| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/21/2015 | CN104295497A 干泵安全停止装置及其使用方法以及干泵系统 Dry pump safety stop and methods of use as well as a dry pump system |
| 01/21/2015 | CN104290031A 切削装置 Cutting device |
| 01/21/2015 | CN104290030A 切削装置 Cutting device |
| 01/21/2015 | CN104289490A 一种芯片专用清洗治具 A chip for cleaning fixtures |
| 01/21/2015 | CN104289463A 旋转清洗装置 Rotating cleaning device |
| 01/21/2015 | CN103367234B 半导体结构的形成方法 The method of forming a semiconductor structure |
| 01/21/2015 | CN103354217B 晶圆上多个通孔的电沉积过程优化方法 A plurality of through holes electrodeposition process optimization method on the wafer |
| 01/21/2015 | CN103228827B 外延碳化硅单晶基板的制造方法 Manufacture of epitaxial SiC single crystal substrate |
| 01/21/2015 | CN103165522B 半导体结构及半导体结构的形成方法 The method of forming a semiconductor structure and semiconductor structure |
| 01/21/2015 | CN103107129B 一种微孔金属填充结构及方法 A microporous metal fill structures and methods |
| 01/21/2015 | CN103107125B 半导体器件及其形成方法 Semiconductor device and method for forming |
| 01/21/2015 | CN103094192B 半导体器件的形成方法 The method of forming a semiconductor device |
| 01/21/2015 | CN103094187B 硅通孔的形成方法 The method for forming silicon vias |
| 01/21/2015 | CN103076718B 感光性树脂组合物、感光性树脂层压体、抗蚀图案形成方法、以及印刷线路板、引线框、半导体封装体和凹凸基板的制造方法 The photosensitive resin composition, a photosensitive resin laminate, a resist pattern forming method and printed wiring board, lead frame, and a method of manufacturing a semiconductor package substrate irregularities |
| 01/21/2015 | CN103065994B 清洗硅片的装置及使用该装置清洗硅片的方法 Apparatus using the same apparatus cleaning method of cleaning silicon wafers |
| 01/21/2015 | CN103031526B 用于在硅衬底上形成钽沉积膜的反应腔及其应用 For tantalum deposited film formed on a silicon substrate the reaction chamber and its Application |
| 01/21/2015 | CN102994976B 多元衬底、基于多元衬底的层数连续可调的石墨烯、及其制备方法 Multiple substrate, based on multi-layer substrate continuously tunable graphene, its preparation method |
| 01/21/2015 | CN102986021B 制造隔离电容器的方法及其结构 Isolation capacitor and method of manufacturing the structure |
| 01/21/2015 | CN102938391B 一种铜互联线的制作工艺 The production process of a copper interconnect lines |
| 01/21/2015 | CN102938385B 化学药液分配装置 Chemical liquid dispensing device |
| 01/21/2015 | CN102903656B 一种光罩篮 One kind of mask basket |
| 01/21/2015 | CN102902165B 叠层虚拟掩模版的装置及集成硅光子集成芯片的方法 Apparatus and method for integrated silicon photonic integrated chip stack virtual reticle |
| 01/21/2015 | CN102891111B 双金属栅极晶体管的制造方法 The method of producing bimetallic gate transistor |
| 01/21/2015 | CN102891103B 一种制备顶层金属互联工艺刻蚀中间停止层的方法 The top layer of a metal interconnection process for preparing the intermediate etch stop layer method |
| 01/21/2015 | CN102890378B 一种阵列基板及其制造方法 An arrayed substrate and manufacturing method |
| 01/21/2015 | CN102856318B 单向瞬态电压抑制器 Unidirectional Transient Voltage Suppressors |
| 01/21/2015 | CN102856187B 一种太阳能电池片手动裂片装置 A solar cell sheet manual lobes device |
| 01/21/2015 | CN102842588B 背照式照明影像感测器及其制造方法 Back-illuminated image sensor and method for manufacturing lighting |
| 01/21/2015 | CN102832113B 导电接头的制造方法 Manufacturing method of a conductive joint |
| 01/21/2015 | CN102820297B 一种应变SiGe垂直回型沟道BiCMOS集成器件及制备方法 A vertical back-channel SiGe BiCMOS integrated device and method for preparing contingency |
| 01/21/2015 | CN102820243B 半导体晶圆制造装置 Semiconductor wafer fabrication equipment |
| 01/21/2015 | CN102810599B 一种多晶硅太阳能电池的磷扩散方法 Phosphorus diffusion method polycrystalline silicon solar cells |
| 01/21/2015 | CN102810489B 芯片封装系统、方法、注入装置及冲压与注入联动装置 Chip packaging systems, methods, apparatus, and injection stamping and injection linkage |
