Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2013
06/06/2013WO2013080972A1 Method for producing ga2o3 crystal film
06/06/2013WO2013080956A1 Semiconductor element image recognition device and semiconductor element image recognition method
06/06/2013WO2013080931A1 Semiconductor display device
06/06/2013WO2013080900A1 Semiconductor device and method for manufacturing the same
06/06/2013WO2013080851A1 Gold-platinum-palladium alloy bonding wire
06/06/2013WO2013080832A1 Method for preparing chemical for forming protective membrane
06/06/2013WO2013080822A1 Method for preparing chemical for forming protective membrane
06/06/2013WO2013080801A1 Tantalum sputtering target and method for manufacturing same
06/06/2013WO2013080784A1 Memory circuit, drive method for same, nonvolatile storage device using same, and liquid crystal display device
06/06/2013WO2013080741A1 Photopolymerizable composition and pattern forming method using same
06/06/2013WO2013080723A1 Method for manufacturing silicon carbide semiconductor device
06/06/2013WO2013080708A1 Resin composition, resin composition sheet, semiconductor device and method for manufacturing same
06/06/2013WO2013080679A1 Silicon carbide semiconductor apparatus and method for manufacturing same
06/06/2013WO2013080588A1 Structure for attaching diode
06/06/2013WO2013080584A1 Semiconductor device fabrication method
06/06/2013WO2013080580A1 Cleaning device and method
06/06/2013WO2013080516A1 Thin film transistor substrate, display apparatus provided with same, and method for manufacturing thin film transistor substrate
06/06/2013WO2013080501A1 Method for manufacturing semiconductor device
06/06/2013WO2013080480A1 Yawing correction mechanism for conveyed workpiece and correction method therefor
06/06/2013WO2013080472A1 Semiconductor device and method for manufacturing same
06/06/2013WO2013080453A1 Carrier for double-sided polishing device, and double-sided polishing device and double-sided polishing method using same
06/06/2013WO2013080438A1 Recording element and recording device
06/06/2013WO2013080437A1 Storage element, and storage device
06/06/2013WO2013080436A1 Storage element, and storage device
06/06/2013WO2013080417A1 Semiconductor device
06/06/2013WO2013080378A1 Semiconductor device manufacturing method and semiconductor device
06/06/2013WO2013080280A1 Substrate processing device and robot controller
06/06/2013WO2013080252A1 Method for forming crystalline thin film, and method for manufacturing thin film transistor
06/06/2013WO2013080248A1 Thin film transistor array manufacturing method, thin film transistor array and display device
06/06/2013WO2013080247A1 Thin film transistor and method for manufacturing thin film transistor
06/06/2013WO2013080246A1 Method for manufacturing crystalline substrate
06/06/2013WO2013080237A1 Field-effect transistor with two-dimensional channel realized with lateral heterostructures based on hybridized graphene
06/06/2013WO2013080106A2 Device and method for treating wafer-shaped articles
06/06/2013WO2013080010A1 Process for fabricating a heterostructure limiting the formation of defects
06/06/2013WO2013079688A1 Hetero-substrate for producing integrated circuits comprising optical, optoelectronic and electronic components
06/06/2013WO2013079234A1 Method for doping a semiconductor body, and semiconductor component
06/06/2013WO2013079096A1 Assembly for sorting optoelectronic devices
06/06/2013WO2013078909A1 Radio frequency power source having precise power detector
06/06/2013WO2013078882A1 Semiconductor device and manufacturing method therefor
06/06/2013WO2013078807A1 Monolithical integrated lattice mismatched crystal template and fabrication method therefor
06/06/2013WO2013078803A1 Method for manufacturing semiconductor device
06/06/2013WO2013078753A1 Barrel-plating quad flat no-lead(qfn) package structure and method for manufacturing the same
06/06/2013WO2013078752A1 No-exposed-pad quad flat no-lead (qfn) packaging structures and method for manufacturing the same
06/06/2013WO2013078750A1 First-plating-then-etching quad flat no-lead (qfn) packaging structures and method for manufacturing the same
06/06/2013WO2013078705A1 Panel taking and placing method in uvm process, and panel taking combination device for implementing the method
06/06/2013WO2013078641A1 Bridge die polysilicon thin-film transistor and manufacturing method thereof
06/06/2013WO2013078609A1 Active chip package substrate and preparation method of the substrate
