| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/14/2015 | CN104282604A 用于双面镀膜的石墨舟片及石墨舟 Graphite and graphite boat for boat piece of double-sided coating |
| 01/14/2015 | CN104282603A 一种晶片承载盘及大束流注入设备 A wafer carrier plate and a large beam injection device |
| 01/14/2015 | CN104282602A 硅片放置架 Wafer Storage Racks |
| 01/14/2015 | CN104282601A 一种二极管绕弯机构 To a diode Raowan agency |
| 01/14/2015 | CN104282600A 一种二极管缠脚线夹具 Foot-line to a diode clamp |
| 01/14/2015 | CN104282599A 一种二极管下线装置 To a diode device offline |
| 01/14/2015 | CN104282598A 蚀刻、显影、清洗以及褪膜设备、喷淋处理设备及方法 Etching, developing, cleaning and faded film equipment, spray processing apparatus and method |
| 01/14/2015 | CN104282597A 双焊头固晶装置 Double horn solid crystal device |
| 01/14/2015 | CN104282596A 半导体测试治具的形成方法 The method for forming a semiconductor test fixture |
| 01/14/2015 | CN104282595A 一种兼容多尺寸硅外延测试片的制备方法 A method of preparing a test piece-size silicon epitaxial compatible |
| 01/14/2015 | CN104282594A 监测介质层性能的测试结构 Test structures to monitor the performance of the dielectric layer |
| 01/14/2015 | CN104282593A 硅光伏电池的钝化缺陷的光致发光绘图 Photoluminescence graphics silicon photovoltaic cell defect passivation |
| 01/14/2015 | CN104282592A 探测装置 Detection device |
| 01/14/2015 | CN104282591A 用于在导线键合过程中测量无空气球尺寸的方法和装置 Method and apparatus for measuring the free air ball size in the wire bonding process is used |
| 01/14/2015 | CN104282590A 半导体晶粒及其制备方法和检测该半导体晶粒裂缝的方法 Semiconductor die and its preparation method and a method to detect cracks in the semiconductor die |
| 01/14/2015 | CN104282589A 检查装置 Inspection device |
| 01/14/2015 | CN104282588A 一种用于晶片表面平整度测量的工装 Tooling for wafer surface flatness measurements |
| 01/14/2015 | CN104282587A 晶圆边缘缺陷的检测方法 Wafer edge defect detection method |
| 01/14/2015 | CN104282586A 用于热压接合器的接合头、热压接合器及其操作方法 Bond head for the thermocompression bonding, thermocompression bonding and its method of operation |
| 01/14/2015 | CN104282585A 测试针头和半导体测试夹具的形成方法 The method for forming a semiconductor testing needles and test fixture |
| 01/14/2015 | CN104282584A 芯片植入锡球模具 Chip implanted tin ball mold |
| 01/14/2015 | CN104282583A 适于半导体器件贴片制程的操作板 SMT manufacturing process of semiconductor devices suitable for the operation panel |
| 01/14/2015 | CN104282582A 一种Ni-P基板的封装方法 A packaged method of Ni-P substrate |
| 01/14/2015 | CN104282581A 树脂片粘贴方法 Resin sheet paste method |
| 01/14/2015 | CN104282580A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/14/2015 | CN104282579A 一种半导体产品封装工艺 A semiconductor product packaging process |
| 01/14/2015 | CN104282578A 内嵌式封装体工艺及其结构 Embedded technology package and its structure |
| 01/14/2015 | CN104282577A 用于在半导体衬底上产生接触区的方法 The method of generating the contact area on the semiconductor substrate for |
| 01/14/2015 | CN104282576A 一种金属氧化物薄膜晶体管制作方法 Of a metal oxide thin film transistor fabrication method |
| 01/14/2015 | CN104282575A 一种制备纳米尺度场效应晶体管的方法 A method of preparing nanoscale field-effect transistors |
| 01/14/2015 | CN104282574A 一种半导体装置以及其制造方法 A semiconductor device and manufacturing method thereof |
| 01/14/2015 | CN104282573A 沟槽型双层栅功率mos器件的制造方法 The method of manufacturing a trench-type double-gate power mos devices |
| 01/14/2015 | CN104282572A Vdmos器件制造方法 Vdmos device manufacturing method |
| 01/14/2015 | CN104282571A 鳍型场效应晶体管及其制造方法 Fin-type field effect transistor and manufacturing method thereof |
