Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2015
01/22/2015US20150024549 Alignment of integrated circuit chip stack
01/22/2015US20150024547 EMI Package and Method for Making Same
01/22/2015US20150024546 System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack
01/22/2015US20150024542 Segmented thin film solar cells
01/22/2015US20150024523 A method for producing an rfid transponder by etching
01/22/2015US20150024521 Plasma processing apparatus and plasma processing method
01/22/2015US20150024520 Semiconductor device manufacturing method and manufacturing device
01/22/2015US20150024518 Method of forming a selectively adjustable gate structure
01/22/2015US20150024517 Plasma etcher chuck band
01/22/2015US20150024516 Electrostatic Phosphor Coating Systems and Methods for Light Emitting Structures and Packaged Light Emitting Diodes Including Phosphor Coating
01/22/2015US20150024515 Systems, methods, and apparatus for minimizing cross coupled wafer surface potentials
01/22/2015US20150023627 Method for producing semiconductor optical device and semiconductor optical device
01/22/2015US20150023385 Model based lamp background filtration of stray radiation for pyrometry
01/22/2015US20150022936 Electrostatic chuck for high temperature process applications
01/22/2015US20150022935 End effector for transferring a substrate
01/22/2015US20150022821 Carrier adapter insert apparatus and carrier adapter insert detection methods
01/22/2015US20150022794 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
01/22/2015US20150022262 Complete system-on-chip (soc) using monolithic three dimensional (3d) integrated circuit (ic) (3dic) technology
01/22/2015US20150022227 Integrated high-speed probe system
01/22/2015US20150021793 Semiconductor structures and methods of manufacture
01/22/2015US20150021789 Hybrid bonding with through substrate via (tsv)
01/22/2015US20150021785 Hybrid bonding with through substrate via (tsv)
01/22/2015US20150021784 Front-to-back bonding with through-substrate via (tsv)
01/22/2015US20150021782 Design method of wiring layout, semiconductor device, program for supporting design of wiring layout, and method for manufacturing semiconductor device
01/22/2015US20150021781 Semiconductor device and method of manufacturing semiconductor device
01/22/2015US20150021779 Hard mask for back-end-of-line (beol) interconnect structure
01/22/2015US20150021775 Method for manufacturing semiconductor device, semiconductor device, and apparatus for producing semiconductor
01/22/2015US20150021773 Through Semiconductor via Structure with Reduced Stress Proximity Effect
01/22/2015US20150021772 Mixed-metal barrier films optimized by high-productivity combinatorial PVD
01/22/2015US20150021771 Mechanisms for forming three-dimensional integrated circuit (3dic) stacking structure
01/22/2015US20150021770 Back-end-of-line (beol) interconnect structure
01/22/2015US20150021764 Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
01/22/2015US20150021763 Epoxy resin composition and semiconductor apparatus prepared using the same
01/22/2015US20150021757 Systems and Methods for Reducing Contact Resistivity of Semiconductor Devices
01/22/2015US20150021754 Semiconductor Device and Method of Forming Thermal Lid for Balancing Warpage and Thermal Management
01/22/2015US20150021750 Semiconductor device and method for manufacturing the same
01/22/2015US20150021749 Semiconductor device and manufacturing method thereof
01/22/2015US20150021746 Backscattering for localized annealing
01/22/2015US20150021745 Reactive ion etching
01/22/2015US20150021744 Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same
01/22/2015US20150021743 Uniform roughness on backside of a wafer
01/22/2015US20150021742 Methods of Forming Junction Termination Extension Edge Terminations for High Power Semiconductor Devices and Related Semiconductor Devices
01/22/2015US20150021741 Bonded Semiconductor Structures
01/22/2015US20150021735 Semiconductor device and method of manufacturing the same
01/22/2015US20150021734 Semiconductor device, a micro-electro-mechanical resonator and a method for manufacturing a semiconductor device
01/22/2015US20150021733 Semiconductor wafer, semiconductor ic chip and manufacturing method of the same
01/22/2015US20150021722 MEMS Device
01/22/2015US20150021716 Low power micro semiconductor gas sensor and method of manufacturing the same
01/22/2015US20150021714 Integrated circuits having a metal gate structure and methods for fabricating the same
01/22/2015US20150021713 Guard ring structure of semiconductor arrangement
01/22/2015US20150021709 Structures and methods integrating different fin device architectures
01/22/2015US20150021704 Finfet work function metal formation
01/22/2015US20150021702 Shallow trench isolation
01/22/2015US20150021700 Shallow trench isolation structure and method of forming the same
01/22/2015US20150021699 FIN Field Effect Transistors Having Multiple Threshold Voltages
01/22/2015US20150021698 Intrinsic Channel Planar Field Effect Transistors Having Multiple Threshold Voltages
01/22/2015US20150021697 Thermally Tuning Strain in Semiconductor Devices
