Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1993
06/30/1993EP0549240A2 Socket
06/30/1993EP0549199A2 Method of forming silicide in integrated circuit manufacture
06/30/1993EP0549168A2 Transistor fabrication method
06/30/1993EP0549165A2 Power conserving integrated circuit
06/30/1993EP0549143A1 An apparatus for polishing chamfers of a wafer
06/30/1993EP0549055A2 Method of manufacturing a semiconductor device provided with a field effect transistor, and such a semiconductor device
06/30/1993EP0549042A2 Improved high voltage thin film transistor having a drift region with a linear doping profile and a field plate
06/30/1993EP0548997A1 Semiconductor device comprising a chemically bonded film on its surface
06/30/1993EP0548954A2 Bonding apparatus
06/30/1993EP0548926A1 Apparatus for vaporizing liquid raw material and apparatus for forming thin film
06/30/1993EP0548913A1 Packaging device and its manufacturing method
06/30/1993EP0548846A1 Wafer polisher head having floating retainer ring
06/30/1993EP0548675A2 Static memory cell design
06/30/1993EP0548652A1 Method of fabricating resistive conductive patterns on aluminum nitride substrates
06/30/1993EP0548603A1 Method for replacing semiconductor chips
06/30/1993EP0548596A2 Method and apparatus for cleaning substrate
06/30/1993EP0548583A1 Header cover
06/30/1993EP0548504A2 Process for cleaning silicon mass
06/30/1993EP0548496A1 A mold and a method for manufacturing semiconductor devices of plastics incorporating an exposed heat sink of metal for inspecting the soldered joint
06/30/1993EP0548407A1 Tungsten chemical vapor deposition method
06/30/1993EP0548368A1 Compound semiconductor and manufacturing method therefor
06/30/1993EP0548351A1 Method for producing integrated circuits having adjacent electrodes, and corresponding integrated circuits
06/30/1993EP0548311A1 Plasma etching indium tin oxide using a deposited silicon nitride mask
06/30/1993EP0548279A1 Functional at speed test system for integrated circuits on undiced wafers
06/30/1993CN1073806A Thin-film-transistor for semiconductor memory device and fabricating method thereof
06/30/1993CN1073805A Manufacturing method of electrostatic induction thyratron transistor and its device
06/30/1993CN1073648A Substrate conveyer
06/29/1993US5224202 Apparatus for the evaporation of liquids
06/29/1993US5224139 X-ray mask and semiconductor device manufacturing method using the same
06/29/1993US5224134 Charge transfer device having circuit for adjusting the high level of the reset pulse
06/29/1993US5224107 Method in a parallel test apparatus for semiconductor memories
06/29/1993US5224070 Apparatus for determining the conditions of programming circuitry used with flash EEPROM memory
06/29/1993US5223914 Follow-up system for etch process monitoring
06/29/1993US5223881 Apparatus for controlling developing solution
06/29/1993US5223851 Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device
06/29/1993US5223744 Semiconductor integrated circuit with circuits for generating stable reference potential
06/29/1993US5223740 Plastic mold type semiconductor device
06/29/1993US5223739 Plastic molded semiconductor device having waterproof cap
06/29/1993US5223737 Electrostatic discharge protection device for an integrated circuit pad and related integrated structure
06/29/1993US5223736 Trench isolation process with reduced topography
06/29/1993US5223735 Semiconductor integrated circuit device in which circuit functions can be remedied or changed and the method for producing the same
06/29/1993US5223734 Semiconductor gettering process using backside chemical mechanical planarization (CMP) and dopant diffusion
06/29/1993US5223731 EPROM cell using trench isolation to provide leak current immunity
06/29/1993US5223730 Stacked-trench dram cell that eliminates the problem of phosphorus diffusion into access transistor channel regions
06/29/1993US5223729 Semiconductor device and a method of producing the same
06/29/1993US5223727 Charge-coupled device having an improved electrode structure
06/29/1993US5223725 Charge transfer device equipped with junction type output transistor improved in sensitivity to charge packet
06/29/1993US5223721 Phosphorous element doped
06/29/1993US5223676 Composite circuit board having means to suppress heat diffusion and manufacturing method of the same
06/29/1993US5223672 Hermetically sealed aluminum package for hybrid microcircuits
06/29/1993US5223458 Method of manufacturing a III-V semiconductor device using a self-biased substrate and a plasma containing an electronegative species
06/29/1993US5223456 High density local interconnect in an integrated circit using metal silicide
06/29/1993US5223455 High speed vapor deposition on semiconductor
