Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/18/2013CN103311289A High electron mobility transistor and method of manufacturing the same
09/18/2013CN103311286A Semiconductor device and manufacturing method thereof
09/18/2013CN103311285A Electron blocking layers for electronic devices
09/18/2013CN103311284A Semiconductor device and production method thereof
09/18/2013CN103311282A Semiconductor device and manufacturing method thereof
09/18/2013CN103311281A Semiconductor device and manufacturing method thereof
09/18/2013CN103311280A Semiconductor device and manufacturing method thereof
09/18/2013CN103311279A Semiconductor device and method for manufacturing the semiconductor device
09/18/2013CN103311278A Fast recovery diode and method for manufacturing fast recovery diode
09/18/2013CN103311277A Semiconductor structure and preparation method thereof
09/18/2013CN103311276A Self-aligned graphene field effect transistor and manufacturing method thereof
09/18/2013CN103311275A Semiconductor device and method for manufacturing semiconductor device
09/18/2013CN103311274A Semiconductor device with non-aligned super junction structure and manufacturing method thereof
09/18/2013CN103311272A Lateral mosfet with dielectric isolation trench
09/18/2013CN103311270A Reverse-conducting IGBT semiconductor device and production method thereof
09/18/2013CN103311265A Organic light-emitting diode display panel and production method thereof
09/18/2013CN103311262A Micro thermoelectric device, production method thereof and temperature difference generator with same
09/18/2013CN103311253A Thin film transistor array substrate and manufacturing method thereof and liquid crystal display device
09/18/2013CN103311251A Semiconductor device and method of manufacturing the same
09/18/2013CN103311249A Semiconductor device having junctionless vertical gate transistor and method of manufacturing the same
09/18/2013CN103311248A Non-volatile memory including multilayer memory cells and method of fabricating the same?
09/18/2013CN103311247A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/18/2013CN103311246A Semiconductor device and method for producing the same
09/18/2013CN103311245A Reverse conducting IGBT (insulated gate bipolar transistor) chip and method for manufacturing same
09/18/2013CN103311244A Semiconductor device and method for fabricating the same?
09/18/2013CN103311243A Plasma protection diode for a hemt device
09/18/2013CN103311241A Integrated structure of double polycrystal capacitor and MOS (Metal Oxide Semiconductor) tube and manufacturing method of integrated structure
09/18/2013CN103311240A Overvoltage protection device for compound semiconductor field effect transistors
09/18/2013CN103311239A Cross-domain ESD protection scheme
09/18/2013CN103311237A FinFET-Based ESD Devices and Methods for Forming the Same
09/18/2013CN103311231A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/18/2013CN103311230A Chip stack structure and method for fabricating the same
09/18/2013CN103311226A Semiconductor device and manufacturing method thereof
09/18/2013CN103311225A Semiconductor package and fabrication method thereof
09/18/2013CN103311224A Contact test structure and method
09/18/2013CN103311223A Nickel and gold electroplating product of wafer and method for manufacturing nickel and gold electroplating product
09/18/2013CN103311222A Semiconductor packages and methods of formation thereof
09/18/2013CN103311220A Circuit repair structure and method
09/18/2013CN103311219A Inductor for post passivation interconnect
09/18/2013CN103311218A Structure and method for a fishbone differential capacitor
09/18/2013CN103311217A 3D transmission lines for semiconductors
09/18/2013CN103311216A Novel high-density multilayer circuit chip flip encapsulation structure and manufacturing method
09/18/2013CN103311213A Semiconductor packaging member integrating shielding film and antenna
09/18/2013CN103311205A Encapsulating piece for preventing chip salient point from being short-circuited and manufacturing process thereof
09/18/2013CN103311204A Flip-chip packaging techniques and configurations
09/18/2013CN103311203A 半导体装置及其制造方法 Semiconductor device and manufacturing method
09/18/2013CN103311201A Semiconductor structure and manufacturing method thereof
09/18/2013CN103311198A Through-silicon via and fabrication method thereof
