Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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09/11/2013 | CN103295899A Manufacturing method of FinFET device |
09/11/2013 | CN103295898A Method for manufacturing transient voltage suppressor by aid of ultra-deep trench structures |
09/11/2013 | CN103295897A Well-through type diode element or diode assembly and method for manufacturing well-through type diode element or diode assembly |
09/11/2013 | CN103295896A Method of thermal processing structures formed on a substrate |
09/11/2013 | CN103295895A Etching method for improving step effect of self-aligned silicide block layer |
09/11/2013 | CN103295894A Method for improving critical size differences of different areas of semiconductor device |
09/11/2013 | CN103295893A Wafer-level micro-assembly process |
09/11/2013 | CN103295892A Method of manufacturing semiconductor device |
09/11/2013 | CN103295891A Manufacturing method for gate dielectric layer and manufacturing method for transistor |
09/11/2013 | CN103295890A Method for processing gate dielectric deposited on germanium based or III-V compound based substrate |
09/11/2013 | CN103295889A Method for manufacturing high-K metal gate in fin-shaped active area |
09/11/2013 | CN103295888A Semiconductor device and method for manufacturing the same |
09/11/2013 | CN103295887A Method for improving trap proximity effect |
09/11/2013 | CN103295886A Manufacturing method and application for phosphorous composition coated nanometer silicon slurry |
09/11/2013 | CN103295885A Method of manufacturing silicon carbide semiconductor device |
09/11/2013 | CN103295884A Method of manufacturing semiconductor device |
09/11/2013 | CN103295883A Method for improving critical size load effect |
09/11/2013 | CN103295882A Formation method of semiconductor structure |
09/11/2013 | CN103295881A Method for removing low-k dielectric materials on surfaces of silicon wafers |
09/11/2013 | CN103295880A Modified structure of control wafer for polysilicon furnace tube process, and production method and application method thereof |
09/11/2013 | CN103295879A Method of manufacturing semiconductor device |
09/11/2013 | CN103295878A Manufacturing method of multilayer nanowire structure |
09/11/2013 | CN103293875A Photolithography device and light-transmitting unit adopting octupole exposure mode and photolithography method |
09/11/2013 | CN103293874A Exposure device, exposure method and manufacturing method for display panel substrate |
09/11/2013 | CN103293873A Exposure apparatus and device manufacturing method using same |
09/11/2013 | CN103293867A Pre-alignment device and method of square substrates |
09/11/2013 | CN103293848A Photoresist treatment method and preparation method of semiconductor device |
09/11/2013 | CN103293811A Array substrate, manufacture method of array substrate, and display device |
09/11/2013 | CN103293807A Array substrate and manufacturing method thereof and display panel |
09/11/2013 | CN103293803A Array substrate for FFS mode liquid crystal display and manufacturing method of array substrate |
09/11/2013 | CN103293797A Thin film transistor liquid crystal display device and manufacturing method thereof |
09/11/2013 | CN103293794A TFT-LCD (thin film transistor-liquid crystal display) device and repair method thereof |
09/11/2013 | CN103293790A Pixel cell, preparation method thereof, array substrate and display device |
09/11/2013 | CN103293776A Array substrate and preparation method and display device thereof |
09/11/2013 | CN103293774A TFT array substrate, TFT LCD panel and manufacture method thereof |
09/11/2013 | CN103293456A Burn-in tester |
09/11/2013 | CN103292677A Methods of extracting fin heights and overlap capacitance and structures for performing the same |
09/11/2013 | CN103290440A Non-cyanide gold electroplating bath for formation of gold bumps and formation method of gold bumps |
09/11/2013 | CN103290371A Sputtering target, method for manufacturing sputtering target, and method for forming thin film |
09/11/2013 | CN103289588A 粘合片 Adhesive sheet |
09/11/2013 | CN103289586A Adhesive sheet for cutting |
09/11/2013 | CN103286089A Substrate cleaning apparatus and substrate cleaning method |
09/11/2013 | CN102501657B Screen printing alignment method |
09/11/2013 | CN102479772B Test structure for monitoring source and drain polycrystalline silicon etching |
09/11/2013 | CN102479699B Manufacturing method of super-junction semiconductor device structure |
09/11/2013 | CN102479669B Wafer brush cleaning device and wafer brush cleaning method |
09/11/2013 | CN102468128B Method for forming deep-trench polysilicon |
09/11/2013 | CN102456561B Forming method of thick gate oxide layer at bottom of groove in groove-type power device |
09/11/2013 | CN102456539B Preparation method for silicon germanium (SiGe) monitoring chip and monitoring method adopting chip |
09/11/2013 | CN102446978B PIN device in bipolar complementary metal oxide semiconductor (BiCMOS) process |
09/11/2013 | CN102446965B Germanium-silicon heterojunction bipolar transistor |
