Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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05/03/1994 | US5308682 Alignment check pattern for multi-level interconnection |
05/03/1994 | US5308655 Processing for forming low resistivity titanium nitride films |
05/03/1994 | US5308651 Pulsation lasers for decomposition, radiation |
05/03/1994 | US5308650 Vapor deposition and cladding with microwave pulsation |
05/03/1994 | US5308447 Endpoint and uniformity determinations in material layer processing through monitoring multiple surface regions across the layer |
05/03/1994 | US5308445 Method of manufacturing a semiconductor device having a semiconductor growth layer completely insulated from a substrate |
05/03/1994 | US5308444 Cover germanium surface with gallium; flowing arsenic compound to form intermetallic |
05/03/1994 | US5308443 Microprobe provided circuit substrate and method for producing the same |
05/03/1994 | US5308440 Multilayer semiconductor with metal layer and air bridges |
05/03/1994 | US5308438 Providing a polishing pad coated with a slurry, rotating workpiece on pad, controlling rotational speed of workpiece and applying pressure, and monitoring current drawn by motor |
05/03/1994 | US5308431 System providing multiple processing of substrates |
05/03/1994 | US5308429 Thermoconductive adhesive is melted and cured by heated copper slug |
05/03/1994 | US5308417 Magnetic material embedded in pedestal where wafer is supported for etching |
05/03/1994 | US5308415 Enhancing step coverage by creating a tapered profile through three dimensional resist pull back |
05/03/1994 | US5308414 Method and apparatus for optical emission end point detection in plasma etching processes |
05/03/1994 | US5308400 Room temperature wafer cleaning process |
05/03/1994 | US5308256 Socket |
05/03/1994 | US5308241 Surface shaping and finshing apparatus and method |
05/03/1994 | US5308222 Noncentering specimen prealigner |
05/03/1994 | US5308210 Interface apparatus for transporting substrates between substrate processing apparatus |
05/03/1994 | US5307983 Method of making an article comprising solder bump bonding |
05/03/1994 | US5307978 Smart indexing head for universal lead frame work station |
05/03/1994 | US5307929 Lead arrangement for integrated circuits and method of assembly |
05/03/1994 | US5307568 Duct between piping unit and reduced-pressure vessel composed of austenitic steel contains molybdenum; eliminates microcontamination from particles of heavy metal ions |
05/03/1994 | US5307561 Method for making 3-D electrical circuitry |
05/03/1994 | CA2039875C Process for forming the ridge structure of a self-aligned semiconductor laser |
05/03/1994 | CA1329239C Electronic arrays having thin film line drivers |
05/03/1994 | CA1329167C Dry etching of silicon carbide |
05/03/1994 | CA1329037C Stripping compositions and methods of stripping resists from substrates |
05/01/1994 | CA2108711A1 Electronic assemblies |
04/28/1994 | WO1994009515A1 Electrical isolation in integrated circuits |
04/28/1994 | WO1994009514A1 Electronics module |
04/28/1994 | WO1994009513A1 Interconnection structure for integrated circuits and method for making same |
04/28/1994 | WO1994009510A1 Process and device for forming the connection leads of integrated circuits |
04/28/1994 | WO1994009378A1 System and method for accelerated degradation testing of semiconductor devices |
04/28/1994 | WO1994009182A1 Metal powder composition for metallization and metallized substrate |
04/28/1994 | WO1994009179A1 High density plasma deposition and etching apparatus |
04/28/1994 | DE4336357A1 Thin-film depositing device - with a vapour jet hitting a rotating substrate diagonally |
04/28/1994 | DE4336003A1 Semiconductor device with connection structure - has surface section of conductive region in substrate surface with surface roughness greater than that of substrate |
04/28/1994 | DE4335997A1 Semiconductor memory device with buried bit-line, for DRAM - has word line as transfer gate, bit line as data line, and two field regions on semiconductor substrate |
04/28/1994 | DE4326846A1 Semiconductor device with insulation by dielectric element - has two-region dielectric layer on electrode body, with both regions of different dielectric constants |
04/28/1994 | DE4235702A1 Substrate surface structuring - uses separate masks with partial patterns to expose separate photo sensitive layers to form a complete pattern as an etching mask |
04/28/1994 | DE4235677A1 Chamber for transport of components in a vacuum processing installation - with at least one radially movable transport unit mounted separately from rotatable component carriers. |
04/28/1994 | DE4235674A1 Chamber for transporting components under vacuum - with a second transport mechanism with elements movable axially and radially relative to the rotary first transport mechanism. |
04/28/1994 | CA2124687A1 Electrical isolation in integrated circuits |
04/27/1994 | EP0594559A2 Solid state image pick-up device |
04/27/1994 | EP0594441A2 Semiconductor device |