09/18/2013CN103311193A Semiconductor power module package structure and preparation method thereof
09/18/2013CN103311192A Thin-gap POP (Package on Package) type packaging structure and packaging method
09/18/2013CN103311190A Mini-projector chip package structure and package method thereof
09/18/2013CN103311188A Method of fabricating erasable programmable single-ploy nonvolatile memory
09/18/2013CN103311187A Method for making tunneling oxidation layer of NOR flash memory
09/18/2013CN103311186A Semiconductor device, printing apparatus, and manufacturing method thereof
09/18/2013CN103311185A Method of hybrid high-k/metal-gate stack fabrication
09/18/2013CN103311184A Transistor formation method and CMOS formation method
09/18/2013CN103311183A Panel of flat-panel display and cutting method of panel
09/18/2013CN103311182A Method of fabricating array substrate for in-plane switching mode liquid crystal display device
09/18/2013CN103311181A Method for improving mismatch parameter of metal layer-insulating dielectric layer-metal layer
09/18/2013CN103311180A Chip layout method for improving performance of MMIC (Microwave Monolithic Integrated Circuit) power amplifier
09/18/2013CN103311179A Copper interconnection structure manufacturing method and semiconductor structure
09/18/2013CN103311178A Methods of forming copper-based conductive structures on an integrated circuit device
09/18/2013CN103311177A Integrated optoelectronic interconnect with side-mounted transducers
09/18/2013CN103311176A Manufacturing method for metal connected wire and manufacturing method for semiconductor structure
09/18/2013CN103311175A Method for etching polycrystalline silicon fuse wire
09/18/2013CN103311174A Method for manufacturing copper interconnection structure
09/18/2013CN103311173A Method for preparing double-depth shallow trench isolation groove
09/18/2013CN103311172A SOI (Silicon On Insulator) substrate formation method
09/18/2013CN103311171A Multi-sucker chip fixing device
09/18/2013CN103311170A Method of fabricating a semiconductor device and semiconductor production apparatus
09/18/2013CN103311169A Panel bearing mechanism with gate closing function
09/18/2013CN103311168A Method and apparatus for wafer alignment
09/18/2013CN103311167A Automatic silicon wafer feeding system
09/18/2013CN103311166A Substrate processing apparatus
09/18/2013CN103311165A Non-destructive feeding device for semiconductor lead frame
09/18/2013CN103311164A Substrate carrier and selenization process system thereof
09/18/2013CN103311163A Inverted valve for semiconductor storage device
09/18/2013CN103311162A Grain picking machine
09/18/2013CN103311161A Modified flexible substrate packaging device
09/18/2013CN103311160A Semiconductor element arrangement jig and operation method thereof
09/18/2013CN103311159A Stripping device for integrated circuit (IC) chip
09/18/2013CN103311158A Process processing member, substrate processing apparatus and substrate processing method
09/18/2013CN103311157A Apparatus for mounting a transducer in a wire bonder
09/18/2013CN103311156A Liquid processing apparatus
09/18/2013CN103311155A Liquid processing apparatus
09/18/2013CN103311154A Heater block and heat treatment apparatus having the same
09/18/2013CN103311153A Substrate treating apparatus and substrate treating method
09/18/2013CN103311152A Cooling method for component in chamber
09/18/2013CN103311151A Method for fabricating a semiconductor device and semiconductor production apparatus
09/18/2013CN103311150A Semiconductor manufacturing device and control method of same
09/18/2013CN103311149A Valve purge assembly for semiconductor manufacturing tools
09/18/2013CN103311148A Defect detection and observation method
09/18/2013CN103311147A Apparatus for evaluating semiconductor crystallinity and method for evaluating semiconductor crystallinity
09/18/2013CN103311146A Defect inspection method
09/18/2013CN103311145A Systems and methods of controlling semiconductor wafer fabrication processes
09/18/2013CN103311144A Method for manufacturing electron beam alignment mark based on tungsten metal
09/18/2013CN103311143A Chip package testing device and lead frame used thereby
09/18/2013CN103311142A Packaging structure and packaging technology thereof
09/18/2013CN103311141A Manufacturing method of coaxial vertical interconnection conductor
09/18/2013CN103311140A Lead welding disc leading-out method for wafer level packaging