| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/22/2015 | DE102014109571A1 Verfahren zum packaging integrierter schaltungen und ein geformtes substrat mit in eine formmasse eingebetteten nicht funtionalen platzhaltern A method for packaging integrated circuits and a molded substrate with not a molding material embedded space holders funtionalen |
| 01/22/2015 | DE102014109230A1 Infrarot-dämpfende oder blockierende Schicht in optischem Nähesensor Infrared-absorbing or blocking layer in optical proximity sensor |
| 01/22/2015 | DE102013216035B3 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module |
| 01/22/2015 | DE102013214235A1 Leuchtvorrichtung mit Halbleiterlichtquellen und umlaufendem Damm Lighting device with semiconductor light sources and circulating dam |
| 01/22/2015 | DE102013108385B3 Herstellverfahren und Halbleitervorrichtung mit thermischem Einstellen von Verspannungen Production method and the semiconductor device with thermal setting tension |
| 01/22/2015 | DE102013011873A1 Positioniervorrichtung zum Bewegen eines Substrats Positioning means for moving a substrate |
| 01/22/2015 | DE102012218580B4 Kohlenstoffimplantation zur Anpassung der Austrittsarbeit bei einem Ersatzgate-Transistor Carbon implantation to adapt the work function for a replacement gate transistor |
| 01/22/2015 | DE102009021744B4 Verfahren zum Herstellen einer Speicherzellen-Anordnung A method for fabricating a memory cell arrangement |
| 01/22/2015 | DE102007012155B4 Formkörper und Nutzen mit Halbleiterchips und Verfahren zur Herstellung des Nutzens Shaped body and benefits with semiconductor chips and processes for making the benefits |
| 01/22/2015 | DE102006025364B4 Verfahren zum Vergrößern des Transistordurchlassstromes durch Vertiefen eines Isolationsgrabens A method for increasing transistor drive current through an isolation trench depth |
| 01/22/2015 | DE102006019644B4 Übertragungseinrichung mit einem Kardangelenkmechanismus und Übertragungsverfahren unter Verwendung der Übertragungseinrichtung Übertragungseinrichung with a universal joint mechanism and transmission method using the transmission device |
| 01/21/2015 | EP2827374A1 Modular approach for reducing flicker noise of MOSFETs |
| 01/21/2015 | EP2827363A1 Etching solution composition and etching method |
| 01/21/2015 | EP2827362A1 Vacuum suction stage, semiconductor wafer dicing method, and semiconductor wafer annealing method |
| 01/21/2015 | EP2827361A1 Mold, resist laminate and manufacturing process therefor, and microrelief structure |
| 01/21/2015 | EP2827341A1 Conductive paste and die bonding method |
| 01/21/2015 | EP2826893A1 Composite substrate used for gan growth |
| 01/21/2015 | EP2826892A1 Method for preparing composite substrate for gan growth |
| 01/21/2015 | EP2826827A1 CMP composition comprising abrasive particles containing ceria |
| 01/21/2015 | EP2826826A1 Composition for forming a coating type BPSG film, substrate formed a film by said composition, and patterning process using said composition |
| 01/21/2015 | EP2826818A1 Sealant paste and sealing method |
| 01/21/2015 | EP2826066A1 Semiconductor devices with close-packed via structures having in-plane routing and method of making same |
| 01/21/2015 | EP2826065A1 Method and apparatus for temporary bonding of ultra thin wafers |
| 01/21/2015 | EP2826064A1 Pressure transmitting device for bonding chips onto a substrate |
| 01/21/2015 | EP2826063A1 Method and system for determining one or more optical characteristics of structure of a semiconductor wafer |
| 01/21/2015 | EP2826062A1 Methods for the selective removal of ashed spin-on glass |
| 01/21/2015 | EP2826061A1 Semiconductor constructions and methods of planarizing across a plurality of electrically conductive posts |
| 01/21/2015 | EP2826060A1 Imprint apparatus, mold, imprint method, and method of manufacturing article |
