24/2013 | CN103065987A Chip engagement device and chip engagement method |
| 04/24/2013 | CN103065986A Semiconductor packaging technology capable of reducing humidity level |
| 04/24/2013 | CN103065985A Double-face wiring packaging wafer level large thickness photosensitive benzocyclobutene (BCB) back manufacturing method |
| 04/24/2013 | CN103065984A Packaging methods for semiconductor devices |
| 04/24/2013 | CN103065983A Simultaneous silicone dispension on coupler |
| 04/24/2013 | CN103065982A Process capable of improving package reliability of printed circuit board (PCB) substrate semiconductor |
| 04/24/2013 | CN103065981A Coupling process applied to printed circuit board (PCB) semiconductor package |
| 04/24/2013 | CN103065980A Lead frame type semiconductor package process |
| 04/24/2013 | CN103065979A Non-contact type integrated circuit (IC) card manufacturing method based on chip on board (COB) encapsulation |
| 04/24/2013 | CN103065978A Composite loading ligature method of insulated gate bipolar translator (IGBT) device |
| 04/24/2013 | CN103065977A Flat packing piece manufacturing craft capable of achieving surface mount technology (SMT) based on framework |
| 04/24/2013 | CN103065976A Surface processing method based on polychlorinated biphenyl (PCB) base plate |
| 04/24/2013 | CN103065975A Manufacturing method for rewiring quad flat no-lead (QFN) packaging component |
| 04/24/2013 | CN103065974A Method for manufacturing bonding block of chip and chip |
| 04/24/2013 | CN103065973A Method preparing indium phosphide (InP) base n-metal oxide semiconductor (n-MOS) device based on silicon (Si) base |
| 04/24/2013 | CN103065972A Metallic oxide semiconductor film and preparation method and application thereof |
| 04/24/2013 | CN103065971A Formation method of semiconductor device and method of keeping shape of boron phosphorosilicate glass |
| 04/24/2013 | CN103065970A Manufacturing method of strain silicon components |
| 04/24/2013 | CN103065969A Semiconductor device and method for manufacturing same |
| 04/24/2013 | CN103065968A Semiconductor device having through contact and manufacturing method therefor |
| 04/24/2013 | CN103065967A 高电压装置 High voltage equipment |
| 04/24/2013 | CN103065966A Super junction preparing technique |
| 04/24/2013 | CN103065965A Semiconductor device manufacturing method |
| 04/24/2013 | CN103065964A Manufacture method of transistor |
| 04/24/2013 | CN103065963A Fin type transistor and formation method thereof |
| 04/24/2013 | CN103065962A Manufacturing method of insulated gate bipolar transistor (IGBT) |
| 04/24/2013 | CN103065961A Polyimide passivation layer manufacture processing method applied to high voltage devices |
| 04/24/2013 | CN103065960A Dry etching method for metal film |
| 04/24/2013 | CN103065959A Method for reducing silicon etching loading effect |
| 04/24/2013 | CN103065958A Chelating material regeneration method and substrate processing device |
| 04/24/2013 | CN103065957A Semiconductor substrate cutting device and manufacturing method of semiconductor wafer cutter |
| 04/24/2013 | CN103065956A Method and device for achieving smoothness of silicon surface structure |
| 04/24/2013 | CN103065955A Method of utilizing Automatic Logic Design (ALD) to prepare gate medium structure |
| 04/24/2013 | CN103065954A Preparation method of HfO2 film / HfSiNO interface layer / Si substrate gate medium |
| 04/24/2013 | CN103065953A Method of preparing fine grid on gallium nitride (GaN) materials by using electroplating technology |
| 04/24/2013 | CN103065952A Nonvolatile memory device and method of manufacturing thereof |
| 04/24/2013 | CN103065951A Trench gate formation method |
| 04/24/2013 | CN103065950A Crosswise heterogeneous electron irradiation method of improving global completion table (GCT) chip safe working area |
| 04/24/2013 | CN103065949A Element doping method used for thin-film solar battery and thin-film solar battery |
| 04/24/2013 | CN103065948A Preparing method of small line width groove shapes |
| 04/24/2013 | CN103065947A Multiple patterning technology method and system for achieving minimal pattern mismatch |
| 04/24/2013 | CN103065946A Lithography method |
| 04/24/2013 | CN103065945A Image sensor wafer bonding method |
| 04/24/2013 | CN103065944A Manufacturing method of portable device wafer |
| 04/24/2013 | CN103065943A Critical size compensating method of deep groove etching process |
| 04/24/2013 | CN103065942A Method for controlling quirk corrosion formative semi-conducting film thickness and semiconductor structure |
| 04/24/2013 | CN103065941A Semiconductor element manufacture table-board gentle slope method |
| 04/24/2013 | CN103065940A Ultrasonic-assisted grapheme photoresist removing method |
| 04/24/2013 | CN103065939A Method for stripping graphene with ultrasonic assist |