01/22/2015US20150021696 MOS Devices Having Epitaxy Regions with Reduced Facets
01/22/2015US20150021695 Epitaxial block layer for a fin field effect transistor device
01/22/2015US20150021694 Integrated circuits having replacement metal gates with improved threshold voltage performance and methods for fabricating the same
01/22/2015US20150021693 Enhancing transistor performance and reliability by incorporating deuterium into a strained capping layer
01/22/2015US20150021692 Method of localized modification of the stresses in a substrate of the soi type, in particular fd soi type, and corresponding device
01/22/2015US20150021690 Fin transformation process and isolation structures facilitating different fin isolation schemes
01/22/2015US20150021688 MOS Devices with Non-Uniform P-type Impurity Profile
01/22/2015US20150021687 Semiconductor structure and method of forming the semiconductor structure with deep trench isolation structures
01/22/2015US20150021681 Semiconductor device having metal gate and manufacturing method thereof
01/22/2015US20150021667 High Electron Mobility Transistor and Method of Forming the Same
01/22/2015US20150021624 Lift-off of epitaxial layers from silicon carbide or compound semiconductor substrates
01/22/2015US20150021612 Array substrate, display device and manufacturing method of array substrate
01/22/2015US20150021609 Semiconductor apparatus with multiple tiers, and methods
01/22/2015US20150021607 Thin film transistor substrate, method of manufacturing the same, and organic light emitting diode display using the same
01/22/2015US20150021599 Barrier materials for display devices
01/22/2015US20150021554 Direct formation of graphene on semiconductor substrates
01/22/2015US20150021551 Methods for coating semiconductor nanocrystals
01/22/2015US20150021466 Micro pick up array alignment encoder
01/22/2015US20150021230 Port Door Positioning Apparatus and Associated Methods
01/22/2015US20150020973 Plasma etching apparatus
01/22/2015US20150020972 Process condition sensing device and method for plasma chamber
01/22/2015US20150020970 Plasma processing method and apparatus
01/22/2015US20150020968 Substrate processing apparatus and substrate processing method
01/22/2015US20150020863 Segmented thin film solar cells
01/22/2015US20150020853 Cleaning apparatus
01/22/2015US20150020851 Substrate cleaning device, substrate cleaning apparatus, cleaned substrate manufacturing method and substrate processing apparatus
01/22/2015US20150020848 Systems and Methods for In-Situ Wafer Edge and Backside Plasma Cleaning
01/22/2015US20150020736 Substrate support ring for more uniform layer thickness
01/22/2015US20150020670 Cutting apparatus
01/22/2015US20150020590 Optomechanical accelerometer
01/22/2015DE112013002390T5 Harzgekapselte Halbleitervorrichtung und Verfahren zu ihrer Herstellung Resin-encapsulated semiconductor device and process for their preparation
01/22/2015DE112013002368T5 Glaszusammensetzung zum schutz eines halbleiterübergangs, verfahren zur herstellung einer halbleitervorrichtung und halbleitervorrichtung Glass composition for protecting a semiconductor junction, process to manufacture a semiconductor device and semiconductor device
01/22/2015DE112010003451B4 Selektives Züchten einer einzelnen Nanoröhre innerhalb eines Durchgangskontaktes unter Verwendung eines lonenstrahls Selective breeding of a single nanotube within a passage contact using an ion beam
01/22/2015DE112010002919B4 Modulare dreidimensionale Kondensatormatrix Modular three-dimensional capacitor array
01/22/2015DE112007001243B4 Verfahren zum Trockenätzen einer Zwischenisolierschicht A method of dry-etching a interlayer
01/22/2015DE112007000215B4 Verfahren zur Herstellen einer Halbleitervorrichtung mit porösem Silizium-Dielektrikum A method of manufacturing a semiconductor device having porous silicon dielectric
01/22/2015DE10301091B4 Leistungs-Halbleiterbauelement und Verfahren zur Verbindung von einem gemeinsamen Substratträger zugeordneten Halbleitereinrichtungen Power semiconductor device and process for connecting a common substrate carrier associated semiconductor devices
01/22/2015DE102014214111A1 Reinigungsvorrichtung Cleaning device
01/22/2015DE102014214037A1 Schneidvorrichtung Cutter
01/22/2015DE102014211026A1 Verfahren zum Bilden von Austauschfins für eine FinFET-Halbleitervorrichtung unter Durchführung eines Austauschaufwachsprozesses A method of forming Austauschfins for a FinFET semiconductor device by performing a Austauschaufwachsprozesses
01/22/2015DE102014110275A1 Verfahren zum ätzen eines werkstücks, zum ätzen eines werkstücks ausgelegte vorrichtung und nicht-transitorisches computerlesbares medium A method of etching a workpiece, for etching a workpiece designed apparatus and non-transitory computer-readable medium
01/22/2015DE102014110266A1 Verfahren zum herstellen von halbleiterbauelementen A process for the manufacture of semiconductor devices
01/22/2015DE102014109870A1 Elektronische Vorrichtung und Verfahren zum Herstellen einer elektronischen Vorrichtung An electronic device and method for manufacturing an electronic device
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