Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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06/06/2013 | US20130143363 Adhesive composition for semiconductor and adhesive film comprising the same |
06/06/2013 | US20130143362 Organic electronic devices |
06/06/2013 | US20130143361 Packaging Process Tools and Systems, and Packaging Methods for Semiconductor Devices |
06/06/2013 | US20130143360 Semiconductor structure and method for making the same |
06/06/2013 | US20130143359 Semiconductor device and a manufacturing method of the same |
06/06/2013 | US20130143358 Method for manufacturing oxide thin film transistor |
06/06/2013 | US20130143348 Heat treatment method of semiconductor wafers, manufacturing method of solar battery, and heat treatment device |
06/06/2013 | US20130143338 Methods of fabrication of high-density laser diode stacks |
06/06/2013 | US20130143164 Polymerizable composition |
06/06/2013 | US20130143038 Pseudo-substrate for use in the production of semiconductor components and method for producing a pseudo-substrate |
06/06/2013 | US20130142979 Thermoformed IC Trays Of Poly(Phenylene Ether) Compositions |
06/06/2013 | US20130142595 Vacuum processing apparatus and operating method of the same |
06/06/2013 | US20130142594 Methods for Transporting Wafers Between Wafer Holders and Chambers |
06/06/2013 | US20130142478 Method and apparatus for aligning a laser diode on a slider structure |
06/06/2013 | US20130141967 Variable resistive memory device and method of fabricating the same |
06/06/2013 | US20130141963 Methods and Apparatus for FinFET SRAM Cells |
06/06/2013 | US20130141910 Method for assembling LEDs to a ceramic heat conductive piece and a structure produced by the method |
06/06/2013 | US20130141833 Mobile electrostatic carriers for thin wafer processing |
06/06/2013 | US20130141708 Substrate processing method, manufacturing method of euv mask, and euv mask |
06/06/2013 | US20130141089 Semiconductor GMI Magnetometer |
06/06/2013 | US20130140838 Mobile vacuum carriers for thin wafer processing |
06/06/2013 | US20130140752 Method and jig for holding silicon wafer |
06/06/2013 | US20130140713 Interposer Wafer Bonding Method and Apparatus |
06/06/2013 | US20130140712 Array Substrate, LCD Device, and Method for Manufacturing Array Substrate |
06/06/2013 | US20130140709 Semiconductor device and method of manufacturing the same |
06/06/2013 | US20130140708 Semiconductor device and method of fabricating the same |
06/06/2013 | US20130140707 Semiconductor device and layout design method for the same |
06/06/2013 | US20130140706 UBM Structures for Wafer Level Chip Scale Packaging |
06/06/2013 | US20130140705 Circuit connector apparatus and method therefor |
06/06/2013 | US20130140704 Low Frequency CMUT with Thick Oxide |
06/06/2013 | US20130140701 Solderable Contact and Passivation for Semiconductor Dies |
06/06/2013 | US20130140700 Method of manufacturing a semiconductor device and semiconductor device |
06/06/2013 | US20130140698 Doped Tantalum Nitride for Copper Barrier Applications |
06/06/2013 | US20130140693 Method for forming an integrated circuit |
06/06/2013 | US20130140691 Semiconductor Device and Method of Forming Patterned Repassivation Openings Between RDL and UBM to Reduce Adverse Effects of Electro-Migration |
06/06/2013 | US20130140690 TSV Structures and Methods for Forming the Same |
06/06/2013 | US20130140688 Through Silicon Via and Method of Manufacturing the Same |
06/06/2013 | US20130140686 Semiconductor package structure and manufacturing method thereof |
06/06/2013 | US20130140685 Electronic Device and a Method for Fabricating an Electronic Device |
06/06/2013 | US20130140683 Semiconductor Device and Method of Forming Cavity in Build-Up Interconnect Structure for Short Signal Path Between Die |
06/06/2013 | US20130140682 Buried word line and method for forming buried word line in semiconductor device |
06/06/2013 | US20130140669 Semiconductor device and method of manufacturing the same |
06/06/2013 | US20130140668 Forming Structures on Resistive Substrates |
06/06/2013 | US20130140667 Localized carrier lifetime reduction |
06/06/2013 | US20130140655 Mems acoustic transducer and method for fabricating the same |
06/06/2013 | US20130140654 Low Frequency CMUT with Vent Holes |
06/06/2013 | US20130140650 MEMS Devices and Methods for Forming the Same |
06/06/2013 | US20130140646 Transistor with reduced depletion field width |
06/06/2013 | US20130140643 Integrated high-k/metal gate in cmos process flow |
06/06/2013 | US20130140639 High gate density devices and methods |
06/06/2013 | US20130140635 Semiconductor device and method of manufacturing the same |
06/06/2013 | US20130140634 Method of replacing silicon with metal in integrated circuit chip fabrication |
06/06/2013 | US20130140633 Edge termination for super junction mosfet devices |
06/06/2013 | US20130140632 Lateral Transistor Component and Method for Producing Same |
06/06/2013 | US20130140631 Semicondutor isolation structure and method of manufacture |
06/06/2013 | US20130140630 Trench schottky diode and manufacturing method thereof |
06/06/2013 | US20130140629 Insulated gate field effect transistor having passivated schottky barriers to the channel |
06/06/2013 | US20130140621 Flash memory |
06/06/2013 | US20130140620 Flash Memory and Manufacturing Method Thereof |
06/06/2013 | US20130140605 GaN high voltage HFET with passivation plus gate dielectric multilayer structure |
06/06/2013 | US20130140583 Silicon carbide semiconductor device and method for manufacturing the same |
