Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/11/2013CN102130065B Manufacturing method of gates of EEPROM (Electrically Erasable Programmable Read-Only Memory) and gates manufactured by using same
09/11/2013CN102130019B Semiconductor packaging process and die utilized in same
09/11/2013CN102122637B Detection structure, detection method and method for forming detection structure
09/11/2013CN102117822B RRAM memory cell and preparation method thereof
09/11/2013CN102115888B Etching method and PCB manufacture method using the etching method
09/11/2013CN102110655B Method for manufacturing EEPROM (electrically erasable programmable read-only memory) device
09/11/2013CN102105975B Action monitoring system for treating device
09/11/2013CN102104026B Method for manufacturing power metal oxide semiconductor (MOS) transistor device integrated with Schottky diodes
09/11/2013CN102104023B Method for manufacturing self-aligned high voltage complementary metal oxide semiconductor (CMOS) in bipolar-CMOS-double-diffused metal oxide semiconductor (DMOS) (BCD) process
09/11/2013CN102099511B Algan bulk crystal manufacturing method and algan substrate manufacturing method
09/11/2013CN102098872B Pad structure and manufacturing method thereof
09/11/2013CN102098863B Electrode board for plasma processing equipment and method for removing process sediments
09/11/2013CN102097404B Wafer level chip scale packaging structure with low substrate resistance and manufacturing method thereof
09/11/2013CN102097361B Forming method of dual-damascene structure
09/11/2013CN102087973B Method for reducing gate oxide film pinholes
09/11/2013CN102084466B Modular base-plate semiconductor polisher architecture
09/11/2013CN102083278B Method of manufacturing printed circuit board
09/11/2013CN102074575B IGBT (Insulated Gate Bipolar Translator) device structure and preparation method thereof
09/11/2013CN102074551B Semiconductor device packages and manufacturing method thereof
09/11/2013CN102064117B Method for encapsulating small-size chip
09/11/2013CN102064100B Process method for manufacturing emitter of silicon germanium (SiGe) heterojunction bipolar transistor
09/11/2013CN102057466B Phosphorous-comprising dopants and methods for forming phosphorous-doped regions in semiconductor substrates using phosphorous-comprising dopants
09/11/2013CN102054821B Packaging structure with internal shield and manufacturing method thereof
09/11/2013CN102054757B Manufacture method of integrated circuit copper interconnection structure
09/11/2013CN102049818B Cutting method for crystalline silicon ingot
09/11/2013CN102049816B Constant tension numerical control multi-thread square cutting machine without pressure sensor
09/11/2013CN102044569B 电容器及其制造方法 Capacitor and manufacturing method
09/11/2013CN102037561B Memory cells, memory cell constructions and memory cell programming methods
09/11/2013CN102034855B Silicon-germanium heterojunction bipolar transistor and manufacturing method thereof
09/11/2013CN102005418B Semiconductor device and method for manufacturing same
09/11/2013CN101996951B Nonvolatile memory structure and forming method thereof
09/11/2013CN101981659B Method for depositing an amorphous carbon film with improved density and step coverage
09/11/2013CN101958325B SONOS (Silicon Oxide Nitride Oxide Semiconductor) flash memory unit and formation method thereof
09/11/2013CN101958324B SONOS (Silicon Oxide Nitride Oxide Semiconductor) flash memory unit and formation method thereof
09/11/2013CN101958314B Manufacture method and usage of folded system-in-package
09/11/2013CN101951733B Insulating layer, printed circuit board with electronic component and producing method thereof
09/11/2013CN101924101B Structure of semiconductor passive device and making method thereof
09/11/2013CN101887935B Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
09/11/2013CN101866110B Rotation test pattern of windmill-shaped scribing groove
09/11/2013CN101853818B Packaging substrate structure with recess and manufacturing method thereof
09/11/2013CN101840888B Integrated circuit structure and method for forming the same
09/11/2013CN101752412B 双极晶体管及其制造方法 Bipolar transistor and its manufacturing method
09/11/2013CN101740876B Plasma antenna and plasma process apparatus including the same
09/11/2013CN101714571B Display device and manufacturing method of the display device
09/11/2013CN101653867B Laser processing apparatus, laser processing method, and method of manufacturing semiconductor device
09/11/2013CN101553420B Method for forming a back-to-back wafer batch to be positioned in a process boot, and handling system for forming the btb wafer batch
