| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/25/2013 | CN103329253A Chemical mechanical polishing pad dresser having leveled tips and associated methods |
| 09/25/2013 | CN103329252A Ion implanter system including remote dopant source, and method comprising same |
| 09/25/2013 | CN103329251A Semiconductor processing system and methods using capacitively coupled plasma |
| 09/25/2013 | CN103329250A Polysilicon films by high density plasma chemical vapor deposition (HDP-CVD) |
| 09/25/2013 | CN103329249A Chemical vapor deposition apparatus and method for manufacturing light-emitting devices using same |
| 09/25/2013 | CN103329248A Epitaxial film-forming method, sputtering apparatus, method for manufacturing semiconductor light-emitting element, semiconductor light-emitting element, and illumination device |
| 09/25/2013 | CN103329247A Method for the permanent bonding of wafers |
| 09/25/2013 | CN103329246A Highly scratch-resistant imprint material containing urethane compound |
| 09/25/2013 | CN103329245A 光伏装置 Photovoltaic device |
| 09/25/2013 | CN103329244A Graphene devices with local dual gates |
| 09/25/2013 | CN103329243A Method for determining the position of a rotation axis |
| 09/25/2013 | CN103329042A Photoresist resin composition |
| 09/25/2013 | CN103328696A Silicon single-crystal wafer production method, and annealed wafer |
| 09/25/2013 | CN103328695A Resistance heated sapphire single crystal ingot grower, method of manufacturing resistance heated sapphire sngle crystal ingot, sapphire sngle crystal ingot, and sapphire wafer |
| 09/25/2013 | CN103328688A Vapour etch of silicon dioxide with improved selectivity |
| 09/25/2013 | CN103328663A Method for producing high-purity lanthanum, high-purity lanthanum, sputtering target formed from high-purity lanthanum, and metal gate film having high-purity lanthanum as main component |
| 09/25/2013 | CN103328599A Silicon polishing compositions with improved PSD performance |
| 09/25/2013 | CN103328176A Method for producing mold for fine pattern transfer, method for producing diffraction grating using same, and method for manufacturing organic el element which comprises the diffraction grating |
| 09/25/2013 | CN103328164A Transportation device, vacuum device |
| 09/25/2013 | CN103328093A 光照射装置 Light irradiation device |
| 09/25/2013 | CN103327751A PCB fixed heating device, PCB lead bonding device and lead bonding method |
| 09/25/2013 | CN103327737A Chip assembly structure and chip assembly method |
| 09/25/2013 | CN103325937A Piezoelectric film-attached substrate, piezoelectric film element and method of manufacturing the same |
| 09/25/2013 | CN103325926A LED packaging structure used in on-board chip and fluorescent powder coating method thereof |
| 09/25/2013 | CN103325890A Light-emitting component positioning method and suction nozzle used |
| 09/25/2013 | CN103325846A Valley gutter Schottky barrier rectification element and manufacturing method thereof |
| 09/25/2013 | CN103325845A 肖特基位障二极管及其制造方法 The method of manufacturing a Schottky diode barrier bits |
| 09/25/2013 | CN103325843A Junction type field effect transistor and manufacturing method thereof |
| 09/25/2013 | CN103325841A Thin-film transistor and manufacturing method and display device thereof |
| 09/25/2013 | CN103325840A Thin-film transistor and preparation method thereof |
| 09/25/2013 | CN103325839A MOS super barrier rectifier device and manufacturing method thereof |
| 09/25/2013 | CN103325838A Power semiconductor chip and manufacturing method thereof |
| 09/25/2013 | CN103325837A Carbon-based field effect transistor and preparing method thereof |
| 09/25/2013 | CN103325836A Grapheme field effect transistor and preparation method thereof |
| 09/25/2013 | CN103325834A Transistor and method for forming channel length of transistor |
| 09/25/2013 | CN103325832A FINFET with metal gate stressor |
| 09/25/2013 | CN103325831A Source/drain profile for FinFET |
| 09/25/2013 | CN103325829A Semiconductor device and manufacturing method of the same |
| 09/25/2013 | CN103325826A Semiconductor structure and manufacturing method thereof |
| 09/25/2013 | CN103325825A Super junction MOSFET |
| 09/25/2013 | CN103325824A Semiconductor device and method of manufacturing the same |
| 09/25/2013 | CN103325823A Compound semiconductor device and method for manufacturing the same |
| 09/25/2013 | CN103325822A Compound semiconductor device and method for manufacturing the same |
| 09/25/2013 | CN103325819A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/25/2013 | CN103325818A Semiconductor device and method for manufacturing the same |
| 09/25/2013 | CN103325817A Thin film transistor, manufacturing method of the same and electronic equipment |
| 09/25/2013 | CN103325811A Organic light emitting diode display device and method of manufacturing the same |
| 09/25/2013 | CN103325803A Method and structure of image sensor packaging and image sensor module and forming method of image sensor module |
| 09/25/2013 | CN103325799A Structure of stacking chips and method for manufacturing the same |