| 01/21/2015 | CN102800672B 一种应变SiGe HBT垂直沟道BiCMOS集成器件及制备方法 A vertical channel SiGe HBT BiCMOS integrated device and method for preparing contingency |
| 01/21/2015 | CN102800622B 介质层的形成方法 The method of forming a dielectric layer |
| 01/21/2015 | CN102800614B 半导体晶圆固定方法及半导体晶圆固定装置 Semiconductor wafer and semiconductor wafer fixation fixtures |
| 01/21/2015 | CN102800592B 晶体管及其形成方法 Transistor and method of forming |
| 01/21/2015 | CN102790032B 一种互连结构及其形成方法 An interconnect structure and method of forming |
| 01/21/2015 | CN102779849B 半导体器件和用于制造半导体器件的方法 A semiconductor device and a method for manufacturing a semiconductor device |
| 01/21/2015 | CN102779766B 基于电润湿原理提升导电焊料焊接电子封装强度的方法 Based on the principle of electrowetting to enhance the strength of the conductive solders in electronic packaging methods |
| 01/21/2015 | CN102760685B 铜互连线的刻蚀后处理方法 After etching the copper interconnect processing method |
| 01/21/2015 | CN102760676B 一种硅片装卸篮装置 Handling device silicon wafers basket |
| 01/21/2015 | CN102751206B 一种加固集成电路内引线键合力的方法 An integrated circuit wire bonding force reinforcement method |
| 01/21/2015 | CN102738063B 一种线路互联结构制法 A circuit interconnect system of law |
| 01/21/2015 | CN102738039B 测量装置以及等离子体处理装置 Measuring apparatus and a plasma processing apparatus |
| 01/21/2015 | CN102738006B 一种用于45纳米及以下技术节点的金属前介质集成工艺 Metal front media integration process for 45nm and below technology nodes |
| 01/21/2015 | CN102709246B 一种形成双应力刻蚀阻挡层的方法 A method of two stress etch stop layer is formed |
| 01/21/2015 | CN102709204B 一种led芯片的键合方法 One kind led chip bonding method |
| 01/21/2015 | CN102690605B 铜研磨用研磨剂和使用了其的研磨方法 Copper polishing abrasive and a polishing method using thereof |
| 01/21/2015 | CN102683209B 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof |
| 01/21/2015 | CN102667597B 有源矩阵基板和显示装置 Active matrix substrate and a display device |
| 01/21/2015 | CN102655166B 一种用于功率器件击穿保护的栅漏箝位和静电放电保护电路 A power device gate-drain breakdown protection clamp and electrostatic discharge protection circuit |
| 01/21/2015 | CN102651362B 串联型集成光电模块及其制造方法 Tandem type and method of manufacturing integrated photovoltaic modules |
| 01/21/2015 | CN102646717B 阵列基板和其制造方法以及显示装置 Array substrate and its manufacturing method, and a display device |
| 01/21/2015 | CN102646621B 深沟槽绝缘结构的制法 Deep trench isolation structure system of law |
| 01/21/2015 | CN102637614B 消除错误缺陷检测方法与系统 Eliminate errors defect detection method and system |
| 01/21/2015 | CN102630337B 检测晶圆、基底表面的等离子体处理期间的电弧事件的方法及设备 Detecting wafer, a method and apparatus of the plasma arc events during processing of the substrate surface |
| 01/21/2015 | CN102629611B 一种显示装置、阵列基板及其制作方法 A device array substrate and method of making the display |
| 01/21/2015 | CN102623330B 一种形成前金属介电质层的方法 A method of front metal dielectric layer is formed |
| 01/21/2015 | CN102610516B 一种提高光刻胶与金属/金属化合物表面之间粘附力的方法 An adhesive force between the photoresist and the metal / metal compound surface improving method |
| 01/21/2015 | CN102592936B 聚焦环和具有该聚焦环的基板处理装置 The substrate processing apparatus of the focus ring and focus ring has |
| 01/21/2015 | CN102585765B Cmp研磨剂以及衬底的研磨方法 Cmp abrasive grinding method and substrate |
| 01/21/2015 | CN102569037B 一种提高金属绝缘层金属电容层多次光刻重复性的方法 A reproducible method multiple lithographic metal insulation layer metal capacitance increase |
| 01/21/2015 | CN102566148B 液晶显示面板及其制造方法 A liquid crystal display panel and manufacturing method thereof |
| 01/21/2015 | CN102549759B 具有分级掺杂区的垂直结型场效应晶体管和二极管及其制造方法 The vertical junction field effect transistor and a diode and a manufacturing method having graded doped region |
| 01/21/2015 | CN102543882B 形成绝缘体上碳硅-锗硅异质结1t--dram结构的方法及形成结构 The formation of carbon and silicon-on-insulator - SiGe heterojunction 1t - method dram structure and formation structure |