| 01/21/2015 | EP2826059A1 Imprint method, imprint apparatus, and article manufacturing method |
| 01/21/2015 | EP2825913A1 Photoresist stripping and cleaning composition, method of its preparation and its use |
| 01/21/2015 | EP2825609A1 Cmp compositions selective for oxide and nitride with high removal rate and low defectivity |
| 01/21/2015 | CN204118111U 一种LED芯片的Al2O3/SiON钝化层结构 An LED chip Al2O3 / SiON passivation layer structure |
| 01/21/2015 | CN204118103U 一种rena湿法设备的传动装置 One kind of wet gear rena equipment |
| 01/21/2015 | CN204118100U 一种等离子体刻蚀硅片夹具 A plasma etching of silicon fixtures |
| 01/21/2015 | CN204118078U 一种GaN基异质结肖特基二极管器件 One kind of GaN-based heterostructure Schottky diode device |
| 01/21/2015 | CN204118056U 一种晶圆保护膜及其涂刷装置 One kind of protective film and brushing device wafer |
| 01/21/2015 | CN204118053U 基于lcp基板的封装外壳 Based on the package substrate shell lcp |
| 01/21/2015 | CN204118052U 蓝宝石衬底摆放架 Sapphire display rack |
| 01/21/2015 | CN204118051U 一种用于传感器封装键合的夹具 A fixture for the sensor package bond |
| 01/21/2015 | CN204118050U 膜体与集成电路分离装置 Membrane separation devices and integrated circuits |
| 01/21/2015 | CN204118049U 单面减薄机用多位吸盘同轴旋转真空分配器 Many-sided thinning machine coaxial rotary vacuum sucker distributor |
| 01/21/2015 | CN204118048U 一种网带烧结炉输送网带 A screen with a sintering furnace conveyor belt |
| 01/21/2015 | CN204118047U 一种气体喷淋装置 A gas spray device |
| 01/21/2015 | CN204118046U 一种新型上蜡机加热装置 A new waxing machine heating device |
| 01/21/2015 | CN204118045U 一种新型贴蜡装置 A new type of paste wax device |
| 01/21/2015 | CN204118044U 一种晶粒清洁装置 One kind of grain cleaning device |
| 01/21/2015 | CN204118043U 一种多芯片模块植入头和智能卡封装生产线 A multi-chip module implanted in head and smart card packaging production line |
| 01/21/2015 | CN204118042U 一种多芯片模块热焊平台和智能卡封装生产线 A multi-chip module thermal welding platform and smart card packaging production line |
| 01/21/2015 | CN204118041U 一种碎硅片清洗设备 One kind of broken wafer cleaning equipment |
| 01/21/2015 | CN204118040U 一种去磷硅玻璃清洗机 One kind of washing machine to PSG |
| 01/21/2015 | CN204118039U 一种led稳态测试装置 Steady test device led |
| 01/21/2015 | CN204118038U 大功率晶体管粘片机 Power Transistor Die Bonder |
| 01/21/2015 | CN204118037U 一种半导体存储器制作模具 A semiconductor memory production molds |
| 01/21/2015 | CN204118036U 蓝宝石衬底抛光装置 Sapphire substrate polishing apparatus |
| 01/21/2015 | CN204108764U 用于提高手动自动一体化单面减薄机加工精度的装置 Used to improve the manual and automatic integration of single precision machining device thinning |
| 01/21/2015 | CN204108535U 一种桥式整流二极管用石墨模具 A bridge-type rectifier diode with a graphite mold |
| 01/21/2015 | CN1966762B 汽化器、使用汽化器的各种装置以及汽化方法 Vaporizer, vaporizer using various apparatus and method of vaporization |
| 01/21/2015 | CN104303319A 用于防止半导体层堆叠、薄衬底cpv电池和太阳能电池组件中电短路的方法 For preventing the semiconductor layer stack, thin substrate cpv cells and solar cell modules in an electrical short Method |
| 01/21/2015 | CN104303314A 具有结终端扩展的半导体器件 Having a junction termination extension of the semiconductor device |
| 01/21/2015 | CN104303313A 纳米器件及其制作方法 Nano-devices and manufacturing method thereof |
| 01/21/2015 | CN104303312A 立式耐高压半导体装置及其制造方法 Vertical high-voltage semiconductor device and manufacturing method |
| 01/21/2015 | CN104303311A 纵型高耐压半导体装置及纵型高耐压半导体装置的制造方法 The method of manufacturing a vertical high-voltage semiconductor device and a vertical high-voltage semiconductor device |
| 01/21/2015 | CN104303307A 半导体装置 Semiconductor device |
| 01/21/2015 | CN104303301A 切换装置结构及方法 Switching apparatus structure and method |
| 01/21/2015 | CN104303300A 非易失性电阻存储单元 Non-volatile resistive memory cell |
| 01/21/2015 | CN104303288A 指纹传感器封装件及其制造方法 Fingerprint sensor package and method for manufacturing |
| 01/21/2015 | CN104303286A 具有局限细丝形成的电阻性存储器 Limitations filaments formed having resistive memory |
| 01/21/2015 | CN104303285A 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device |
