| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/25/2013 | CN103325714A 加热装置及半导体制造装置 A heating device and a semiconductor manufacturing apparatus |
| 09/25/2013 | CN103325713A Cutting device and cutting method |
| 09/25/2013 | CN103325712A IGBT module packaging welding auxiliary device and system |
| 09/25/2013 | CN103325711A Method for inspecting gap in filling technology |
| 09/25/2013 | CN103325710A Method of testing three-inch diffusion silicon piece surface nickel plating thickness |
| 09/25/2013 | CN103325709A No-nitrogen medium reflecting resistant layer off-line detecting method |
| 09/25/2013 | CN103325708A Wafer defect crosscutting observation device |
| 09/25/2013 | CN103325707A Method for detecting reverse sputter etching rate |
| 09/25/2013 | CN103325706A Detector and chip transport unit |
| 09/25/2013 | CN103325705A Method of inspecting semiconductor device, method of fabricating semiconductor device, and inspection tool |
| 09/25/2013 | CN103325704A Chip quality inspection method |
| 09/25/2013 | CN103325703A Probing chips during package formation |
| 09/25/2013 | CN103325702A Chip binding method and chip binding structure |
| 09/25/2013 | CN103325701A Installation method, installation structure and power module for power module PCB |
| 09/25/2013 | CN103325700A Method for achieving through hole interconnection by filling through hole from bottom to top and product thereof |
| 09/25/2013 | CN103325699A Manufacturing method of semiconductor device |
| 09/25/2013 | CN103325698A Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components |
| 09/25/2013 | CN103325697A Semiconductor packaging structure and manufacturing method thereof |
| 09/25/2013 | CN103325696A Fabrication method of wafer level semiconductor package and fabrication method of wafer level packaging substrate |
| 09/25/2013 | CN103325695A XY workbench |
| 09/25/2013 | CN103325694A Dispensing method used for flip chip manufacturing process |
| 09/25/2013 | CN103325693A Encapsulation piece using plastic package technology to optimize FCBGA encapsulation and manufacturing technology of encapsulation piece |
| 09/25/2013 | CN103325692A Manufacturing method of semiconductor device fan-out flip chip packaging structure |
| 09/25/2013 | CN103325691A Technological method for plating and etching multilayer circuit substrate of metal frame |
| 09/25/2013 | CN103325690A Semiconductor package and methods of formation thereof |
| 09/25/2013 | CN103325689A Radiating structure manufacturing method |
| 09/25/2013 | CN103325688A Method for forming channel of thin film transistor and compensating circuit |
| 09/25/2013 | CN103325687A Method for forming transistor |
| 09/25/2013 | CN103325686A Method for preparing diamond base FET device with T-similar-type grid shelter autocollimation technology |
| 09/25/2013 | CN103325685A Deep groove power semiconductor field effect transistor and manufacturing method thereof |
| 09/25/2013 | CN103325684A Semiconductor structure and method for manufacturing semiconductor structure |
| 09/25/2013 | CN103325683A Fin field effect transistor and technology thereof |
| 09/25/2013 | CN103325682A Preparing method for double-layer polycrystalline gate groove-type MOS transistor |
| 09/25/2013 | CN103325681A Super-junction MOSFET with ions injected in self-aligned mode and manufacturing method thereof |
| 09/25/2013 | CN103325680A Method for improving radiation resistance of integrated circuit bipolar type audion |
| 09/25/2013 | CN103325679A Method for manufacturing back of semiconductor power device |
| 09/25/2013 | CN103325678A IC two- micrometer-thick aluminum etching process method |
| 09/25/2013 | CN103325677A Method for preparing polar c surface GaN-base semiconductor device with SiNx inserting layer |
| 09/25/2013 | CN103325676A Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatus |
| 09/25/2013 | CN103325675A Method for manufacturing electronic element of narrow-line-width electrode |
| 09/25/2013 | CN103325674A Constraint etching processing method of complex three-dimensional multistage micro-nano structures |
| 09/25/2013 | CN103325673A Chip packaging method supporting cutting wafer from back |
| 09/25/2013 | CN103325672A Manufacture method for double-gate dielectric layer and semiconductor device |
| 09/25/2013 | CN103325671A Method for manufacturing T-shaped grid electrode on semiconductor surface |
| 09/25/2013 | CN103325670A Metal gate semiconductor device |
| 09/25/2013 | CN103325669A Shield plate, method for manufacturing a semiconductor device, and semiconductor device |
| 09/25/2013 | CN103325668A Formula of crystalline silicon solar cell diffusion source |
| 09/25/2013 | CN103325667A Plane silicon controlled rectifier device chip terminal protective method |
