Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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06/05/2013 | CN103137561A Buried word line and method for forming buried word line |
06/05/2013 | CN103137560A Side wall stripping process method |
06/05/2013 | CN103137559A Removing method of pseudo polycrystalline silicon and manufacturing method of complementary metal oxide semiconductor (CMOS) metal grid |
06/05/2013 | CN103137558A Twisted nematic (TN) type array substrate and manufacturing method thereof and display device thereof |
06/05/2013 | CN103137557A Array substrate and display unit and manufacturing method of array substrate |
06/05/2013 | CN103137556A Conductive pattern forming method and conductive pattern forming system |
06/05/2013 | CN103137555A Thin film transistor liquid crystal display device and manufacturing method thereof |
06/05/2013 | CN103137554A Method of forming a semiconductor device by suing sacrificial gate electrodes and sacrificial self-aligned contact structures |
06/05/2013 | CN103137553A Integrated circuits with electrical fuses and methods of forming the same |
06/05/2013 | CN103137552A Method for forming contact hole |
06/05/2013 | CN103137551A Method for forming holes in grooves |
06/05/2013 | CN103137550A Method for forming gaps in self-aligned mode between interlayer dielectric layers |
06/05/2013 | CN103137549A Formation method of barrier layer and semiconductor device |
06/05/2013 | CN103137548A Method for improving silicon contact hole etching process window |
06/05/2013 | CN103137547A Si/NiSi 2 substrate material on insulator and preparation method thereof |
06/05/2013 | CN103137546A Si/NiSi2 substrate material on imaging fully-depleted insulation body and preparing method thereof |
06/05/2013 | CN103137545A Semiconductor device and forming method thereof |
06/05/2013 | CN103137544A Semi-conductor chip structure and manufacture method of metal fuse in chip |
06/05/2013 | CN103137543A Processing method capable of achieving shallow trench isolation |
06/05/2013 | CN103137542A Uniform shallow trench isolation regions and the method of forming the same |
06/05/2013 | CN103137541A Shallow groove filling method with inner side wall |
06/05/2013 | CN103137540A Manufacturing method of thick isolation dielectric medium layer structure of RFLDMOS |
06/05/2013 | CN103137539A Si/CoSi 2 substrate material on insulator and preparation method thereof |
06/05/2013 | CN103137538A Si/NiSi2 substrate material on imaging insulation body and preparing method thereof |
06/05/2013 | CN103137537A Si/CoSi2 substrate material on imaging fully-depleted insulation body and preparing method thereof |
06/05/2013 | CN103137536A Semiconductor processing system |
06/05/2013 | CN103137535A Wafer carrying device and carrying method thereof |
06/05/2013 | CN103137534A Substrate support device |
06/05/2013 | CN103137533A Electrostatic chuck robotic system |
06/05/2013 | CN103137532A Coplanar three-axis positioning device |
06/05/2013 | CN103137531A Wafer counterpoint method |
06/05/2013 | CN103137530A Registration system for mounting BGA (Ball Grid Array) elements |
06/05/2013 | CN103137529A Heat treatment method of semiconductor wafers, manufacturing method of solar battery, and heat treatment device |
06/05/2013 | CN103137528A Positioning device to position one or more plates of electronic circuits, in a metal deposition unit, and relative method |
06/05/2013 | CN103137527A Device for machining a substrate and a method for this purpose |
06/05/2013 | CN103137526A Apparatus for mounting semiconductor chips |
06/05/2013 | CN103137525A Vaporized material supply apparatus, substrate processing apparatus and vaporized material supply method |
06/05/2013 | CN103137524A Wafer debonding and cleaning apparatus and method of use |
06/05/2013 | CN103137523A Robot system and method of manufacturing workpiece |
06/05/2013 | CN103137522A Ball-planting fixture |
06/05/2013 | CN103137521A Air inlet device |
06/05/2013 | CN103137520A Semiconductor chip gas etching device |
06/05/2013 | CN103137519A Cold and hot plate device and temperature control method thereof |
06/05/2013 | CN103137518A Adjustable BGA (ball grid array) reballing device |
06/05/2013 | CN103137517A Reaction device for treating wafer, electrostatic chuck and wafer temperature control method |
06/05/2013 | CN103137516A Control system for mounting BGA (Ball Grid Array) elements |
06/05/2013 | CN103137515A Control device and compensation method of motorized spindle thermal drift and dicing machine |
06/05/2013 | CN103137514A Apparatus for testing a substrate |
06/05/2013 | CN103137513A Integrated circuit manufacturing tool condition monitoring system and method |
06/05/2013 | CN103137512A Light-emitting diode (LED) substrate surface automatic detection method |
