Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/25/2013CN102066038B Decoupled, multiple stage positioning system
09/25/2013CN102061445B Vacuum evaporation device, vacuum evaporation method and organic EL display device manufacturing method
09/25/2013CN102036918B Dielectric film, dielectric element, and process for producing the dielectric element
09/25/2013CN102013388B Chamber cleaning method
09/25/2013CN102007586B Thin film transistor and method for manufacturing the same
09/25/2013CN101989609B Solid-state imaging device and method for producing the same
09/25/2013CN101978475B Shielded lid heater assembly
09/25/2013CN101971310B Method of forming a thermo pyrolytic graphite-embedded heatsink
09/25/2013CN101965642B Method for manufacturing a silicon surface with pyramidal texture
09/25/2013CN101930956B Chip packaging structure and manufacturing method thereof
09/25/2013CN101910050B Nanowire growth on dissimilar material
09/25/2013CN101855707B Plasma processing apparatus
09/25/2013CN101814447B Method for fabricating a bond
09/25/2013CN101813892B Immersion lithography apparatus and method for manufacturing microdevice using lithography device
09/25/2013CN101807552B Production method of semi-transmission type TFT array substrate
09/25/2013CN101803005B A CMOS device having gate insulation layers of different type and thickness and method of forming the same
09/25/2013CN101777521B Manufacturing method of split-gate type flash memory of shared word line
09/25/2013CN101777519B Split-gate type nonvolatile storage and production method thereof
09/25/2013CN101765904B Film forming technology for a semiconductor
09/25/2013CN101740349B Die Separator
09/25/2013CN101689494B Polishing liquid for metal film
09/25/2013CN101681885B 半导体器件 Semiconductor devices
09/25/2013CN101660140B Film deposition apparatus and method, substrate processing apparatus
09/25/2013CN101651104B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/25/2013CN101621001B Mechanical enhancement of dense and porous organosilicate materials by uv exposure
09/25/2013CN101563765B Electronic, in particular microelectronic, functional group and method for its production
09/25/2013CN101528884B Etching paste containing particles for silicon surfaces and layers
09/25/2013CN101471351B Semiconductor device and its manufacture method
09/25/2013CN101388373B Semiconductor device and production method thereof
09/25/2013CN101183079B Method of inspecting defect for electroluminescence display apparatus, defect inspection apparatus, and method of manufacturing
09/24/2013USRE44510 Multifunctional linker molecules for tuning electronic charge transport through organic-inorganic composite structures and uses thereof
09/24/2013US8543352 System for measuring a shape, method for measuring a shape, and computer program product
09/24/2013US8542513 Arrays of vertically stacked tiers of non-volatile cross point memory cells, methods of forming arrays of vertically stacked tiers of non-volatile cross point memory cells, and methods of reading a data value stored by an array of vertically stacked tiers of non-volatile cross point memory cells
09/24/2013US8542474 Electrostatic chuck
09/24/2013US8542439 Method and device for scanning-microscopy imaging of a specimen
09/24/2013US8542344 Lithographic apparatus and device manufacturing method
09/24/2013US8542343 Lithographic apparatus
09/24/2013US8542337 Pixel structure of active matrix organic light emitting display and manufacturing thereof
09/24/2013US8541892 Bonding connection between a bonding wire and a power semiconductor chip
09/24/2013US8541890 Substrate based unmolded package
09/24/2013US8541889 Probe card including frame and cover plate for testing a semiconductor device
09/24/2013US8541882 Stacked IC device with recessed conductive layers adjacent to interlevel conductors
09/24/2013US8541868 Top electrode templating for DRAM capacitor
09/24/2013US8541867 Metal insulator metal structure with remote oxygen scavenging
09/24/2013US8541865 Semiconductor device with improved ESD protection
09/24/2013US8541863 Data retention in a single poly EPROM cell
09/24/2013US8541854 Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure
09/24/2013US8541847 Semiconductor device and method for fabricating the same
09/24/2013US8541845 Semiconductor discharge devices and methods of formation thereof
09/24/2013US8541844 Semiconductor device and manufacturing method thereof