| 04/24/2013 | CN103065938A Method for preparing direct band-gap germanium thin film |
| 04/24/2013 | CN103065937A Pattern-recognition-based method for integrating multiple materials on substrate |
| 04/24/2013 | CN103065936A Plastic package integrated circuit (IC) seal-opening method |
| 04/24/2013 | CN103065935A Method of disposing of insulated gate bipolar translator (IGBT) silicon wafer polishing piece edge oxidation film in extrusion mode |
| 04/24/2013 | CN103065934A Removal of particles on back side of wafer |
| 04/24/2013 | CN103065933A Preparation method and laminated structure of direct band gap Ge film |
| 04/24/2013 | CN103065932A Preparation method and laminated structure of tensile strain Ge film |
| 04/24/2013 | CN103065931A Method for preparing semiconductor relaxation, tensile strain materials and for transferring layers thereof |
| 04/24/2013 | CN103065930A Composite plasma gas cleaning activation method |
| 04/24/2013 | CN103065929A Manufacture method of alignment mark protective layer |
| 04/24/2013 | CN103065180A Manufacturing technology of chipless radio frequency identification (RFID) radio frequency tag |
| 04/24/2013 | CN103064255A Approximate exposure device, method for positioning substrate of approximate exposure device, and method for manufacturing substrate of display panel |
| 04/24/2013 | CN103064225A Array substrate and manufacturing method thereof as well as display device |
| 04/24/2013 | CN103060831A Cleaning liquid and application thereof |
| 04/24/2013 | CN103060768A Low-temperature rapid crystallization method for amorphous silicon film |
| 04/24/2013 | CN103059610A Mask agent and preparation method of substrate with nanometer patterns |
| 04/24/2013 | CN103058127A Surface treatment method of micro-strip |
| 04/24/2013 | CN103056500A Welding method for semiconductor ceramic shell sealing cap |
| 04/24/2013 | CN103056067A Coating processing device |
| 04/24/2013 | CN102437025B Method for eliminating negative bias temperature instability (NBTI) influence on PMOS (p-channel metal-oxide-semiconductor field-effect transistor) |
| 04/24/2013 | CN102420158B Device for sintering various chips with different thicknesses at one time |
| 04/24/2013 | CN102347354B Germanium-silicon heterojunction bipolar transistor and manufacturing method thereof |
| 04/24/2013 | CN102347223B Method for doping silicon wafer with colloidal silicon nano particles |
| 04/24/2013 | CN102339828B Low-power-consumption semiconductor memory and driving method thereof |
| 04/24/2013 | CN102324391B Non-lead semiconductor lead frame aluminum foil welding method |
| 04/24/2013 | CN102315271B Semiconductor device and making method thereof |
| 04/24/2013 | CN102315270B Power semiconductor structure with field effect rectifier element and making method for power semiconductor structure |
| 04/24/2013 | CN102315133B Conveying system for integrated circuit chip loader framework |
| 04/24/2013 | CN102315093B Process method for flattening filled trench |
| 04/24/2013 | CN102313599B Device and method for measuring temperature of coupling window, and plasma equipment |
| 04/24/2013 | CN102306666B Copper indium gallium selenium (CIGS) solar battery with gradient energy band and preparation method thereof |
| 04/24/2013 | CN102299057B Method for manufacturing fine patterns on semiconductor device |
| 04/24/2013 | CN102290398B Storage capacitor framework and making method thereof, and pixel structure |
| 04/24/2013 | CN102270591B One-step die-bonding process of two semiconductor chips |
| 04/24/2013 | CN102254787B Semiconductor chip separation device and method |
| 04/24/2013 | CN102244044B Diode die-pressing discharging base and novel die-pressing discharging process thereof |
| 04/24/2013 | CN102243985B Waste heat utilization device for semiconductor production line and operating method thereof |
| 04/24/2013 | CN102237243B Ion implantation system and method |
| 04/24/2013 | CN102231367B Scanning film figure laser transfer method |
| 04/24/2013 | CN102222632B Wafer testing method and device |
| 04/24/2013 | CN102222628B Jig for semiconductor process |
| 04/24/2013 | CN102214589B Electronic packing method of vertical chips |
| 04/24/2013 | CN102214579B Method of fabricating semiconductor device and semiconductor element |
| 04/24/2013 | CN102208447B Semiconductor device with super-junction structure and manufacturing method thereof |
| 04/24/2013 | CN102203927B Method for device plastic packaging and packaging structure |
| 04/24/2013 | CN102179349B Coating device, and method for replacing liquid material |
| 04/24/2013 | CN102169894B 化合物半导体装置 The compound semiconductor device |
| 04/24/2013 | CN102148236B Semiconductor device and method of manufacturing the same |
| 04/24/2013 | CN102148221B Electronic component package and manufacturing method therefor |