06/05/2013 | CN103137511A Silicon through-hole test structure and corresponding test method |
06/05/2013 | CN103137510A Method and monitoring module for monitoring metal layer over-etching |
06/05/2013 | CN103137509A Device for wafer bonding and wafer bonding method |
06/05/2013 | CN103137508A Bonder |
06/05/2013 | CN103137507A Manufacturing method of semiconductor structure and semiconductor structure manufactured by applying of manufacturing method |
06/05/2013 | CN103137506A Joining method and semiconductor device manufacturing method |
06/05/2013 | CN103137505A Printed circuit board (PCB) fixing device of ball grid array (BGA) repair platform |
06/05/2013 | CN103137504A Movement device for mounting BGA (Ball Grid Array) elements |
06/05/2013 | CN103137503A Device for mounting BGA (Ball Grid Array) elements |
06/05/2013 | CN103137502A Chip seaming device |
06/05/2013 | CN103137501A Method for producing semiconductor device |
06/05/2013 | CN103137500A Method of manufacturing semiconductor device |
06/05/2013 | CN103137499A SOD 123 encapsulation component manufacturing process |
06/05/2013 | CN103137498A Semiconductor package structure and manufacturing method thereof |
06/05/2013 | CN103137497A Manufacturing method of low-temperature polycrystalline silicon transistor |
06/05/2013 | CN103137496A Semiconductor device and method for manufacturing the same |
06/05/2013 | CN103137495A Method for manufacturing semiconductor device |
06/05/2013 | CN103137494A Semiconductor device with field electrode |
06/05/2013 | CN103137493A FinFET with improved gate planarity |
06/05/2013 | CN103137492A Method of manufacturing oxide thin film transistor and display device |
06/05/2013 | CN103137491A Reacted layer for improving thickness uniformity of strained structures |
06/05/2013 | CN103137490A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
06/05/2013 | CN103137489A Semiconductor device manufacturing method |
06/05/2013 | CN103137488A Semiconductor device and manufacturing method thereof |
06/05/2013 | CN103137487A Improving method of passivation of deep trench corner |
06/05/2013 | CN103137486A Semiconductor device manufacturing method |
06/05/2013 | CN103137485A Preparation method of plane type super junction |
06/05/2013 | CN103137484A Production method of bridging grain polycrystalline silicon thin film transistor |
06/05/2013 | CN103137483A Method for eliminating sharp corner at top end of groove |
06/05/2013 | CN103137482A Method of reducing V-shaped groove at top end of polycrystalline silicon inside groove of groove-type power transistor |
06/05/2013 | CN103137481A Transistor manufacturing method |
06/05/2013 | CN103137480A Forming method of metal oxide semiconductor (MOS) device and MOS device formed through method |
06/05/2013 | CN103137479A Metal-oxide semiconductor tube and manufacturing method thereof |
06/05/2013 | CN103137478A Manufacturing method and structure of fin field-effect transistor (FinFET) device |
06/05/2013 | CN103137477A Preparation method for InP based high electron mobility transistor (HEMT) on Si substrate |
06/05/2013 | CN103137476A GaN high voltage HFET with passivation plus gate dielectric multilayer structure |
06/05/2013 | CN103137475A Semi-conductor structure and manufacture method thereof |
06/05/2013 | CN103137474A Method of manufacturing field termination type insulated gate bipolar translator (IGBT) component in patching mode |
06/05/2013 | CN103137473A Method of manufacturing field termination type insulated gate bipolar translator (IGBT) component with substrate provided with outward-extending layer |
06/05/2013 | CN103137472A Method for manufacturing insulated gate bipolar transistor (IGBT) component combined with fast recovery diode (FRD) |
06/05/2013 | CN103137471A Manufacturing method for self-isolation parasitism plug-and-play (PNP) device in SiGe HBT (heterojunction bipolar transistor) process |
06/05/2013 | CN103137470A Semiconductor device and manufacturing method thereof |
06/05/2013 | CN103137469A Method for manufacturing non-photosensitive polyimide passivation layer |
06/05/2013 | CN103137468A Apparatus and method for manufacturing semiconductor devices |
06/05/2013 | CN103137467A Semiconductor manufacturing process for removing oxide layer |
06/05/2013 | CN103137466A Method for removing silicon nitride in manufacturing process of deep trench device |
06/05/2013 | CN103137465A Method for overcoming silicon-needle-shaped defects on periphery of deep groove process chip |
06/05/2013 | CN103137464A Source leakage polycrystalline silicon autoregistration dry etching method |
06/05/2013 | CN103137463A Solution for detect of needle shape in deep groove etching process |
06/05/2013 | CN103137462A Method for forming self-aligned metal silicide |