Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/26/2013WO2013140746A1 Semiconductor device
09/26/2013WO2013140745A1 Semiconductor device and production method for same
09/26/2013WO2013140677A1 Manganese oxide thin film and oxide laminate
09/26/2013WO2013140621A1 Semiconductor device and method for manufacturing same
09/26/2013WO2013140499A1 Exposure head and exposure device
09/26/2013WO2013140473A1 Semiconductor element
09/26/2013WO2013140302A1 Method, computer system and apparatus for recipe generation for automated inspection semiconductor devices
09/26/2013WO2013140223A1 Improved method of implantation for fragilization of substrates
09/26/2013WO2013140122A1 Forming silicon dioxide on silicon carbide
09/26/2013WO2013140094A1 Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone
09/26/2013WO2013139888A1 Method for producing iii-n templates and the reprocessing thereof and iii-n template
09/26/2013WO2013139887A1 Method for producing iii-n single crystals, and iii-n single crystal
09/26/2013WO2013139663A2 Method for producing a semiconductor wafer doped differently on both sides
09/26/2013WO2013139366A1 Pressure transfer plate for pressure transfer of a bonding pressure
09/26/2013WO2013139164A1 Soi-based longitudinal sige bipolar transistor and manufacturing method thereof
09/26/2013WO2013139158A1 Thin film transistor array substrate, method of manufacturing same and display device
09/26/2013WO2013139154A1 Integrated fabrication method for locos multilayer oxide layer
09/26/2013WO2013139148A1 Array substrate and manufacturing method thereof, and display device
09/26/2013WO2013139135A1 Array substrate, manufacturing method therefor and display device
09/26/2013WO2013139128A1 Top-gate-type n-tft, array base plate, manufacturing method thereof and display device
09/26/2013WO2013139120A1 Oxide thin film transistor and manufacturing method, array substrate and display device
09/26/2013WO2013139064A1 Semiconductor structure and manufacturing method therefor
09/26/2013WO2013139063A1 Semiconductor structure and manufacturing method therefor
09/26/2013WO2013139054A1 Thin film transistor with parasitic capacitance correction structure and liquid crystal display using same
09/26/2013WO2013139047A1 Method for cleaning tft-lcd glass substrate
09/26/2013WO2013139045A1 Thin film transistor array substrate and manufacturing method thereof
09/26/2013WO2013138952A1 Cmos device and manufacturing method thereof
09/26/2013WO2013106285A3 Structures formed using monocrystalline silicon and/or other materials for optical and other applications
09/26/2013WO2013085839A3 Semiconductor modules and methods of forming the same
09/26/2013WO2013070978A4 Substrate processing system and method
09/26/2013US20130253690 Method of manufacturing semiconductor device
09/26/2013US20130253689 Substrate processing apparatus, maintenance method, and maintenance program
09/26/2013US20130253688 Multi charged particle beam writing apparatus and multi charged particle beam writing method
09/26/2013US20130252440 Pretreatment and improved dielectric coverage
09/26/2013US20130252439 Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-Transitory Computer-Readable Recording Medium
09/26/2013US20130252438 Method for the deposition of a ruthenium-containing film
09/26/2013US20130252437 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
09/26/2013US20130252436 Dielectric thin film, method of manufacturing same, and applications thereof
09/26/2013US20130252435 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording medium
09/26/2013US20130252434 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
09/26/2013US20130252433 Semiconductor device manufacturing method, substrate processing apparatus, and non-transitory recording medium
09/26/2013US20130252432 Patterning method
09/26/2013US20130252431 Method of Forming Trench in Semiconductor Substrate
09/26/2013US20130252430 Method for reducing damage to low-k gate spacer during etching
09/26/2013US20130252429 Mask and method for fabricating semiconductor device
09/26/2013US20130252428 Photo-etching and Exposing System
09/26/2013US20130252427 Method for cleaning textured silicon wafers
09/26/2013US20130252426 Polishing agent and method for polishing substrate using the polishing agent
09/26/2013US20130252425 Method of forming a semiconductor device
09/26/2013US20130252424 Wafer holder with tapered region
09/26/2013US20130252423 Method for manufacturing a semiconductor device and semiconductor device
