Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/18/2013CN103311139A Bonding components to each other using exothermic reactions by simultaneous current pulses
09/18/2013CN103311138A Packaging methods and packaged semiconductor devices
09/18/2013CN103311137A Automatic supply equipment for solder ball positioning in high-density chip packaging
09/18/2013CN103311136A Copper wire welding device and copper wire welding realization method based on BGA package
09/18/2013CN103311135A Method of producing a resin molded semiconductor device
09/18/2013CN103311134A Semiconductor packages and methods of forming the same
09/18/2013CN103311133A Pre-welding inverse installation technology of power semiconductor module
09/18/2013CN103311132A Plating-then-etching technical method for multi-layer circuit substrate with metal frame
09/18/2013CN103311131A Method for preventing lateral undercutting of micro-convex points in manufacturing process of micro-convex points
09/18/2013CN103311130A Amorphous metallic oxide film transistor and preparation method thereof
09/18/2013CN103311129A Thin-film transistor array substrate and channel formation method therefor
09/18/2013CN103311128A Self-aligning metal oxide thin film transistor and manufacturing method thereof
09/18/2013CN103311127A Method for manufacturing semiconductor device
09/18/2013CN103311126A Method of manufacturing a thin-film transistor, method of manufacturing a display substrate, and display substrate
09/18/2013CN103311125A finFET device having a strained region
09/18/2013CN103311124A Semiconductor devices and methods of manufacture thereof
09/18/2013CN103311123A Semiconductor device manufacturing method
09/18/2013CN103311122A Formation method of transistor
09/18/2013CN103311121A Vertical trench IGBT and method for manufacturing the same
09/18/2013CN103311120A Method for growing high-dielectric constant dielectric lamination
09/18/2013CN103311119A Catalyst synthesis for organosilane sol-gel reactions
09/18/2013CN103311118A Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devices
09/18/2013CN103311117A Method for corroding Si substrate of sample by wet method
09/18/2013CN103311116A Back chamfering process for semiconductor chips
09/18/2013CN103311115A Manufacturing method of sapphire substrate with identifiable front side and back side
09/18/2013CN103311114A Cutting apparatus
09/18/2013CN103311113A Formation method of grid electrode
09/18/2013CN103311112A Method for forming polycrystalline silicon in trenches
09/18/2013CN103311111A Forming method of fin type transistor
09/18/2013CN103311110A Formation method of semiconductor structure and formation method of transistor
09/18/2013CN103311109A Method for forming side wall and method for defining graph structure by using side wall
09/18/2013CN103311108A CMOS transistor and polysilicon gate manufacturing method
09/18/2013CN103311107A Metal silicide production method, and semiconductor structure with application of metal silicide
09/18/2013CN103311106A Preparation method for silica-based gallium arsenide material with high quality and low surface roughness
09/18/2013CN103311105A Method for inducing crystallization of amorphous silicon thin film into polycrystalline silicon thin film by aluminum at low temperature
09/18/2013CN103311104A Method for manufacturing graphene
09/18/2013CN103311103A Layout-layer designing method of semiconductor chip and masking plate thereof
09/18/2013CN103311102A Methods of making jogged layout routings double patterning compliant
09/18/2013CN103311101A Method of fabricating a semiconductor device
09/18/2013CN103311100A Production method of InN semiconductor component with nonpolar m plane GaN buffer layer
09/18/2013CN103311099A Method for reducing defects caused by laser spike anneal process
09/18/2013CN103311098A Method for improving chromatic aberration of wafer backside
09/18/2013CN103311097A Method for manufacturing micro-nano graph on sapphire substrate
09/18/2013CN103311096A Method for manufacturing nitride semiconductor
09/18/2013CN103311095A Method for manufacturing nitride semiconductor layer
09/18/2013CN103311094A Method for treating surface of wafer
09/18/2013CN103311093A Doping method of PN structure
09/18/2013CN103311092A Method for etching grooves
09/18/2013CN103311091A Method for replacing wafer protective film on laminator
09/18/2013CN103310834A Structure and method for a sram circuit
09/18/2013CN103310031A System and method for modeling through silicon via
09/18/2013CN103309174A Lithographic equipment, light-transmission unit and lithographic method employing dipolar exposure method
09/18/2013CN103309165A Formation method for semiconductor structure
09/18/2013CN103309164A Formation method for semiconductor structure