09/24/2013US8541842 High-k transistors with low threshold voltage
09/24/2013US8541833 Power transistor device vertical integration
09/24/2013US8541830 Nonvolatile semiconductor memory device and method for manufacturing the same
09/24/2013US8541827 Semiconductor memory device including multi-layer gate structure
09/24/2013US8541826 Memory array structure and method for forming the same
09/24/2013US8541822 Semiconductor device and method for producing the same
09/24/2013US8541821 Method of forming a non-volatile electron storage memory and the resulting device
09/24/2013US8541816 III nitride electronic device and III nitride semiconductor epitaxial substrate
09/24/2013US8541813 Homojunction type high-speed photodiode
09/24/2013US8541802 Phosphor placement in white light emitting diode assemblies
09/24/2013US8541775 Schottky diode, resistive memory device having schottky diode and method of manufacturing the same
09/24/2013US8541773 Vertical tunneling negative differential resistance devices
09/24/2013US8541735 Inlaid optical material and method of manufacture
09/24/2013US8541678 Thermionic/thermotunneling thermo-electrical converter
09/24/2013US8541319 Laser processing method
09/24/2013US8541318 Monosilane or disilane derivatives and method for low temperature deposition of silicon-containing films using the same
09/24/2013US8541317 Deposition method for passivation of silicon wafers
09/24/2013US8541316 Method of manufacturing semiconductor device including sequentially forming first and second mask material layers and forming a dotted photoresist pattern on the second mask material layer
09/24/2013US8541315 High throughput epitaxial lift off for flexible electronics
09/24/2013US8541314 Method for smoothing group III nitride semiconductor substrate
09/24/2013US8541312 Selective suppression of dry-etch rate of materials containing both silicon and nitrogen
09/24/2013US8541311 Integrated circuit fabrication methods utilizing embedded hardmask layers for high resolution patterning
09/24/2013US8541310 CMP compositions containing a soluble peroxometalate complex and methods of use thereof
09/24/2013US8541309 Processing assembly for semiconductor workpiece and methods of processing same
09/24/2013US8541308 Polishing method and method for forming a gate
09/24/2013US8541307 Treatment method for reducing particles in dual damascene silicon nitride process
09/24/2013US8541306 Semiconductor device and method of double photolithography process for forming patterns of the semiconductor device
09/24/2013US8541305 3D integrated circuit and method of manufacturing the same
09/24/2013US8541304 Production of TSV interconnection structures made up of an insulating contour and a conductive zone situated in the contour and disconnected from the contour
09/24/2013US8541303 Method for fabricating MOS transistor
09/24/2013US8541302 Electronic device including a trench with a facet and a conductive structure therein and a process of forming the same
09/24/2013US8541301 Reduction of pore fill material dewetting
09/24/2013US8541299 Electrical interconnect forming method
09/24/2013US8541298 Method for fabricating semiconductor device
09/24/2013US8541297 Manufacturing method of semiconductor device
09/24/2013US8541296 Method of manufacturing dummy gates in gate last process
09/24/2013US8541295 Pad-less gate-all around semiconductor nanowire FETs on bulk semiconductor wafers
09/24/2013US8541294 Method of forming epitaxial film
09/24/2013US8541293 Method of controlled lateral etching
09/24/2013US8541292 Group III nitride semiconductor epitaxial substrate and method for manufacturing the same
09/24/2013US8541291 Thermo-compression bonded electrical interconnect structure and method
09/24/2013US8541290 Optoelectronic substrate and methods of making same
09/24/2013US8541289 Dicing die bonding film and dicing method
09/24/2013US8541287 Laser processing method for wafer
09/24/2013US8541286 Methods for fabricating integrated circuits
09/24/2013US8541285 Semiconductor memory device and method for manufacturing the same
09/24/2013US8541284 Method of manufacturing string floating gates with air gaps in between
09/24/2013US8541283 High performance dielectric stack for DRAM capacitor
09/24/2013US8541282 Blocking layers for leakage current reduction in DRAM devices
09/24/2013US8541281 Replacement gate process flow for highly scaled semiconductor devices