09/26/2013US20130252422 Methods of forming semiconductor structures
09/26/2013US20130252421 Method of processing silicon and glass substrates using a laser peeling technique
09/26/2013US20130252420 Method for forming fine pitch structures
09/26/2013US20130252419 Metal Alloy Cap Integration
09/26/2013US20130252418 Electromigration-resistant lead-free solder interconnect structures
09/26/2013US20130252417 Thin film forming method
09/26/2013US20130252416 Method of manufacturing a semiconductor integrated circuit device
09/26/2013US20130252415 Structure and process for metallization in high aspect ratio features
09/26/2013US20130252414 System, method, and computer program product for affixing a post to a substrate pad
09/26/2013US20130252412 Process for producing an integrated circuit
09/26/2013US20130252411 Manufacturing method of a semiconductor device
09/26/2013US20130252410 Selective low-temperature ohmic contact formation method for group iii-nitride heterojunction structured device
09/26/2013US20130252408 Method for fabricating schottky device
09/26/2013US20130252407 Silicon polymers, methods of polymerizing silicon compounds, and methods of forming thin films from such silicon polymers
09/26/2013US20130252406 Techniques for drying and annealing thermoelectric powders
09/26/2013US20130252405 Method for making semiconducting single wall carbon nanotubes
09/26/2013US20130252404 Keyed wafer carrier
09/26/2013US20130252403 Method of cutting semiconductor substrate
09/26/2013US20130252402 Laser processing method
09/26/2013US20130252401 Nitride semiconductor substrate, semiconductor device, and methods for manufacturing nitride semiconductor substrate and semiconductor device
09/26/2013US20130252400 Method for manufacturing silicon carbide semiconductor device
09/26/2013US20130252399 Direct bonding process using a compressible porous layer
09/26/2013US20130252398 Methods for Forming Semiconductor Constructions, and Methods for Selectively Etching Silicon Nitride Relative to Conductive Material
09/26/2013US20130252397 Manufacturing method for high capacitance capacitor structure
09/26/2013US20130252392 Performing Enhanced Cleaning in the Formation of MOS Devices
09/26/2013US20130252387 Metal-gate cmos device and fabrication method thereof
09/26/2013US20130252385 Semiconductor device and fabrication method thereof
09/26/2013US20130252384 Trench forming method, metal wiring forming method, and method of manufacturing thin film transistor array panel
09/26/2013US20130252383 Fabrication method of wafer level semiconductor package and fabrication method of wafer level packaging substrate
09/26/2013US20130252382 Method of manufacturing a semiconductor device
09/26/2013US20130252381 Electrically Isolated Power Semiconductor Package With Optimized Layout
09/26/2013US20130252380 Method for fabricating packaging structure having embedded semiconductor element
09/26/2013US20130252379 Method for making high-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost
09/26/2013US20130252374 Semiconductor packaging method and structure thereof
09/26/2013US20130252360 Method of manufacturing photonic crystal and method of manufacturing surface-emitting laser
09/26/2013US20130252356 Supporting substrate, method for fabricating semiconductor device, and method for inspecting semiconductor device
09/26/2013US20130252355 Methods for Achieving Width Control in Etching Processes
09/26/2013US20130252354 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
09/26/2013US20130252353 Vapor deposition method, vapor deposition device and organic el display device
09/26/2013US20130252350 System and method for generating care areas for defect inspection
09/26/2013US20130252349 Finfet Device Fabrication Using Thermal Implantation
09/26/2013US20130252175 Litho Cluster and Modulization to Enhance Productivity
09/26/2013US20130252144 Semiconductor structure having an air-gap region and a method of manufacturing the same
09/26/2013US20130251999 Carbon material, jig, and method of manufacturing carbon material
09/26/2013US20130251949 Plasma etching apparatus component and manufacturing method for the same
09/26/2013US20130251494 Wh (wafer-holder) process
09/26/2013US20130250676 Semiconductor storage device
09/26/2013US20130250662 Tamper-resistant mram utilizing chemical alteration
09/26/2013US20130250661 Memory cells, semiconductor device structures, systems including such cells, and methods of fabrication
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