Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2015
01/14/2015CN102804339B 气相生长装置 Vapor phase growth apparatus
01/14/2015CN102800605B 用于监控铜势垒层预清洗工艺的系统和方法 Monitoring of copper barrier layer system and method for pre-cleaning process
01/14/2015CN102800587B 一种肖特基二极管的制备工艺 Preparation process for the Schottky diode
01/14/2015CN102769016B 一种抗辐射的cmos器件及其制备方法 Cmos devices, an anti-radiation and its preparation method
01/14/2015CN102768965B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
01/14/2015CN102751182B 半导体制造方法 Semiconductor manufacturing method
01/14/2015CN102751170B 半导体处理设备 Semiconductor processing equipment
01/14/2015CN102738066B 形成硅通孔开口的方法 The method of forming a silicon vias openings
01/14/2015CN102738051B 自动化料盘移运机台 Automated reel transshipment machine
01/14/2015CN102723257B 衬底处理设备和衬底处理方法 The substrate processing apparatus and a substrate processing method
01/14/2015CN102714235B 带布线板的太阳能电池单元及其制造方法 Solar cell and method of manufacturing a wiring board with
01/14/2015CN102709224B 旋转薄片盘状物夹持装置 Rotating thin disk-like holding device
01/14/2015CN102693916B 改进MOSFETs镍基硅化物热稳定性的方法 MOSFETs improve thermal stability of nickel silicide-based approach
01/14/2015CN102691100B 工艺腔室装置和具有该工艺腔室装置的外延设备 An epitaxial process chamber means and the processing chamber apparatus having means
01/14/2015CN102683429B 超大电流高频frd二极管芯片及制作方法 Large current high frequency frd diode chips and production methods
01/14/2015CN102683237B 半导体制造方法和化学机械抛光cmp系统 The semiconductor manufacturing method and system for chemical mechanical polishing cmp
01/14/2015CN102651359B 具有低阻值基材与低功率损耗的半导体结构 A semiconductor structure having low resistance and low power loss substrate
01/14/2015CN102646600B 半导体设备及其制造方法 Semiconductor device and manufacturing method thereof
01/14/2015CN102612641B 真空质量测量系统 Vacuum Quality Measurement System
01/14/2015CN102610585B 一种封装硅芯片的方法及其形成的电子元件 A method of encapsulating the silicon chip and the electronic component is formed
01/14/2015CN102593130B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/14/2015CN102593001B 向沟道中引入应变的方法和使用该方法制作的器件 Strain introduced into the channel in a method and a device produced using this method
01/14/2015CN102593000B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/14/2015CN102592934B 用于超浅结注入的离子源装置 Ion source means for injecting USJ
01/14/2015CN102569393B 晶体管、包括该晶体管的半导体器件及其制造方法 Transistor, a semiconductor device and a manufacturing method comprising the transistor
01/14/2015CN102569020B 一种8英寸晶圆切口氧化膜去除方法和装置 An 8-inch wafer notch oxide film removal method and apparatus
01/14/2015CN102522373B 半导体装置 Semiconductor device
01/14/2015CN102496596B 晶圆承载结构及其制备方法以及晶圆减薄方法 Wafer load-bearing structure and preparation methods, and wafer thinning method
01/14/2015CN102496577B 非晶氧化物膜的制造方法 Method for producing an amorphous oxide film
01/14/2015CN102474988B 电子元件单元和加强粘合剂 The electronic component element and the strengthening adhesive
01/14/2015CN102473668B 静电吸附构造体及其制造方法 Electrostatic adsorption structure and manufacturing method thereof
01/14/2015CN102460651B 移除基板与静电卡钳之间的电荷 Removing the substrate and the electrostatic charge between the caliper
01/14/2015CN102439608B 用于将电子元件贴附在产品上的方法 The electronic component attached to the method for the product
01/14/2015CN102437090B 无金属阻挡层的铜后道互连工艺 No metal barrier layer copper interconnect process after the Road
01/14/2015CN102376557B 掺杂的多晶硅栅极的制作方法、mos晶体管及其制作方法 Production methods doped polysilicon gate, mos transistor and its manufacturing method
01/14/2015CN102347406B 一种立式led引线框架用夹具 Led lead frame to provide a vertical jig
01/14/2015CN102292816B 有机半导体装置及其制造方法 The organic semiconductor device and manufacturing method thereof
01/14/2015CN102256429B 一种修复euv光源集光器的方法及装置 A prosthetic euv light collector method and apparatus
01/14/2015CN102194880B 带有沟槽-氧化物-纳米管超级结的器件结构及制备方法 Oxide - - nanotube super junction device structures and trenches with preparation
01/14/2015CN102130046B 用于镶嵌互连件中的电迁移电阻改进的界面层 Damascene interconnect member for electromigration resistance improved interfacial layer
01/14/2015CN102117766B 制造半导体器件的方法 The method of manufacturing a semiconductor device
01/14/2015CN102110571B 等离子体加工装置 The plasma processing apparatus
01/14/2015CN102097435B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/14/2015CN102079112B 应用于金刚线开方机的切割方法 Diamond wire cutting method applies prescribing machines
01/14/2015CN101928935B 等离子体处理装置、薄膜制造方法和薄膜晶体管制造方法 Device, a thin film manufacturing method and a thin film transistor manufacturing method plasma treatment
01/14/2015CN101826454B 半导体装置的制造方法 The method of manufacturing a semiconductor device
01/14/2015CN101777485B 刻蚀方法 Etching