09/11/2013CN101548132B Discharge lamp, cable for connection, light source device, and exposure device
09/11/2013CN101528653B Radiation-sensitive composition
09/11/2013CN101505861B Advanced thermal control interface
09/11/2013CN101441995B Vacuum processing apparatus
09/11/2013CN101388370B Semiconductor device
09/11/2013CN101263592B Device and method for separating electronic components
09/11/2013CN101064348B Semiconductor device and method for manufacturing the same
09/11/2013CN101047190B Nonvolatile semiconductor storage device and method for manufacturing the same
09/10/2013USRE44491 Chemical mechanical polishing retaining ring
09/10/2013US8533634 Exposure mask manufacturing method, drawing apparatus, semiconductor device manufacturing method, and mask blanks product
09/10/2013US8532796 Contact processing using multi-input/multi-output (MIMO) models
09/10/2013US8531814 Removal of charge between a substrate and an electrostatic clamp
09/10/2013US8531619 Active matrix liquid crystal display device with overlapping conductive film and pixel electrode
09/10/2013US8531564 Capacitive element, manufacturing method of the same, solid-state imaging device, and imaging apparatus
09/10/2013US8531226 Bridge circuit providing a polarity insensitive power connection
09/10/2013US8531043 Planar encapsulation and mold cavity package in package system
09/10/2013US8531040 Controlled area solder bonding for dies
09/10/2013US8531039 Micro pin grid array with pin motion isolation
09/10/2013US8531038 Top layers of metal for high performance IC's
09/10/2013US8531035 Interconnect barrier structure and method
09/10/2013US8531033 Contact plug structure, semiconductor device, and method for forming contact plug
09/10/2013US8531031 Integrated circuit packages
09/10/2013US8531019 Heat dissipation methods and structures for semiconductor device
09/10/2013US8531012 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
09/10/2013US8531010 Semiconductor device including a pillar MOS transistor
09/10/2013US8531009 Package structure of three-dimensional stacking dice and method for manufacturing the same
09/10/2013US8531007 Semiconductor device and the method for manufacturing the same
09/10/2013US8531001 Complementary bipolar inverter
09/10/2013US8530996 Buck regulator structure comprising high-side and low-side voltage HEMT transistors
09/10/2013US8530981 Leadframe-based premolded package having acoustic air channel for micro-electro-mechanical system
09/10/2013US8530979 Semiconductor package and method for manufacturing the same
09/10/2013US8530976 Memory element transistors with reversed-workfunction gate conductors
09/10/2013US8530971 Borderless contacts for semiconductor devices
09/10/2013US8530970 Curvilinear wiring structure to reduce areas of high field density in an integrated circuit
09/10/2013US8530966 Semiconductor device
09/10/2013US8530962 Transistor of semiconductor device and method for manufacturing the same
09/10/2013US8530961 Compatible vertical double diffused metal oxide semiconductor transistor and lateral double diffused metal oxide semiconductor transistor and manufacture method thereof
09/10/2013US8530946 Photo detector device, photo sensor and spectrum sensor
09/10/2013US8530942 Semiconductor device and method of fabricating the same
09/10/2013US8530939 Cross-point memory structures
09/10/2013US8530938 Monolithic integrated composite group III-V and group IV semiconductor device and method for fabricating same
09/10/2013US8530934 Integrated circuit structures containing a strain-compensated compound semiconductor layer and methods and systems related thereto
09/10/2013US8530921 High voltage low current surface emitting LED
09/10/2013US8530900 Method for selectively forming crystalline silicon layer regions above gate electrodes
09/10/2013US8530896 Semiconductor device comprising a pixel unit including an auxiliary capacitor
09/10/2013US8530894 Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions
09/10/2013US8530893 Display substrate and method of manufacturing the same
09/10/2013US8530892 Semiconductor device
09/10/2013US8530890 Aligned nanotube bearing composite material
09/10/2013US8530876 Semiconductor memory device and method of manufacturing the same
09/10/2013US8530836 Electron-beam dimension measuring apparatus and electron-beam dimension measuring method
09/10/2013US8530788 Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device
09/10/2013US8530361 Process for producing silicon and oxide films from organoaminosilane precursors
09/10/2013US8530360 Method for low stress flip-chip assembly of fine-pitch semiconductor devices