06/06/2013 | US20130140582 Semiconductor device and method for manufacturing same |
06/06/2013 | US20130140579 Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device |
06/06/2013 | US20130140577 Semiconductor Device and Method for Preparing the Same |
06/06/2013 | US20130140576 Semiconductor device and method for manufacturing the same |
06/06/2013 | US20130140573 Manufacturing method for crystalline semiconductor film, semiconductor device, and display device |
06/06/2013 | US20130140567 Silicon substrate, epitaxial structure including the same, and method of manufacturing the silicon substrate |
06/06/2013 | US20130140551 Transistors, methods of manufacturing the same, and electronic devices including transistors |
06/06/2013 | US20130140525 Gallium nitride growth method on silicon substrate |
06/06/2013 | US20130140517 Thin and Flexible Gallium Nitride and Method of Making the Same |
06/06/2013 | US20130140516 Protruding post resistive memory devices and methods of manufacturing the same |
06/06/2013 | US20130140513 Thermally confined electrode for programmable resistance memory |
06/06/2013 | US20130140512 Nonvolatile resistive memory element with a passivated switching layer |
06/06/2013 | US20130140503 Precursor composition for forming amorphous metal oxide semiconductor layer, amorphous metal oxide semiconductor layer, method for producing same, and semiconductor device |
06/06/2013 | US20130139966 Jig for use in etching and chemical lift-off apparatus including the same |
06/06/2013 | US20130139946 Process for bonding two substrates |
06/06/2013 | US20130139851 Post cmp scrubbing of substrates |
06/06/2013 | DE112011102681T5 Induktionsheizvorrichtung und lnduktionsheizverfahren Induction heating and lnduktionsheizverfahren |
06/06/2013 | DE112011102644T5 Integrierte Halbleiterschaltung A semiconductor integrated circuit |
06/06/2013 | DE112011102414T5 Verfahren zur Herstellung isolierter Kondensatoren und Struktur daraus Process for the production of insulated capacitors and structure thereof |
06/06/2013 | DE112011102331T5 Verfahren zum schnellen Schätzen bindender Lithografiestrukturen in einem Layout einer integrierten Schaltung A method for quickly estimating binding lithographic structures in a layout of an integrated circuit |
06/06/2013 | DE112011102327T5 Schichtbildungsvorrichtung Film forming apparatus |
06/06/2013 | DE112011102263T5 Halbleitervorrichtung Semiconductor device |
06/06/2013 | DE112010003403T5 Transistoren mit einer Gate-Isolationsschicht mit einer Kanalverarmungsgrenzschichtladung und diesbezügliches Herstellungsverfahren Transistors with a gate insulating layer with a channel depletion boundary layer charge, and to this effect production method |
06/06/2013 | DE102013205563A1 Fixing crystal on a saw strip, comprises providing an adhesive layer, which is interrupted by adhesive-free regions, between the crystal and the saw strip by inserting an adhesive between them |
06/06/2013 | DE102012221690A1 4H-SiC-Halbleiterelement und Halbleitervorrichtung 4H-SiC semiconductor element and semiconductor device |
06/06/2013 | DE102012220825A1 Verbesserung des polysilicium/metall- kontaktwiderstands in einem tiefen graben Dig improving the polysilicon / metal-contact resistor in a deep |
06/06/2013 | DE102012220824A1 Eingebettete brücke mit niedrigem widerstand für einen grabenkondensator Embedded bridge with low resistance for a grave capacitor |
06/06/2013 | DE102012220822A1 Finfet mit verbesserter gate-planarität FinFET with improved gate-planarity |
06/06/2013 | DE102012111654A1 Elektronisches Bauelement und ein Verfahren zur Herstellung eines elektronischen Bauelements Electronic component and a method for manufacturing an electronic component |
06/06/2013 | DE102012111633A1 Prüfkörperanordnung zum Untersuchen von Leistungshalbleitervorrichtungen und Inspektionsvorrichtung, die diese verwendet Test body for inspecting the power semiconductor devices and inspection apparatus using this |
06/06/2013 | DE102012111632A1 Inspektionsvorrichtung für Halbleitervorrichtungen und Klemmstufe, die für die Inspektionsvorrichtung verwendet wird An inspection apparatus for semiconductor devices and terminal stage, which is used for the inspection device |
06/06/2013 | DE102012104197A1 Verfahren für das Ausbilden einer Verbindung in einer Solarzelle A method for forming a connection in a solar cell |
06/06/2013 | DE102012101875A1 Vorrichtung mit hoher Gatedichte und Verfahren zu deren Herstellung Device with high gate density and methods for their preparation |
06/06/2013 | DE102012100825A1 Vorrichtung zum Bearbeiten eines Substrats und Verfahren hierzu An apparatus for processing a substrate and method therefor |
06/06/2013 | DE102012023503A1 Legierter 2N-Kupferdraht zum Bonden in Mikroelektronikgeräten Alloy 2N copper wire for bonding in microelectronic devices |
06/06/2013 | DE102012023501A1 Sekundär legierter 1N-Kupferdraht zum Bonden in Mikroelektronikgeräten Secondary alloy 1N copper wire for bonding in microelectronic devices |
06/06/2013 | DE102012023500A1 3N-Kupferdraht mit Spurenmengen von Zusatzstoffen zum Bonden in Mikroelektronikgeräten 3N copper wire with trace amounts of additives for bonding in microelectronic devices |
06/06/2013 | DE102012023499A1 Dotierter 4N-Kupferdraht zum Bonden in Mikroelektronikgeräten Doped 4N copper wire for bonding in microelectronic devices |
06/06/2013 | DE102011120133A1 Apparatus for wet-chemical treatment of substrate, has liquid-based seal that is provided in transition region between outer wall and container for shielding of gaseous substance or treatment liquid relative to environment |