Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/1993
07/08/1993DE4244615A1 Integrated circuit chip package with multi-voltage wiring pattern - has concentric rings of body surface metallisation provided for power supply to single or multivoltage chip
07/08/1993DE4244083A1 Semiconductor memory device with internal state determining circuit - has region of chip surface for alternative connections of internal circuit to ends of supply lines
07/08/1993DE4238441A1 Phase shift mask for submicron integrated circuit technology - has light-screening regions on opposite sides of each phase-shifting oxygen-ion implant region
07/08/1993CA2127260A1 Integrated circuit
07/08/1993CA2126969A1 Method and composition for cleaning articles
07/08/1993CA2117341A1 Electronic component and process for making it
07/07/1993EP0550404A1 A method of making a capacitive coupling device, especially in an EEPROM
07/07/1993EP0550317A1 Manufacturing method of hyperfrequency field effect transistors
07/07/1993EP0550255A2 Transistor spacer structure
07/07/1993EP0550216A1 CMOS digital-controlled delay gate
07/07/1993EP0550215A2 A CMOS gate having a programmable driving power characteristic
07/07/1993EP0550202A1 Method of producing prestressed diamond composite films
07/07/1993EP0550198A1 A semiconductor integrated circuit comprising a protective device
07/07/1993EP0550186A1 Method to determine tool paths for thinning and correcting errors in thickness profiles of films
07/07/1993EP0550177A1 Static RAM memory integrated circuit with balanced resistance
07/07/1993EP0550175A1 Static RAM memory integrated circuit
07/07/1993EP0550174A2 Process of making a self-aligned contact window in integrated circuits
07/07/1993EP0550173A1 Integrated circuits
07/07/1993EP0550171A2 Integrated circuit with silicon contact to silicide
07/07/1993EP0550081A2 Locating a field of view in which selected IC conductors are unobscured
07/07/1993EP0550058A2 A programmable multizone gas injector for single-wafer semiconductor processing equipment
07/07/1993EP0550021A2 Self-aligned single-mask CMOS/BiCMOS twin-well formation with flat surface topography
07/07/1993EP0550014A2 Dicing-die bonding film
07/07/1993EP0550013A2 Semiconductor device and method of producing the same
07/07/1993EP0550009A1 Positive resist composition
07/07/1993EP0549995A2 Conditioning of semiconductor wafers for uniform and repeatable rapid thermal processing
07/07/1993EP0549994A2 Global planarization process
07/07/1993EP0549893A1 Wire saw and slicing method using the same
07/07/1993EP0290578B1 Tungsten paste for co-sintering with pure alumina and method for producing same
07/07/1993CN1021528C Pressure-reducing process and system for gas epitaxy of semiconductors
07/06/1993US5226056 Plasma ashing method and apparatus therefor
07/06/1993US5226055 Devices having repetitive layers
07/06/1993US5226015 Semiconductor memory system
07/06/1993US5226008 Dynamic random access memory allowing determination of a read/write control type at the final step of manufacturing process
07/06/1993US5225993 Design rule test apparatus for testing if mask pattern satisfies design rule and operation method therefor
07/06/1993US5225991 Optimized automated macro embedding for standard cell blocks
07/06/1993US5225966 Conductive adhesive film techniques
07/06/1993US5225891 Wire bonding external appearance inspecting apparatus
07/06/1993US5225777 High density probe
07/06/1993US5225775 Ic testing device for permitting adjustment of timing of a test signal
07/06/1993US5225774 Semiconductor integrated circuit
07/06/1993US5225771 Making and testing an integrated circuit using high density probe points
07/06/1993US5225724 Operational analysis device of the scan path type having a single scanning clock and a single output phase for an integrated circuit
07/06/1993US5225720 Semiconductor integrated circuit device
07/06/1993US5225711 In a reducing atmosphere; inhibits copper oxide formation before fusion and reduces oxides to promote wetting
07/06/1993US5225709 Package having a structure for stabilizing and/or impedance-matching a semiconductor IC device accommodated therein
07/06/1993US5225708 Semiconductor junction capacitance element with breakdown voltage protection
07/06/1993US5225707 Insulated via hole structure for semiconductor devices
07/06/1993US5225703 Dual field effect transistor structure employing a single source region
07/06/1993US5225700 Circuit and method for forming a non-volatile memory cell