| 01/14/2015 | CN104282570A 半导体器件的制备方法 The method for preparing a semiconductor device |
| 01/14/2015 | CN104282569A Rfldmos的制作工艺方法 Rfldmos craftsmanship methods |
| 01/14/2015 | CN104282568A 一种半导体结构及其制造方法 A semiconductor structure and its manufacturing method |
| 01/14/2015 | CN104282567A 制造igzo层和tft的方法 Manufacturing method igzo layer and tft |
| 01/14/2015 | CN104282566A 鳍式场效应晶体管及其形成方法 Fin field-effect transistor and method of forming |
| 01/14/2015 | CN104282565A 鳍式场效应晶体管及其形成方法 Fin field-effect transistor and method of forming |
| 01/14/2015 | CN104282564A 半导体器件和鳍式场效应晶体管的形成方法 The method for forming a semiconductor device and a fin field effect transistor |
| 01/14/2015 | CN104282563A Ldmos器件及其形成方法 Device and method for forming Ldmos |
| 01/14/2015 | CN104282562A 鳍式场效应晶体管及其形成方法 Fin field-effect transistor and method of forming |
| 01/14/2015 | CN104282561A FinFET器件及其制作方法 FinFET device and manufacturing method thereof |
| 01/14/2015 | CN104282560A 级联堆叠纳米线mos晶体管制作方法 Cascade stacked nanowire transistors mos production methods |
| 01/14/2015 | CN104282559A 堆叠纳米线mos晶体管及其制作方法 Mos stacked nanowire transistors and its production method |
| 01/14/2015 | CN104282558A 一种无结纳米线FinFET及其制作方法 A non-knot nanowires FinFET and production methods |
| 01/14/2015 | CN104282557A 一种电加热设备用超温自保护晶闸管的制作方法 An electrical heating equipment since production methods overtemperature protection thyristor |
| 01/14/2015 | CN104282556A 双极型晶体管发射极的掺杂方法 Bipolar transistor emitter doping method |
| 01/14/2015 | CN104282555A 一种绝缘栅双极性晶体管的制造方法 A method of manufacturing an insulated gate bipolar transistor |
| 01/14/2015 | CN104282554A 一种igbt的制造方法 A method of producing igbt |
| 01/14/2015 | CN104282553A 一种igbt的制造方法 A method of producing igbt |
| 01/14/2015 | CN104282552A 一种igbt的制造方法 A method of producing igbt |
| 01/14/2015 | CN104282551A 一种igbt的制造方法 A method of producing igbt |
| 01/14/2015 | CN104282550A 肖特基二极管的制造方法 The method of manufacturing the Schottky diode |
| 01/14/2015 | CN104282549A 一种背面结构的保护方法 A method of protecting the back of the structure |
| 01/14/2015 | CN104282548A 一种iii-v族化合物半导体材料的刻蚀方法 A method of etching iii-v compound semiconductor material |
| 01/14/2015 | CN104282547A 麦克风mems减薄工艺方法 Mems microphone thinning process method |
| 01/14/2015 | CN104282546A 一种提高多晶硅层均匀性的方法 A method for the uniformity of the polysilicon layer to improve |
| 01/14/2015 | CN104282545A 一种晶片研磨方法 A wafer polishing method |
| 01/14/2015 | CN104282544A 具有掩埋栅极电极结构的半导体器件制造方法及半导体器件 A buried gate electrode structure having a semiconductor device manufacturing method and semiconductor device |
| 01/14/2015 | CN104282543A 应用于沟槽型mos器件的沟槽栅及其制备方法 Its preparation method is applied to the trench gate trench mos devices |
| 01/14/2015 | CN104282542A 解决超级结产品保护环场氧侧壁多晶硅残留的方法 Super Junction solve product protection ring field oxide sidewall polysilicon residual method |
| 01/14/2015 | CN104282541A 一种半导体结构及其制造方法 A semiconductor structure and its manufacturing method |
| 01/14/2015 | CN104282540A 晶体管及其形成方法 Transistor and method of forming |
| 01/14/2015 | CN104282539A 一种多晶硅制作方法 One kind of polysilicon production methods |
| 01/14/2015 | CN104282538A 一种制作半导体器件的方法 A method of fabricating a semiconductor device |
| 01/14/2015 | CN104282537A 半导体器件及制造方法 Semiconductor device and method of manufacture |
| 01/14/2015 | CN104282536A 金属层的形成工艺 Process for forming a metal layer |