04/27/1994 | EP0594427A2 A printed circuit board mounted with electric elements thereon |
04/27/1994 | EP0594340A2 Method for forming a bipolar transistor |
04/27/1994 | EP0594339A1 Method of manufacturing a CMOS device |
04/27/1994 | EP0594328A1 Method for controlling plasma processes |
04/27/1994 | EP0594300A1 Method for forming a metal contact |
04/27/1994 | EP0594299A2 Multi-layered lead frame assembly and method for integrated circuits |
04/27/1994 | EP0594298A1 Integrated circuit doped dielectric, preventing contamination by mobile ions |
04/27/1994 | EP0594286A2 Electronic parts with metal wiring and manufacturing method thereof |
04/27/1994 | EP0594252A1 A device for applying a lacquer coating to a disc-shaped registration carrier |
04/27/1994 | EP0594248A2 Method of manufacturing a semiconductor device whereby a laterally bounded semiconductor zone is formed in a semiconductor body in a self-aligning manner |
04/27/1994 | EP0594212A1 An ohmic electrode, its fabricating method and a light emitting device |
04/27/1994 | EP0594206A2 Method of making a SOI film having a more uniform thickness in a SOI substrate |
04/27/1994 | EP0594182A2 Anode bonding method and acceleration sensor obtained by using the anode bonding method |
04/27/1994 | EP0594111A1 High voltage MIS transistor and semiconductor device |
04/27/1994 | EP0594049A1 Insulated gate bipolar transistor and manufacturing method thereof |
04/27/1994 | EP0594032A1 Deposition of layers at high specific electric conductivity |
04/27/1994 | EP0594030A2 Process for the fabrication of a wafer having a moncrystalline silicium carbide layer |
04/27/1994 | EP0593986A1 Process of soldering a semiconductor body to a supportelement |
04/27/1994 | EP0593924A1 Device for producing plasma using cathodic sputtering |
04/27/1994 | EP0593865A2 A semiconductor memory device and a manufacturing method of the same |
04/27/1994 | EP0593666A1 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
04/27/1994 | EP0593579A1 Rapid-switching rotating disk reactor |
04/27/1994 | EP0593529A1 Programmable interconnect structures and programmable integrated circuits |
04/27/1994 | EP0396663B1 Charge-coupled device |
04/27/1994 | CN2163445Y Round rectifying bridge base pin processing apparatus |
04/27/1994 | CN1086048A Semiconductor memory device and the manufacturing method thereof |
04/27/1994 | CN1086047A Electric device matrix device, electro-optical display device, and semiconductor memory having thin-film transistors |
04/27/1994 | CN1086046A Light source and technique for mounting light emitting diodes |
04/27/1994 | CN1086045A Method of manufacturing an integrated circuit and integrated circuit obtained by this method |
04/26/1994 | US5307433 Optical connection member of silicon and method for the manufacture thereof |
04/26/1994 | US5307360 Method of wiring a row of lasers and a row of lasers wired by this method |
04/26/1994 | US5307316 Semiconductor memory unit having redundant structure |
04/26/1994 | US5307312 Process for obtaining an N-channel single polysilicon level EPROM cell and cell obtained with said process |
04/26/1994 | US5307310 Semiconductor memory having stacked capacitors and MOS transistors |
04/26/1994 | US5307308 Semiconductor memory device comprising one or more high-resistance elements |
04/26/1994 | US5307304 Semiconductor memory device and method of operation thereof |
04/26/1994 | US5307286 Method for optimizing automatic place and route layout for full scan circuits |
04/26/1994 | US5307237 Integrated circuit packaging with improved heat transfer and reduced signal degradation |
04/26/1994 | US5307184 Exposure apparatus |
04/26/1994 | US5307154 Semiconductor chip position detector |
04/26/1994 | US5307011 Loader and unloader for test handler |
04/26/1994 | US5306960 Common bias circuit for a plurality of discrete IC's each having their own bias circuritry |
04/26/1994 | US5306952 Multilayer aluminum-containing interconnection structure of semiconductor device |
04/26/1994 | US5306950 Substrate, contact layer of rare earth metal or silicide, diffusion barrier of iron or alloy, solder layer of tin and lead |
04/26/1994 | US5306948 Semiconductor device and semiconductor module having auxiliary high power supplying terminals |
04/26/1994 | US5306947 Semiconductor device and manufacturing method thereof |
04/26/1994 | US5306946 Semiconductor device having a passivation layer with silicon nitride layers |
04/26/1994 | US5306944 Semiconductor structure within DI islands having bottom projection for controlling device characteristics |
04/26/1994 | US5306943 Schottky barrier diode with ohmic portion |
04/26/1994 | US5306941 Semiconductor memory device and production process thereof |
04/26/1994 | US5306940 Semiconductor device including a locos type field oxide film and a U trench penetrating the locos film |
04/26/1994 | US5306938 Lateral MOSFET |
04/26/1994 | US5306936 Non-volatile semiconductor memory device having oxynitride film for preventing charge in floating gate from loss |