| 01/21/2015 | CN102543829B 浅沟槽隔离和穿透基板通孔于集成电路设计之内的整合 Shallow trench isolation and penetrate the substrate through holes in the integrated circuit design of the integration of |
| 01/21/2015 | CN102498543B 图案化基底的方法 Patterned substrate method |
| 01/21/2015 | CN102468211B 浅沟槽隔离结构形成方法 The method of forming a shallow trench isolation structure |
| 01/21/2015 | CN102466931B 阵列基板及其制作方法、液晶显示面板 Array substrate and method of making the liquid crystal display panel |
| 01/21/2015 | CN102439693B 工作件处理系统 Work piece handling system |
| 01/21/2015 | CN102422228B 抗蚀剂剥离组合物和生产电气装置的方法 Resist stripping composition and method for the production of electrical equipment |
| 01/21/2015 | CN102368479B 快闪存储器及其制作方法 Flash memory and its manufacturing method |
| 01/21/2015 | CN102292792B 离子注入中的增强型低能离子束传输 Low energy ion beam transport enhanced ion implantation |
| 01/21/2015 | CN102290365B 基板保持装置、具备其之曝光装置及方法、元件制造方法 Substrate holding apparatus, which includes the exposure apparatus and method, device manufacturing method |
| 01/21/2015 | CN102257592B 具有减小的扫描场效应的离子注入 Having a reduced scanning field effect ion implantation |
| 01/21/2015 | CN102212798B 适应热膨胀的喷头装备 Accommodate thermal expansion of the nozzle equipment |
| 01/21/2015 | CN102169260B Tft-lcd像素电极层结构、制备方法及其掩膜板 Tft-lcd pixel electrode layer structure, preparation method and the mask |
| 01/21/2015 | CN102160177B 半导体装置的制造方法 The method of manufacturing a semiconductor device |
| 01/21/2015 | CN102148191B 接触孔形成方法 The method for forming a contact hole |
| 01/21/2015 | CN102148159B 自对准电荷平衡的功率双扩散金属氧化物半导体制备方法 Metal oxide semiconductor preparation charge balance of power self-aligned double diffusion |
| 01/21/2015 | CN102134709B 成膜装置 Film forming apparatus |
| 01/21/2015 | CN102034732B 吸附用构件、使用其的吸附装置及带电粒子线装置 Adsorption member, adsorption means and using its charged particle apparatus |
| 01/21/2015 | CN101996859B 疏水化处理装置、疏水化处理方法以及存储介质 Hydrophobic treatment apparatus, hydrophobized processing method and a storage medium |
| 01/21/2015 | CN101910431B 高纯度镧、包含高纯度镧的溅射靶以及以高纯度镧为主成分的金属栅膜 High-purity lanthanum, a sputtering target comprising high-purity lanthanum, and a high-purity lanthanum metal gate film mainly composed of |
| 01/21/2015 | CN101834190B 薄膜半导体装置、电光装置和电子设备 A thin film semiconductor device, an electro-optical device and electronic equipment |
| 01/20/2015 | US8938138 Optical semiconductor device and method of manufacturing optical semiconductor device |
| 01/20/2015 | US8938134 Hybrid optical modulator for photonic integrated circuit devices |
| 01/20/2015 | US8937800 Electrostatic chuck with advanced RF and temperature uniformity |
| 01/20/2015 | US8937770 Excimer laser apparatus projecting a beam with a selectively variable short-axis beam profile |
| 01/20/2015 | US8937714 Inspecting apparatus and inspecting method |
| 01/20/2015 | US8937704 Lithographic apparatus and device manufacturing method involving a resistivity sensor |
| 01/20/2015 | US8937505 Integrated circuit comprising a clock tree cell |
| 01/20/2015 | US8937486 Method for testing through-silicon-via |
| 01/20/2015 | US8937483 Semiconductor package transferring apparatus and method of manufacturing semiconductor device using the same |
| 01/20/2015 | US8937394 Compound barrier layer, method for forming the same and package structure using the same |
| 01/20/2015 | US8937393 Integrated circuit package system with device cavity |
| 01/20/2015 | US8937392 Semiconductor device |
| 01/20/2015 | US8937389 Semiconductor devices comprising GSG interconnect structures |
| 01/20/2015 | US8937387 Semiconductor device with conductive vias |