Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2015
01/15/2015US20150017800 Interconnect Structure for Semiconductor Devices
01/15/2015US20150017799 Method of semiconductor integrated circuit fabrication
01/15/2015US20150017798 Method of manufacturing through-silicon-via
01/15/2015US20150017797 Method of manufacturing semiconductor device including metal-containing conductive line
01/15/2015US20150017796 Techniques providing metal gate deviceswith multiple barrier layers
01/15/2015US20150017795 Non-Volatile Memory With Silicided Bit Line Contacts
01/15/2015US20150017794 Methods for forming doped silicon oxide thin films
01/15/2015US20150017793 Formation of localised molten regions in silicon containing multiple impurity types
01/15/2015US20150017792 Method and system for diffusion and implantation in gallium nitride based devices
01/15/2015US20150017791 Film-forming composition and ion implantation method
01/15/2015US20150017790 Method for manufacturing semiconductor device
01/15/2015US20150017789 Electronic device using group iii nitride semiconductor and its fabrication method and an epitaxial multi-layer wafer for making it
01/15/2015US20150017788 Method for making silicon-germanium absorbers for thermal sensors
01/15/2015US20150017787 Method and apparatus to reduce contamination of particles in a fluidized bed reactor
01/15/2015US20150017786 Method for Treating Group III Nitride Substrate and Method for Manufacturing Epitaxial Substrate
01/15/2015US20150017785 Method of forming salicide block with reduced defects
01/15/2015US20150017784 Semiconductor processing apparatus using laser
01/15/2015US20150017783 Method for manufacturing bonded soi wafer
01/15/2015US20150017781 Method of forming shallow trench isolation structure
01/15/2015US20150017779 Semiconductor device having stacked storage nodes of capacitors in cell region separated from peripheral region
01/15/2015US20150017778 Capacitor in Post-Passivation Structures and Methods of Forming the Same
01/15/2015US20150017776 Epitaxial growth of doped film for source and drain regions
01/15/2015US20150017775 Device with a Vertical Gate Structure
01/15/2015US20150017774 Method of forming fins with recess shapes
01/15/2015US20150017773 Semiconductor device and method for manufacturing the same
01/15/2015US20150017768 Semiconductor device and method of forming the same
01/15/2015US20150017767 Method for producing a semiconductor device having sgts
01/15/2015US20150017763 Microelectronic Assembly With Thermally and Electrically Conductive Underfill
01/15/2015US20150017762 Display device and method for manufacturing the same
01/15/2015US20150017761 Method for fabricating thin-film transistor
01/15/2015US20150017754 Composition for forming n-type diffusion layer, method for producing semiconductor substrate having n-type diffusion layer, and method for producing solar cell element
01/15/2015US20150017751 Method for manufacturing semiconductor device
01/15/2015US20150017748 Apparatus and method for manufacturing led package
01/15/2015US20150017747 Method for forming a solar cell with a selective emitter
01/15/2015US20150017746 Methods of forming a semiconductor device
01/15/2015US20150017745 Polishing method and polishing apparatus
01/15/2015US20150017742 Methods for manufacturing a data storage device
01/15/2015US20150017741 Plasma etching method
01/15/2015US20150017740 Molecular sensor based on virtual buried nanowire
01/15/2015US20150017456 Reducing voids caused by trapped acid on a dielectric surface
01/15/2015US20150017454 Chemical mechanical polishing (cmp) composition comprising a protein
01/15/2015US20150017372 Method of manufacturing resin-encapsulated electronic component and apparatus for manufacturing resin-encapsulated electronic component
01/15/2015US20150017086 Silicon single crystal and method for manufacture thereof
01/15/2015US20150016943 Lithographic Overlay Sampling
01/15/2015US20150016941 Sealed substrate carriers and systems and methods for transporting substrates
01/15/2015US20150016936 Substrate transfer method and device
01/15/2015US20150016935 Substrate retaining device
01/15/2015US20150016926 Pod having top cover aperture for detecting surrounding gas within the pod