| 09/25/2013 | CN103325666A Semiconductor wafer doping and diffusing technology |
| 09/25/2013 | CN103325665A Forming method of polycrystalline silicon layer |
| 09/25/2013 | CN103325664A Method of forming a semiconductor device |
| 09/25/2013 | CN103325663A Preparation method of composite nanofiltration heterostructure capable of generating quantum dots on side wall of nanowire |
| 09/25/2013 | CN103325662A Method for manufacturing semiconductor single-walled carbon nanotubes |
| 09/25/2013 | CN103325337A Flat panel display device and method of fabricating the same |
| 09/25/2013 | CN103324035A Mask plate and manufacture method of array base plate |
| 09/25/2013 | CN103324027A Photomask blank and photomask making method |
| 09/25/2013 | CN103324024A Photomask blank and photomask making method |
| 09/25/2013 | CN103323993A Liquid crystal display device and manufacturing method of conductive substrate |
| 09/25/2013 | CN103320764A Method for preparing InN semiconductor device based on a-side GaN buffer layer on a-side 6H-SiC substrate |
| 09/25/2013 | CN103320654A Aluminum alloy bonding wire |
| 09/25/2013 | CN103320033A Bonding belt used for protecting semiconductor wafer surface |
| 09/25/2013 | CN103320018A Additive for crystalline silicon polishing solution and application method thereof |
| 09/25/2013 | CN103319931A Thermal annealing process |
| 09/25/2013 | CN103319712A Triazine ring-containing polymer and film-forming composition comprising same |
| 09/25/2013 | CN103318647A Force generation device |
| 09/25/2013 | CN103317437A Bearing device and method adopting same to transfer wafers |
| 09/25/2013 | CN102662305B Micro-lens mould structure and manufacturing method thereof |
| 09/25/2013 | CN102446957B Structure of heterojunction field effect transistor and fabrication method thereof |
| 09/25/2013 | CN102437043B Method for removing polished section wafer edge oxide film used for IGBT (insulated gate bipolar transistor) in a row grinding manner |
| 09/25/2013 | CN102407401B Wire bonding machine |
| 09/25/2013 | CN102368468B Precleaning process of silicon wafer |
| 09/25/2013 | CN102339831B 垂直沟道晶体管阵列及其制造方法 Vertical channel transistor array and manufacturing method thereof |
| 09/25/2013 | CN102339803B Die package structure manufacturing method |
| 09/25/2013 | CN102315167B Wide visual angle LCD array substrate manufacturing method |
| 09/25/2013 | CN102315086B Device for improving movement accuracy of mechanical arm and use method thereof |
| 09/25/2013 | CN102308256B Photomask and methods for manufacturing and correcting photomask |
| 09/25/2013 | CN102301457B Plasma etching apparatus |
| 09/25/2013 | CN102292796B Non-condensing thermos chuck |
| 09/25/2013 | CN102290360B T-shaft rotation limiting structure |
| 09/25/2013 | CN102280479B Semiconductor device and fabrication method therefor |
| 09/25/2013 | CN102280367B Method for protecting alignment mark and semiconductor element formed therewith |
| 09/25/2013 | CN102270600B Forming method of through hole |
| 09/25/2013 | CN102244093B Structure and method of reducing transverse diffusion width of p-n junction isolation diffusion |
| 09/25/2013 | CN102244060B Packaging base plate and manufacturing method thereof |
| 09/25/2013 | CN102244037B 画素结构及其制作方法 Pixel structure and production methods |
| 09/25/2013 | CN102243993B Method for growing GaInP compound semiconductor on Ge substrate |
| 09/25/2013 | CN102217070B Semiconductor device and method for producing same |
| 09/25/2013 | CN102217052B Method for detaching and removing semiconductor chip from tape |
| 09/25/2013 | CN102203928B Wire bonding method and semiconductor device |
| 09/25/2013 | CN102197487B Insulated gate bipolar transistor (IGBT), and method of manufacturing same |
| 09/25/2013 | CN102189736B Film cutting mechanism for wafer film laminator |
| 09/25/2013 | CN102177214B Ultraviolet curing removable adhesive composition and adhesive sheet using the same |
| 09/25/2013 | CN102176416B Method for manufacturing semiconductor device including laser annealing |
| 09/25/2013 | CN102165093B High-purity copper or high-purity copper alloy sputtering target, process for manufacturing the sputtering target, and high-purity copper or high-purity copper alloy sputtered film |
| 09/25/2013 | CN102150235B A method for producing polycrystalline layers |
| 09/25/2013 | CN102132399B 半导体装置 Semiconductor device |
| 09/25/2013 | CN102132380B Polysilicon deposition apparatus |
| 09/25/2013 | CN102117781B Bonding structure and method for manufacturing same |
| 09/25/2013 | CN102087974B Deep trench liner removal process |
| 09/25/2013 | CN102074503B Array substrate of display panel and patching method thereof |