09/18/2013CN103309151A Method for processing photoresist, and method of manufacturing semiconductor device
09/18/2013CN103309105A Array baseplate and preparation method thereof, and display device
09/18/2013CN103309100A Liquid crystal display device and method of fabricating the same
09/18/2013CN103309099A Liquid crystal display array substrate and method for manufacturing the same
09/18/2013CN103307983A Wafer edge exposure process detecting method
09/18/2013CN103307857A Vacuum drying method
09/18/2013CN103307290A Two way gate valve and substrate processing system having the same
09/18/2013CN103305886A Methods and apparatus for wetting pretreatment for through resist metal plating
09/18/2013CN103305160A Adhesive composition, adhesive sheet and method for manufacturing semiconductor device
09/18/2013CN103305159A Adhesive composition, an adhesive sheet and a production method of a semiconductor device
09/18/2013CN103305146A Adhesive sheet
09/18/2013CN103305144A Dicing/die bonding film
09/18/2013CN103305142A Adhesive tape
09/18/2013CN103305140A Heat-resistance pressure-sensitive adhesive tape for semiconductor device production and method for producing semiconductor device by using heat-resistance pressure-sensitive adhesive tape
09/18/2013CN103305139A Heat-resistance pressure-sensitive adhesive tape for semiconductor device production and method for producing semiconductor device by using heat-resistance pressure-sensitive adhesive tape
09/18/2013CN103305138A Pressure-sensitive adhesive tape for resin sealing and production method for resin sealing type semiconductor device
09/18/2013CN103302910A Biodegradable flexible conductive base plate and preparation method thereof
09/18/2013CN103302587A Chemical mechanical polishing (CMP) device and system
09/18/2013CN103302572A Method for grinding plate-like object
09/18/2013CN103301993A Coating apparatus and manufacturing method of coated body
09/18/2013CN102566258B Double imprint method
09/18/2013CN102520587B Two-workpiece-platform rotary exchange method and device based on cable-box anti-rotation mechanisms
09/18/2013CN102509712B Method for determining dynamic pressure distribution and grinding removal rate of chemical mechanical polishing grinding liquid
09/18/2013CN102508414B Rotary exchanging method and rotary exchanging device for double workpiece platforms based on synchronous steering of turntable gear
09/18/2013CN102496600B Method for manufacturing flexible display panel
09/18/2013CN102495529B Lintel type dual-guide rail dual-drive stepping scanning double silicon wafer stage exchanging device and method thereof
09/18/2013CN102495527B Double work-piece stage exchanging device based on single/double drive stepping scanning, and method thereof
09/18/2013CN102485951B Method for depositing medium oxide between layers of metal front layer
09/18/2013CN102435307B Detection method of UV (Ultraviolet) illumination of multi-layer UV hot oven in TFT-LCD (Thin Film Transistor-Liquid Crystal Display) manufacturing process and combined disk extraction device for implementing detection method
09/18/2013CN102422497B Group iii nitride semiconductor laser diode, and method for producing group iii nitride semiconductor laser diode
09/18/2013CN102412302B Tunneling field-effect transistor for inhibiting bipolar effect and preparation method thereof
09/18/2013CN102403270B Method for forming silicon through hole interconnection structure
09/18/2013CN102403248B Nondestructive testing method of fault and dislocation defects of silicon polished wafers or epitaxial wafers
09/18/2013CN102376765B 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
09/18/2013CN102376686B Semiconductor device and production method thereof
09/18/2013CN102364689B Floating gate structure of flash memory device and manufacturing method for floating gate structure
09/18/2013CN102354663B Method for etching silicon chip
09/18/2013CN102349146B Systems, apparatus and methods for making an electrical connection to a robot and electrical end effector thereof
09/18/2013CN102347234B Structure of semiconductor device and manufacturing method thereof
09/18/2013CN102339796B Production method for and structure of accumulation-mode complementary metal oxide semiconductor (CMOS) device
09/18/2013CN102339741B Chemical mechanical polishing method
09/18/2013CN102332435B Electronic component and manufacturing method of same
09/18/2013CN102315281B Schottky diode and manufacture method thereof
09/18/2013CN102299106B Manufacturing method of memory cell of phase change memory
09/18/2013CN102282648B Evaporation apparatus, thin film depositing apparatus and method for feeding source material of the same
09/18/2013CN102272915B 销升降系统 Pin lift system