| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/11/2013 | CN103296028A Low-cost single polycrystal framework and non-volatile memory without light doped area and preparation method thereof |
| 09/11/2013 | CN103296027A Analog floating-gate memory manufacturing process implementing n-channel and p-channel MOS transistors |
| 09/11/2013 | CN103296026A Nonvolatile memory device and method of fabricating the same |
| 09/11/2013 | CN103296024A Semiconductor device, manufacturing method thereof, protective element, and manufacturing method thereof |
| 09/11/2013 | CN103296023A Semiconductor devices and manufacturing and design methods thereof |
| 09/11/2013 | CN103296019A Semiconductor device and method for manufacturing semiconductor device |
| 09/11/2013 | CN103296014A Fan-out wafer level semiconductor chip three-dimensional stacking packaging structure and technology |
| 09/11/2013 | CN103296013A Formation method of radio frequency components |
| 09/11/2013 | CN103296008A TSV or TGV pinboard, 3D packaging and manufacture method thereof |
| 09/11/2013 | CN103296007A Protective layer for conductive pad and forming method thereof |
| 09/11/2013 | CN103296006A Diffusion blocking layer and metal interconnection structure and manufacturing method thereof |
| 09/11/2013 | CN103296004A Anti-fuse element and manufacturing method thereof |
| 09/11/2013 | CN103296003A Capacitor structure and forming method thereof |
| 09/11/2013 | CN103296002A Electronic device and method for manufacturing same |
| 09/11/2013 | CN103296000A Trench capacitor and method of forming the same |
| 09/11/2013 | CN103295998A Package with interposer frame and method of making the same |
| 09/11/2013 | CN103295997A Electrical connections for chip scale packaging |
| 09/11/2013 | CN103295996A Package substrate and manufacturing method thereof |
| 09/11/2013 | CN103295995A Semiconductor device and manufacturing method of the same |
| 09/11/2013 | CN103295994A Packaging structure, substrate structure and manufacturing method thereof |
| 09/11/2013 | CN103295992A 半导体装置 Semiconductor device |
| 09/11/2013 | CN103295991A Two-solder semiconductor chip, apparatus for self-aligning solder bumps in semiconductor assembly, and two-solder method |
| 09/11/2013 | CN103295990A Semiconductor device and method of manufacturing semiconductor device |
| 09/11/2013 | CN103295988A System-in-package with integrated socket |
| 09/11/2013 | CN103295986A Mechanisms of forming connectors for package on package |
| 09/11/2013 | CN103295985A Chip package and method for forming the same |
| 09/11/2013 | CN103295979A Package structure and method for manufacturing the same |
| 09/11/2013 | CN103295978A Semiconductor package and fabrication method thereof |
| 09/11/2013 | CN103295976A Chip arrangements and methods for forming a chip arrangement |
| 09/11/2013 | CN103295970A Array substrate and manufacturing method thereof and display device |
| 09/11/2013 | CN103295969A Method for manufacturing semiconductor integrated circuit device |
| 09/11/2013 | CN103295968A Production method of semiconductor device |
| 09/11/2013 | CN103295967A Manufacturing method for separated grid type flash memory embedded into logical circuit |
| 09/11/2013 | CN103295966A Method for forming three-dimensional nonvolatile storage cell array |
| 09/11/2013 | CN103295965A Method for manufacturing semiconductor structure |
| 09/11/2013 | CN103295964A Device system structure and preparing method based on mixed crystal orientation SOI and channel stress |
| 09/11/2013 | CN103295963A Semiconductor device having a strained region |
| 09/11/2013 | CN103295962A Array substrate and manufacturing method thereof and display device |
| 09/11/2013 | CN103295961A Array substrate, manufacturing method thereof and display device |
| 09/11/2013 | CN103295960A Array substrate and method of fabricating the same |
| 09/11/2013 | CN103295959A Array substrate and manufacturing method thereof and liquid crystal display panel |
| 09/11/2013 | CN103295958A Method for producing copper seed layers |
| 09/11/2013 | CN103295957A Method of improving metal layer/insulating layer/metal layer mismatch parameters |
| 09/11/2013 | CN103295956A Method for manufacturing ultra-thin ruthenium film by aid of plasma enhanced atomic layer deposition process |
| 09/11/2013 | CN103295955A Method for manufacturing semiconductor structure |
| 09/11/2013 | CN103295954A Method for forming semiconductor device |
| 09/11/2013 | CN103295953A Formation method of semiconductor device |
| 09/11/2013 | CN103295952A Double-depth shallow-trench isolation channel preparation method |
| 09/11/2013 | CN103295951A Device system structure and preparing method based on mixed crystal orientation SOI |