07/06/1993US5225699 Dram having a large dielectric breakdown voltage between an adjacent conductive layer and a capacitor electrode and method of manufacture thereof
07/06/1993US5225697 dRAM cell and method
07/06/1993US5225693 Cmos gate array configured as a sram with load resistors over gate electrodes
07/06/1993US5225691 Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation
07/06/1993US5225686 Positioning method and positioning mechanism for use in exposure apparatus
07/06/1993US5225663 Heat process device
07/06/1993US5225659 Method and apparatus for surface treating an axially symmetric substrate at atmosphere pressure
07/06/1993US5225378 Preheating second process gas before reacting with the first process gas
07/06/1993US5225376 Polysilicon taper process using spin-on glass
07/06/1993US5225375 Plasma enhanced chemical vapor processing of semiconductor substrates
07/06/1993US5225372 Method of making a semiconductor device having an improved metallization structure
07/06/1993US5225371 Laser formation of graded junction devices
07/06/1993US5225370 Method of diffusing P type impurity
07/06/1993US5225368 Method of producing strained-layer semiconductor devices via subsurface-patterning
07/06/1993US5225367 Doping boron nitride and exposure to laser beam in vacuum
07/06/1993US5225365 Forming a p-type well in lightly doped epitaxilal layer before forming an n-type well
07/06/1993US5225362 Method of manufacturing a full feature high density EEPROM cell with poly tunnel spacer
07/06/1993US5225361 Forming a second gate insulating film resistant to electrical breakdown
07/06/1993US5225360 Refractory binder such as silicon formed on substrate and metal with low resistance deposited
07/06/1993US5225358 In single step after transistor fabrication by chemical vapor deposition of oxide or borophosphosilicate glass over wafer
07/06/1993US5225357 Low P+ contact resistance formation by double implant
07/06/1993US5225356 Formed on an insulating layer
07/06/1993US5225355 Irradiating uv rad on an insulating layer in a chlorine containing gas atmosphere
07/06/1993US5225311 Positive photoresist composition
07/06/1993US5225286 Tantalum oxide with yttrium oxide, tungsten oxide and niobium oxide
07/06/1993US5225235 Semiconductor wafer and manufacturing method therefor
07/06/1993US5225040 Process for patterning metal connections in small-geometry semiconductor structures
07/06/1993US5225036 Method of manufacturing semiconductor device
07/06/1993US5225034 Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing
07/06/1993US5225026 Bonding method and apparatus therefor
07/06/1993US5225023 Coating with a thermoplastic resin, immersion and drying
07/06/1993US5224999 Heat treatment apparatus
07/06/1993US5224809 Semiconductor processing system with robotic autoloader and load lock
07/06/1993US5224581 Magnetic semiconductor wafers with handling apparatus and method
07/06/1993US5224504 Single wafer processor
07/06/1993US5224503 Centrifugal wafer carrier cleaning apparatus
07/06/1993US5224265 Fabrication of discrete thin film wiring structures
07/06/1993US5224264 Process for producing a film carrier having a superior lead strength
07/03/1993CA2085660A1 Method of producing prestressed diamond composite films by chemical vapor deposition and articles produced therefrom
07/01/1993DE4244544A1 Lead frame blanking appts. for integrated circuit mfr. - has press tool with individual punches set into die block for formation of connection leads for IC elements
07/01/1993DE4244115A1 Semiconductor device - comprises silicon@ layer, and foreign atom layer contg. boron ions
07/01/1993DE4241684A1 Encapsulated housing for semiconductor - has connecting leads bonded to housing with connecting wires embedded within protective material
07/01/1993DE4211051C1 FET mfr. using dielectric etching for gate formation - applying two dielectric layers of specified material for successive spacer formation to define very narrow gate width
07/01/1993DE4143209A1 Integrierte schaltung Integrated circuit
06/1993
06/30/1993EP0549405A1 Method of wiring a laser array
06/30/1993EP0549377A2 A scrubber apparatus for cleaning a thin disk work
06/30/1993EP0549354A2 Time constant detecting circuit and time constant adjusting circuit
06/30/1993EP0549320A1 Method and apparatus for ESD protection
06/30/1993EP0549278A1 A method for fabricating an AlGaInP semiconductor light emitting device
06/30/1993EP0549261A1 Method for forming interconnect for integrated circuits