| 01/21/2015 | CN104303284A 冷却机构和处理系统 Cooling mechanism and processing systems |
| 01/21/2015 | CN104303283A 半导体晶片制造系统中向stb提供不活泼气体的方法和使用该方法的半导体晶片制造系统 The semiconductor wafer fabrication system to provide an inert gas and a method using the method to a semiconductor wafer fabrication system stb |
| 01/21/2015 | CN104303282A 工作台装置及输送装置 Table arrangement and delivery device |
| 01/21/2015 | CN104303281A 用于将芯片接合到衬底的压力传递设备 Pressure for the die-bonding to the substrate transfer apparatus |
| 01/21/2015 | CN104303280A 半导体基板的评价方法、评价用半导体基板、半导体装置 Evaluation method of a semiconductor substrate, a semiconductor substrate for evaluation, the semiconductor device |
| 01/21/2015 | CN104303279A 离心分离器 Centrifugal separator |
| 01/21/2015 | CN104303278A 接合辅助剂及其制造方法 Engaging adjuvants and manufacturing method thereof |
| 01/21/2015 | CN104303277A 覆晶黏晶机以及黏晶平台的平坦度与变形量补正方法 Flip-chip crystal machine and flatness sticky sticky and deformation of the crystal platform correction method |
| 01/21/2015 | CN104303276A 防止相邻器件的短路 Prevent shorting between adjacent devices |
| 01/21/2015 | CN104303275A 在脉冲激光退火中使用红外干涉技术的熔化深度测定 Melt depth was measured using infrared pulsed laser annealing interference technology |
| 01/21/2015 | CN104303274A 等离子体蚀刻方法及等离子体处理装置 The plasma etching method and a plasma processing apparatus |
| 01/21/2015 | CN104303273A 蚀刻方法和等离子体处理装置 Etching method and a plasma processing apparatus |
| 01/21/2015 | CN104303272A 用于抛光模组的预化学机械平坦化的方法与设备 Chemical mechanical polishing module for pre-flattening method and apparatus |
| 01/21/2015 | CN104303271A 切割片 Cutting tablets |
| 01/21/2015 | CN104303270A 切割刀 Cleaver |
| 01/21/2015 | CN104303269A 碳化硅半导体装置的制造方法 The method of manufacturing a silicon carbide semiconductor device |
| 01/21/2015 | CN104303268A 外延基板、半导体装置及半导体装置的制造方法 The method of manufacturing an epitaxial substrate, a semiconductor device and a semiconductor device |
| 01/21/2015 | CN104303267A 用包含金属纳米粒子和纳米线的油墨形成导电图案 Forming a conductive pattern using an ink containing metal nanoparticles and nanowires |
| 01/21/2015 | CN104303266A Na添加光吸收层用合金及其制造方法以及太阳能电池 Na add light absorbing layer alloy and its manufacturing method and a solar cell |
| 01/21/2015 | CN104303265A 形成层的方法 The method of forming a layer |
| 01/21/2015 | CN104303264A 用于半导体装置的自动化检验的配方产生的方法、计算机系统及设备 The method of formulation for automated inspection of semiconductor device produced, computer systems and equipment |
| 01/21/2015 | CN104303263A 具有线形翅片场效应结构的电路 With a fin field-effect linear circuit structure |
| 01/21/2015 | CN104303262A 用于其中一部分暴露在环境下的密封mems设备的工艺 Wherein a portion exposed to the process environment of the apparatus for sealing mems |
| 01/21/2015 | CN104303221A 有源矩阵基板的制造方法和显示装置的制造方法 A manufacturing method of an active matrix substrate and a display device |
| 01/21/2015 | CN104303110A 切断机构、接合机构、基板处理系统、基板处理装置及基板处理方法 Cutting mechanism, the engagement mechanism, the substrate processing system, the substrate processing apparatus and a substrate processing method |
| 01/21/2015 | CN104303107A 用于形成抗蚀剂下层膜的组合物 The composition for forming a resist underlayer film of |
| 01/21/2015 | CN104303048A 使用反射及透射图来检测光罩劣化 Use reflective and transmissive mask map to detect deterioration |
| 01/21/2015 | CN104302962A 流体运送系统和方法 A fluid delivery system and method |
| 01/21/2015 | CN104302816A 具有可调节属性的纳米线的高吞吐量连续气相合成 High throughput continuous gas phase synthesis with an adjustable attributes nanowires |
| 01/21/2015 | CN104302723A 带有凸块电极的半导体器件制造用粘合剂片材及半导体器件的制造方法 The semiconductor device having a bump electrode for producing an adhesive sheet and a method of manufacturing a semiconductor device |
| 01/21/2015 | CN104302562A 搬运系统以及搬运系统中的物品的临时保管方法 Transport systems and handling systems for temporary storage method articles |
| 01/21/2015 | CN104300044A 高倍聚光太阳能电池基板单边取放固定底座 High power concentrator solar cell substrate handling unilateral fixed base |