| 09/25/2013 | CN103325794A Array substrate, display device and method for manufacturing array substrate |
| 09/25/2013 | CN103325792A Array substrate, preparation method and display device |
| 09/25/2013 | CN103325791A Memory device |
| 09/25/2013 | CN103325790A 只读记忆体及其制造方法 Read-only memory and manufacturing method |
| 09/25/2013 | CN103325789A System and method of uv programming of non-volatile semiconductor memory |
| 09/25/2013 | CN103325787A Cmos device and manufacturing method thereof |
| 09/25/2013 | CN103325785A Method and apparatus related to a diode device including a JFET portion |
| 09/25/2013 | CN103325779A Methods of making microelectronic packages |
| 09/25/2013 | CN103325771A Interposer and electrical testing method thereof |
| 09/25/2013 | CN103325770A Integrated circuit copper interconnection structure and preparation method thereof |
| 09/25/2013 | CN103325769A Copper interconnection structure and manufacturing method thereof |
| 09/25/2013 | CN103325762A Ball grid array package substrate with through holes and method of forming same |
| 09/25/2013 | CN103325761A Upright package structure and preparation method for novel high-density multi-layer circuit chip |
| 09/25/2013 | CN103325760A Conductive bump structure on substrate and fabrication method thereof |
| 09/25/2013 | CN103325758A FCQFN encapsulation part preventing solder balls from collapsing and manufacturing process of FCQFN encapsulation part |
| 09/25/2013 | CN103325757A Packaging piece based on substrate and adopting slotting technology and manufacturing process of packaging piece |
| 09/25/2013 | CN103325756A Multi-device SMT flat packaging piece based on frame and manufacturing process of multi-device SMT flat packaging piece |
| 09/25/2013 | CN103325754A Enhanced polymer composite material adapter plate based on carbon nano tube and preparation method thereof |
| 09/25/2013 | CN103325753A Plastic packaging piece and manufacturing process based on frameless CSP packaging back ball placing |
| 09/25/2013 | CN103325752A Circuit package, electronic circuit package, and method for encapsulating an electronic circuit |
| 09/25/2013 | CN103325751A Step-type micro convex point structure and preparation method thereof |
| 09/25/2013 | CN103325750A High-power whole wafer flat plate pressure welding type encapsulating structure and method thereof |
| 09/25/2013 | CN103325747A 垂直式半导体元件及其制造方法 Vertical-type semiconductor device and manufacturing method |
| 09/25/2013 | CN103325746A Semiconductor packages and methods of formation thereof |
| 09/25/2013 | CN103325745A 半导体装置 Semiconductor device |
| 09/25/2013 | CN103325743A Insulated heat-conducting substrate with high reliability |
| 09/25/2013 | CN103325741A Packaging piece based on substrate and adopting liquid plastic packaging and manufacturing process of packaging piece |
| 09/25/2013 | CN103325740A Stacked wafer structure and method for stacking a wafer |
| 09/25/2013 | CN103325737A Method of manufacturing semiconductor device |
| 09/25/2013 | CN103325736A Method for fabricating fin type field effect transistor with fins of different widths |
| 09/25/2013 | CN103325735A Method for forming diffusion resistance in integrated circuit isolation region |
| 09/25/2013 | CN103325734A Separation method of flexible substrate and flexible substrate structure |
| 09/25/2013 | CN103325733A Substrate separating method and substrate separating apparatus |
| 09/25/2013 | CN103325732A COA substrate and manufacturing method and display device of COA substrate |
| 09/25/2013 | CN103325731A Manufacturing method of flexible display device |
| 09/25/2013 | CN103325730A Manufacturing method for copper interconnection interlevel dielectric with adjustable permittivity |
| 09/25/2013 | CN103325729A Copper interconnection structure manufacturing method |
| 09/25/2013 | CN103325728A Air gap forming method |
| 09/25/2013 | CN103325727A Semiconductor method and device of forming a fan-out pop device |
| 09/25/2013 | CN103325726A Clamping tool and equipment for rework process |
| 09/25/2013 | CN103325725A Static chuck |
| 09/25/2013 | CN103325724A Direct drive taking and placing device with little inertia and light moving mass |
| 09/25/2013 | CN103325723A Device for delivering wafers processed in a plurality of chambers |
| 09/25/2013 | CN103325722A Wafer conveying mechanism and application method thereof |
| 09/25/2013 | CN103325721A Rolling type chip moving method |
| 09/25/2013 | CN103325720A Novel railboat for diffusing silicon wafers |
| 09/25/2013 | CN103325719A Supporting substrate, method for fabricating semiconductor device, and method for inspecting semiconductor device |
| 09/25/2013 | CN103325718A Absorption panel, manufacturing method thereof and opposite combination device |
| 09/25/2013 | CN103325717A One-chip type cleaning device and cleaning method |
| 09/25/2013 | CN103325716A Method and device for manufacturing welding points of chip-level device |
| 09/25/2013 | CN103325715A Device and method for detaching a wafer from a carrier |