01/15/2015US20150016174 Integrated circuits with programmable electrical connections and methods for fabricating the same
01/15/2015US20150016173 ROM Chip Manufacturing Structures
01/15/2015US20150016064 Semiconductor device and manufacturing method therefor
01/15/2015US20150016011 Electrostatic Check with Multi-Zone Control
01/15/2015US20150016010 Carrier device and ceramic member
01/15/2015US20150015870 Overlay Abnormality Gating by Z Data
01/15/2015US20150015858 Lithographic apparatus and device manufacturing method
01/15/2015US20150015823 Liquid crystal panel and manufacturing method thereof
01/15/2015US20150015336 Cmos cascode power cells
01/15/2015US20150015335 Sense amplifier layout for finfet technology
01/15/2015US20150015013 Vacuum gripper
01/15/2015US20150014868 Thin film transistor array substrate, method of manufacturing the same, and display device
01/15/2015US20150014866 Semiconductor Device And Method For Producing A Glass-Like Layer
01/15/2015US20150014864 Semiconductor package and method of fabricating the same
01/15/2015US20150014863 Dam Structure for Enhancing Joint Yield in Bonding Processes
01/15/2015US20150014861 Embedded structures for package-on-package architecture
01/15/2015US20150014859 On-chip interconnects with reduced capacitance and method of fabrication thereof
01/15/2015US20150014856 Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
01/15/2015US20150014855 Microelectronic packages and methods for the fabrication thereof
01/15/2015US20150014854 Wafer level package solder barrier used as vacuum getter
01/15/2015US20150014853 Semiconductor devices comprising edge doped graphene and methods of making the same
01/15/2015US20150014851 Interconnect structure and method of fabricating same
01/15/2015US20150014849 Coreless package structure and method for manufacturing same
01/15/2015US20150014847 Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
01/15/2015US20150014844 Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
01/15/2015US20150014842 Semiconductor device and production method therefor
01/15/2015US20150014838 Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof
01/15/2015US20150014836 Electronic Module Assembly With Patterned Adhesive Array
01/15/2015US20150014831 Semiconductor device with corner tie bars
01/15/2015US20150014829 Copper Leadframe Finish for Copper Wire Bonding
01/15/2015US20150014827 Uv protection for lightly doped regions
01/15/2015US20150014824 Method for fabricating a semiconductor device
01/15/2015US20150014823 Compositions and methods for making silicon containing films
01/15/2015US20150014822 Method of testing a semiconductor on insulator structure and application of said test to the fabrication of such a structure
01/15/2015US20150014821 Film thickness metrology
01/15/2015US20150014820 Semiconductor device manufacturing method and support substrate-attached wafer
01/15/2015US20150014819 Underlying film composition for imprints and pattern forming method using the same
01/15/2015US20150014816 Doped semiconductor films and processing
01/15/2015US20150014813 Complex circuit element and capacitor utilizing cmos compatible antiferroelectric high-k materials
01/15/2015US20150014811 Antifuses and methods of forming antifuses and antifuse structures
01/15/2015US20150014809 Fin diode structure
01/15/2015US20150014808 Semiconductor structure and fabrication method thereof
01/15/2015US20150014807 Method of forming a shallow trench isolation structure
01/15/2015US20150014795 Surface passivation of substrate by mechanically damaging surface layer
01/15/2015US20150014787 Semiconductor device and method for manufacturing the same
01/15/2015US20150014778 Multiple via structure and method
01/15/2015US20150014776 Finfet integrated circuits and methods for their fabrication
01/15/2015US20150014774 Merged tapered finfet
01/15/2015US20150014772 Patterning fins and planar areas in silicon
01/15/2015US20150014767 Semiconductor device and method for forming the same
01/15/2015US20150014765 Radiation resistant cmos device and method for fabricating the same
01/15/2015US20150014764 Super junction mosfet, method of manufacturing the same, and complex semiconductor device
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