06/29/1993US5223453 Illuminating substrate from top surface with electromagnetic radiation having wavelength transmitted by substrate and absorbed at interface to alloy bottom metal layer while sintering top strips
06/29/1993US5223452 Vaporizing dopant from solid dopant source which contacts and supports spheres in chamber
06/29/1993US5223451 Semiconductor device wherein n-channel MOSFET, p-channel MOSFET and nonvolatile memory cell are formed in one chip and method of making it
06/29/1993US5223450 Method of producing semiconductor substrate having dielectric separation region
06/29/1993US5223448 Method for producing a layered capacitor structure for a dynamic random access memory device
06/29/1993US5223447 DRAM-cell having an isolation merged trench and its method of manufacture
06/29/1993US5223445 Suppressing defects by changing shape of amorphous layer formed
06/29/1993US5223443 Method for determining wafer cleanliness
06/29/1993US5223442 Method of making a semiconductor device of a high withstand voltage
06/29/1993US5223331 Substrate having a polymerized monomolecular film
06/29/1993US5223321 Tape with interconnection terminals of gold having Vickers hardness of 55 or less for even bonding to pad
06/29/1993US5223305 Forming dielectric film on semiconductor substrate; applicable to electroluminesce device
06/29/1993US5223113 Apparatus for forming reduced pressure and for processing object
06/29/1993US5223112 Removable shutter apparatus for a semiconductor process chamber
06/29/1993US5223085 Etching with plasma formed by electron cyclotron resonance from mixture of halogen and hydrogen or hydrogen halide gas
06/29/1993US5223084 Simultaneous dielectric planarization and contact hole etching
06/29/1993US5223083 Process for etching a semiconductor device using an improved protective etching mask
06/29/1993US5223081 Method for roughening a silicon or polysilicon surface for a semiconductor substrate
06/29/1993US5223080 Method for controlling thickness of single crystal thin-film layer in soi substrate
06/29/1993US5223079 Forming thin liquid phase epitaxial layers
06/29/1993US5223063 Method for bonding semiconductor elements to a tab tape
06/29/1993US5223039 Illuminating apparatus and photo-excited process apparatus using same
06/29/1993US5223001 Vacuum processing apparatus
06/29/1993US5222655 Soldering method employing provision of heated gas to a soldering alloy at a soldering connection
06/29/1993US5222648 Bonder
06/29/1993US5222310 Single wafer processor with a frame
06/29/1993US5222293 System for placing an object on a carrier and method
06/29/1993CA2011235C Method of forming contacts to a semiconductor device
06/29/1993CA1319763C Cure-box resin molded semiconductor device
06/29/1993CA1319588C Method of making single-crystal mercury cadmium telluride layers
06/29/1993CA1319587C Metalorganic chemical vapor depositing growth of group ii-vi semiconductor materials having improved compositional uniformity
06/29/1993CA1319586C Recovery of lower-boiling silanes in a cvd process
06/28/1993CA2085962A1 Positive resist composition
06/28/1993CA2085405A1 Resist composition and process for producing the same
06/24/1993WO1993012545A1 Vertical insulated gate semiconductor device and method for its manufacture
06/24/1993WO1993012544A1 Scr protection structure and circuit with reduced trigger voltage
06/24/1993WO1993012542A1 Layered superlattice material applications
06/24/1993WO1993012541A1 External temperature-independent heterojunction bipolar transistor and associated integrated circuit
06/24/1993WO1993012539A1 Thermal transfer posts for high density multichip substrates and formation method
06/24/1993WO1993012538A1 Process for fabricating layered superlattice materials
06/24/1993WO1993012537A1 High quality photovoltaic semiconductor material and laser ablation method of fabricating same
06/24/1993WO1993012190A1 Conductive adhesive compositions based on thermally depolymerisable polymers
06/24/1993WO1993012152A1 Metal ion reduction in novolak resins
06/24/1993WO1993011925A1 Scraping plunger
06/24/1993DE4243611A1 Test mode circuit for data memory - has data entered and read out from data memory cells inverted during test mode to detect cross interference
06/24/1993DE4243345A1 Circuit board integrated circuit module mounting construction - uses thin film surface coating element to bond IC terminals to corresponding circuit board conductor paths
06/24/1993DE4243066A1 Signal charge transfer device for CCD or contact image sensor - with multistep impurity zone under each 2nd electrode for high charge transfer efficiency without shortening electrode
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