01/14/2015CN101685267B 光束变换元件、光学照明装置、曝光装置以及曝光方法 Beam transforming element, illumination optical apparatus, exposure apparatus and exposure method
01/14/2015CN101558186B 对基板表面做预先处理以进行金属沉积的工艺和集成系统 Do pretreated substrate surface for metal deposition processes and integrated systems
01/13/2015US8934706 Wafer center finding with kalman filter
01/13/2015US8934705 Persistent feature detection
01/13/2015US8934607 Measuring apparatus and measuring method
01/13/2015US8934300 Memory array structure and operating method and manufacturing method for the same
01/13/2015US8934259 Substrates with transferable chiplets
01/13/2015US8934091 Monitoring incident beam position in a wafer inspection system
01/13/2015US8934066 Semiconductor device having stick drivers and a method of manufacturing the same
01/13/2015US8933806 High reliability surveillance and/or identification tag/devices and methods of making and using the same
01/13/2015US8933715 Configurable vertical integration
01/13/2015US8933624 Light emitting device
01/13/2015US8933570 Three dimensional structure memory
01/13/2015US8933569 Pressure contact arrangement and method for producing a pressure contact arrangement
01/13/2015US8933566 Multilayer line trimming
01/13/2015US8933564 Landing structure for through-silicon via
01/13/2015US8933561 Semiconductor device for semiconductor package having through silicon vias of different heights
01/13/2015US8933559 Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
01/13/2015US8933551 3D-packages and methods for forming the same
01/13/2015US8933543 Nitride semiconductor element having m-plane angled semiconductor region and electrode including Mg and Ag
01/13/2015US8933538 Oxygen-doped gallium nitride single crystal substrate
01/13/2015US8933535 Wafer with spacer including horizontal member
01/13/2015US8933534 Isolation structure of high-voltage driving circuit
01/13/2015US8933525 Semiconductor apparatus and method of fabrication for a semiconductor apparatus
01/13/2015US8933519 Magnetic dynamic random access nonvolatile semiconductor memory (MRAM)
01/13/2015US8933517 Semiconductor device comprising a dummy well
01/13/2015US8933515 Device structure, layout and fabrication method for uniaxially strained transistors
01/13/2015US8933514 Transistor with MIM (Metal-Insulator-Metal) capacitor
01/13/2015US8933512 MOSFET and method for manufacturing the same
01/13/2015US8933511 Semiconductor device
01/13/2015US8933510 DEMOS formed with a through gate implant
01/13/2015US8933509 Semiconductor device and method for fabricating the same
01/13/2015US8933504 Semiconductor structure and method for forming the semiconductor structure
01/13/2015US8933503 Advanced forming method and structure of local mechanical strained transistor
01/13/2015US8933501 Three dimensional NAND device and method of charge trap layer separation and floating gate formation in the NAND device
01/13/2015US8933500 EEPROM-based, data-oriented combo NVM design
01/13/2015US8933499 Asymmetrically stressed field effect transistor in dynamic cell
01/13/2015US8933497 Semiconductor switch device and method of manufacturing semiconductor switch device
01/13/2015US8933496 Electronically controlled squishable composite switch
01/13/2015US8933493 Semiconductor device with high voltage transistor
01/13/2015US8933490 Structure, method and system for complementary strain fill for integrated circuit chips
01/13/2015US8933489 Compound semiconductor device and manufacturing method of the same
01/13/2015US8933488 Heterostructure field effect transistor with same channel and barrier configuration for PMOS and NMOS
01/13/2015US8933487 Controlling lateral two-dimensional electron hole gas HEMT in type III nitride devices using ion implantation through gray scale mask
01/13/2015US8933485 Compound semiconductor device and method of manufacturing the same
01/13/2015US8933482 Light emitting device
01/13/2015US8933471 Organic EL panel, display device using same, and method for producing organic EL panel
01/13/2015US8933464 SiC epitaxial wafer and semiconductor device
01/13/2015US8933462 Method of fabricating diamond semiconductor and diamond semiconductor formed according to the method
01/13/2015US8933461 III-nitride enhancement mode transistors with tunable and high gate-source voltage rating
01/13/2015US8933460 Array substrate for fringe field switching mode liquid crystal display device
01/13/2015US8933458 Semiconductor device structures and methods of forming semiconductor structures
01/13/2015US8933457 3D memory array including crystallized channels
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