06/06/2013WO2013052833A3 High power semiconductor electronic components with increased reliability
06/06/2013WO2013033394A3 High definition heater system having a fluid medium
06/06/2013WO2013013956A3 Layer composite composed of a layer arrangement and an electrical or electronic component
06/06/2013WO2013006803A8 Integrated solar collectors using epitaxial lift off and cold weld bonded semiconductor solar cells
06/06/2013WO2013003122A3 Measurement of composition for thin films
06/06/2013WO2013002601A9 Memory device using graphene and method for manufacturing same
06/06/2013WO2012056240A3 Method of polishing coated substrates using brushes
06/06/2013WO2011099680A9 Single crystal cooler and single crystal grower including the same
06/06/2013US20130143418 Rapid thermal annealing to reduce pattern effect
06/06/2013US20130143417 Crystallization processing for semiconductor applications
06/06/2013US20130143416 Laser ablation with extraction of the ablated material
06/06/2013US20130143415 Multi-Component Film Deposition
06/06/2013US20130143414 Nanostructured electrodes and active polymer layers
06/06/2013US20130143413 Wafer processing method
06/06/2013US20130143412 Methods for preparing thin samples for tem imaging
06/06/2013US20130143411 Systems and methods for improving front-side process uniformity by back-side metallization
06/06/2013US20130143410 Non-Uniformity Reduction in Semiconductor Planarization
06/06/2013US20130143409 Methods for forming semiconductor structures using selectively-formed sidewall spacers
06/06/2013US20130143408 Etch resistant alumina based coatings
06/06/2013US20130143407 Method for producing a thin single crystal silicon having large surface area
06/06/2013US20130143406 Techniques providing photoresist removal
06/06/2013US20130143405 Silicon wafer processing solution and silicon wafer processing method
06/06/2013US20130143404 Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
06/06/2013US20130143403 Texture-etchant composition for crystalline silicon wafer and method for texture-etching (1)
06/06/2013US20130143402 Method of forming Cu thin film
06/06/2013US20130143401 Metal and silicon containing capping layers for interconnects
06/06/2013US20130143400 Metal-contamination-free through-substrate via structure
06/06/2013US20130143399 Method for Forming a Reliable Solderable Contact
06/06/2013US20130143398 Method for manufacturing semiconductor device
06/06/2013US20130143397 Use of an organic planarizing mask for cutting a plurality of gate lines
06/06/2013US20130143396 Pretreatment Method for Reduction and/or Elimination of Basal Plane Dislocations Close to Epilayer/Substrate Interface in Growth of SiC Epitaxial
06/06/2013US20130143395 Stable amorphous metal oxide semiconductor
06/06/2013US20130143394 Semiconductor substrate and method of forming
06/06/2013US20130143393 Apparatus for manufacturing compound semiconductor, method for manufacturing compound semiconductor, and compound semiconductor
06/06/2013US20130143392 In-situ sin growth to enable schottky contact for gan devices
06/06/2013US20130143391 Reacted layer for improving thickness uniformity of strained structures
06/06/2013US20130143390 Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method
06/06/2013US20130143389 Controlled process and resulting device
06/06/2013US20130143388 Method for manufacturing semiconductor device
06/06/2013US20130143387 Method of manufacturing a semiconductor device
06/06/2013US20130143386 Method of filling shallow trenches
06/06/2013US20130143385 Stress in trigate devices using complimentary gate fill materials
06/06/2013US20130143383 Method of forming an ald material
06/06/2013US20130143379 Leakage reduction in dram mim capacitors
06/06/2013US20130143378 Method of forming polysilicon layer and method of manufacturing thin film transistor using the polysilicon layer
06/06/2013US20130143376 Current in one-time-programmable memory cells
06/06/2013US20130143375 On Current in One-Time-Programmable Memory Cells
06/06/2013US20130143374 Method for manufacturing semiconductor device and method for growing graphene
06/06/2013US20130143372 Methods of forming patterns of a semiconductor device
06/06/2013US20130143369 Chip identification for organic laminate packaging and methods of manufacture
06/06/2013US20130143368 Semiconductor device
06/06/2013US20130143366 Alpha shielding techniques and configurations
06/06/2013US20130143364 Method of processing solder bump by vacuum annealing