| 01/14/2015 | CN104282535A 一种提高ccd器件用p型硅外延片电阻率均匀性的方法 An increase ccd device uniformity method p-type silicon wafer resistivity |
| 01/14/2015 | CN104282534A 金属表面缺陷的处理方法 Processing method of metal surface defects |
| 01/14/2015 | CN104282533A 研磨方法及研磨装置 Method and apparatus for polishing abrasive |
| 01/14/2015 | CN104282532A 用于GaN膜中掺杂剂物质的电活化的方法 GaN films dopant material for electric activation method |
| 01/14/2015 | CN104282531A 半导体材料表面钝化层结构的形成工艺方法 Process for forming a surface passivation layer of semiconductor material structure |
| 01/14/2015 | CN104282530A 包括等温处理区的等离子体处理设备 Isothermal plasma processing apparatus includes a processing zone |
| 01/14/2015 | CN104282522A 具有离子加速器的双室等离子体蚀刻器 Ion accelerator with a dual-chamber plasma etcher |
| 01/14/2015 | CN104282521A 离子束蚀刻系统 Ion beam etching system |
| 01/14/2015 | CN104282237A 一种led集成像素封装模组及其高清显示屏 One kind of led module and integrated package pixel HD display |
| 01/14/2015 | CN104281010A 形成方法和基板 Formation method and substrate |
| 01/14/2015 | CN104280967A 阵列基板及其制造方法、显示面板和显示装置 Array substrate and manufacturing method thereof, a display panel and a display device |
| 01/14/2015 | CN104280963A 阵列基板及其制造方法、显示装置 Array substrate and its manufacturing method, a display device |
| 01/14/2015 | CN104280651A 测试系统以及半导体元件 Test systems and semiconductor components |
| 01/14/2015 | CN104278330A 一种晶硅太阳能电池用制绒液及其制备方法 A crystalline silicon solar cell with a textured liquid and its preparation method |
| 01/14/2015 | CN104275642A 研磨装置及研磨状态监视方法 Grinding and polishing equipment condition monitoring methods |
| 01/14/2015 | CN104275640A 膜厚测定装置、膜厚测定方法及具有膜厚测定装置的研磨装置 Film thickness measuring apparatus, the film thickness measuring method and a polishing apparatus having a film thickness measuring device |
| 01/14/2015 | CN104275567A 部件的固定夹具、固定装置以及固定搬运器 Fixture member, and a fixing means fixing the carrier |
| 01/14/2015 | CN104275555A 衬底分离装置和使用衬底分离装置的衬底分离方法 Substrate separating apparatus and method for separating a substrate using a substrate separation means |
| 01/14/2015 | CN104275317A 基板清洗装置及基板清洗方法 Substrate cleaning apparatus and substrate cleaning method |
| 01/14/2015 | CN103339219B Cmp研磨液及其制造方法、复合粒子的制造方法以及基体的研磨方法 Cmp slurry polishing method and its manufacturing method, manufacturing method of composite particles and matrix |
| 01/14/2015 | CN103000549B 腔室装置和具有它的基片处理设备 Chamber means and having its substrate processing apparatus |
| 01/14/2015 | CN102983102B 阵列基板及其制作方法、显示装置 Array substrate and method of manufacturing the display device |
| 01/14/2015 | CN102971449B 成膜装置 Film forming apparatus |
| 01/14/2015 | CN102969232B 后栅工艺中假栅的制造方法 Fake gate after gate process manufacturing methods |
| 01/14/2015 | CN102956516B 一种引线键合机xy工作台结构 A lead bonder xy table structure |
| 01/14/2015 | CN102915971B 一种半导体器件的制造方法 A method of manufacturing a semiconductor device |
| 01/14/2015 | CN102891089B 智能卡的封装方法 Smart card packaging method |
| 01/14/2015 | CN102891073B 一种低温等离子体辅助铝诱导多晶碳化硅薄膜的制备方法 A low-temperature plasma-assisted preparation of aluminum-induced polycrystalline silicon carbide films |
| 01/14/2015 | CN102874513B 硅片清洗设备以及储液罐 Wafer cleaning equipment and reservoir |
| 01/14/2015 | CN102856294B 单芯片正装先蚀刻后封装基岛埋入封装结构及其制造方法 After etching the first single-chip package being installed base island buried package structure and its manufacturing method |
| 01/14/2015 | CN102832182B 半导体封装件及其制造方法 Semiconductor package and its manufacturing method |