09/11/2013 | CN102446915B Novel metal-insulator-metal (MIM) capacitor structure and manufacturing method thereof |
09/11/2013 | CN102446914B Semiconductor module with extra capacitance structure and production method thereof |
09/11/2013 | CN102446912B Metal oxide semiconductor transistor ESD (Electrostatic Discharge) protection structure and making method thereof |
09/11/2013 | CN102446813B Production method of interconnecting structure |
09/11/2013 | CN102446740B Integrated process for improving gap fill property of PMD (pre-metal dielectric) |
09/11/2013 | CN102446704B Dual patterning method |
09/11/2013 | CN102437180B Ultra high voltage silicon germanium heterojunction bipolar transistor (HBT) device and manufacturing method thereof |
09/11/2013 | CN102437134B Ultra-small packing body and production method thereof |
09/11/2013 | CN102437030B Method for forming dual-depth isolation channels through P type ion injection |
09/11/2013 | CN102426494B Bonding method of touch screen substrates, and binder for same |
09/11/2013 | CN102420240B Terminal protection structure of super junction device and manufacturing method of terminal protection structure |
09/11/2013 | CN102420174B Method for filling through hole in dual damascene process |
09/11/2013 | CN102420134B Manufacturing method of super-junction combined punch-through type groove IGBT (Insulated Gate Bipolar Transistor) device |
09/11/2013 | CN102420105B Process for manufacturing metal-insulator-metal capacitor by using copper damascene process, and structure |
09/11/2013 | CN102420103B Copper Damascus process MIM (metal-insulator-metal) capacitor structure and manufacturing process |
09/11/2013 | CN102412293B 5V PMOS (P-channel Metal Oxide Semiconductor) device in SONOS (Silicon Oxide Nitride Oxide Semiconductor) technique and fabrication method thereof |
09/11/2013 | CN102412291B Variable capacitor in SiGe Bi CMOS technology and manufacturing method thereof |
09/11/2013 | CN102412154B Method for improving working frequency of radio frequency LDMOS device |
09/11/2013 | CN102412148B Preparation method of IGBT device |
09/11/2013 | CN102403344B Parasitic PNP bipolar transistor in silicon germanium BiCMOS (bipolar complementary metal oxide semiconductor) process |
09/11/2013 | CN102403312B Device region on substrate and method of designing layout of devices |
09/11/2013 | CN102403261B 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof |
09/11/2013 | CN102403251B Prewashing solution of crystal silicon wafer and prewashing technology thereof |
09/11/2013 | CN102403222B Manufacturing method for silicon germanium heterojunction bipolar transistors |
09/11/2013 | CN102386130B Forming method of dual-stress liner semiconductor device |
09/11/2013 | CN102386114B Method of bonding chips |
09/11/2013 | CN102386094B Method for forming bottle-type groove and method for forming bottle-type groove capacitor |
09/11/2013 | CN102386083B MOS (metal oxide semiconductor) transistor and manufacturing method of MOS transistor gate dielectric layer |
09/11/2013 | CN102376762B Super junction LDMOS(Laterally Diffused Metal Oxide Semiconductor) device and manufacturing method thereof |
09/11/2013 | CN102376716B Semiconductor device and manufacturing method |
09/11/2013 | CN102376580B Method for manufacturing super junction semiconductor device |
09/11/2013 | CN102376555B Method for improving reliability of SONOS (Silicon Oxide Nitride Oxide Semiconductor) by oxidizing ON film as tunneling dielectric medium |
09/11/2013 | CN102361033B Pixel structure for display panel and manufacturing method thereof |
09/11/2013 | CN102339777B Wafer limiting piece of wafer box |
09/11/2013 | CN102318049B Epitaxial substrate for electronic devices and manufacturing method therefor |
09/11/2013 | CN102315198B Structure with alignment mark and manufacture method for stacking device |
09/11/2013 | CN102306628B Method for manufacturing planar diode or die of thyristor by utilizing aluminium foil as solder |
09/11/2013 | CN102290388B Electronic control device, heat pipe radiator and manufacturing method of heat pipe radiator |
09/11/2013 | CN102272889B Epitaxial substrate for electronic device and manufacturing method thereof |
09/11/2013 | CN102270596B Sucking disc and sheet-holding table |
09/11/2013 | CN102254852B Thimble cap of die bonder |
09/11/2013 | CN102222702B Capacitor and formation method thereof |
09/11/2013 | CN102214584B Method for manufacturing InxAl1-xN composite barrier GaN-enhanced field-effect transistor |
09/11/2013 | CN102210017B Rapid thermal processing chamber with micro-positioning system |
09/11/2013 | CN102194794B Plasma damage detection structure as well as detection method and formation method thereof |
09/11/2013 | CN102187441B Ultraviolet reflector with coolant gas holes and method |
09/11/2013 | CN102171805B Bump stress mitigation layer for integrated circuits |
09/11/2013 | CN102160103B 显示装置 The display device |
09/11/2013 | CN102136432B Method of making semiconductor device through heat-resistant gluing sheet |