| 09/11/2013 | CN103295950A Shallow groove isolating structure manufacturing method |
| 09/11/2013 | CN103295949A Method of testing a microelectronic circuit, test device and portable assembly |
| 09/11/2013 | CN103295948A Processing method of device wafer with bump |
| 09/11/2013 | CN103295947A Laser lift-off device and laser lift-off method |
| 09/11/2013 | CN103295946A FIMS (front-opening interface mechanical standard) device of furnace tube device |
| 09/11/2013 | CN103295945A Method and apparatus for joining adhesive tape |
| 09/11/2013 | CN103295944A Carrier transfer and method of transferring substrate carrier using the same |
| 09/11/2013 | CN103295943A Base plate transmitting device and semiconductor manufacture device using same |
| 09/11/2013 | CN103295942A Feeding system of lead frame array |
| 09/11/2013 | CN103295941A Hetero-junction plate-type PECVD (plasma enhanced chemical vapor deposition) carrier plate |
| 09/11/2013 | CN103295940A Automatic liquid adding system for metal film stripping and cleaning device |
| 09/11/2013 | CN103295939A Combined-type quartz glass heating cavity |
| 09/11/2013 | CN103295938A 半导体处理设备 Semiconductor processing equipment |
| 09/11/2013 | CN103295937A Binding equipment and binding method of chip |
| 09/11/2013 | CN103295936A Substrate treatment apparatus and substrate treatment method |
| 09/11/2013 | CN103295935A Substrate processing apparatus |
| 09/11/2013 | CN103295934A Wire loop forming systems and methods of using the same |
| 09/11/2013 | CN103295933A Carrying device, manufacture method of substrate device |
| 09/11/2013 | CN103295932A Two-shaft drive mechanism and die bonder |
| 09/11/2013 | CN103295931A Providing device and method of LED wafers |
| 09/11/2013 | CN103295930A Quick efficient wafer back defect identification method |
| 09/11/2013 | CN103295929A Barrier driving system of furnace tube and method for initializing barrier driving system |
| 09/11/2013 | CN103295928A Method for rapidly finding wafer scratch unfilled-corner contamination |
| 09/11/2013 | CN103295927A Convex spot wire bonding method |
| 09/11/2013 | CN103295926A Interconnection and package method on basis of TSV (through silicon via) chips |
| 09/11/2013 | CN103295925A Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (ewlp-mlp) |
| 09/11/2013 | CN103295924A System-in-package type semiconductor device |
| 09/11/2013 | CN103295923A Method of manufacturing semiconductor device and semiconductor device |
| 09/11/2013 | CN103295922A Manufacturing method of semiconductor device, and semiconductor device |
| 09/11/2013 | CN103295921A Resin seal device and resin seal body manufacture method |
| 09/11/2013 | CN103295920A Noninsulated type power module and packaging process thereof |
| 09/11/2013 | CN103295919A Ball attachment device with controllable unit pitch, and ball attachment method |
| 09/11/2013 | CN103295918A Manufacturing method of high-power field-effect transistor aluminum-gold bonding transition sheet |
| 09/11/2013 | CN103295917A Aluminum bonding pad manufacturing method |
| 09/11/2013 | CN103295916A Semiconductor device and method of manufacturing the same |
| 09/11/2013 | CN103295915A Manufacturing method of TSV adapter plate and TSV adapter plate |
| 09/11/2013 | CN103295914A Metamaterial based on ceramic substrates and preparation method thereof |
| 09/11/2013 | CN103295913A Method for improving negative bias temperature instability of semiconductor device |
| 09/11/2013 | CN103295912A Graphene transistor production method based on self-aligning technology |
| 09/11/2013 | CN103295911A Power MOSFET (metal-oxide-semiconductor field effect transistor) trench terminal structure and manufacturing method thereof |
| 09/11/2013 | CN103295910A Semiconductor device and method of manufacturing the same |
| 09/11/2013 | CN103295909A Transistor, method of manufacturing the transistor, semiconductor unit, method of manufacturing the semiconductor unit, and display |
| 09/11/2013 | CN103295908A Method for making gate-oxide with step-graded thickness in trenched DMOS device |
| 09/11/2013 | CN103295907A Semiconductor device and method of manufacture thereof |
| 09/11/2013 | CN103295906A Method for manufacturing thin film transistor and thin film transistor |
| 09/11/2013 | CN103295905A Semiconductor device and forming method thereof |
| 09/11/2013 | CN103295904A FinFET design with LDD extensions |
| 09/11/2013 | CN103295903A Surrounding fence structure fin-type semiconductor device manufacturing method |
| 09/11/2013 | CN103295902A Finned field-effect tube and forming method thereof |
| 09/11/2013 | CN103295901A Forming method of finned field-effect tube |
| 09/11/2013 | CN103295900A Method for forming fin part and fin-type field effect transistor |