Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/12/2013WO2013032956A3 Methods of fabricating semiconductor chip solder structures by reflowing a first and a second metallic layer and corresponding device
09/12/2013US20130238113 Substrate Processing Apparatus, Method of Transferring Substrate, Method of Manufacturing Semiconductor Device, and State Detecting Program
09/12/2013US20130237469 Aluminum post-etch residue removal with simultaneous surface passivation
09/12/2013US20130237065 Plasma reactor with conductive member in reaction chamber for shielding substrate from undesirable irradiation
09/12/2013US20130237064 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording medium
09/12/2013US20130237063 Split pumping method, apparatus, and system
09/12/2013US20130237062 Method for achieving smooth side walls after bosch etch process
09/12/2013US20130237061 Method and apparatus for manufacturing semiconductor device
09/12/2013US20130237060 FORMATION OF SiOCl-CONTAINING LAYER ON EXPOSED LOW-K SURFACES TO REDUCE LOW-K DAMAGE
09/12/2013US20130237059 FORMATION OF SiOCl-CONTAINING LAYER ON SPACER SIDEWALLS TO PREVENT CD LOSS DURING SPACER ETCH
09/12/2013US20130237058 Gas supply device, substrate processing apparatus and substrate processing method
09/12/2013US20130237057 Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces
09/12/2013US20130237056 Semiconductor Processing Methods
09/12/2013US20130237055 Method of redistributing functional element
09/12/2013US20130237054 Three dimensional integration and methods of through silicon via creation
09/12/2013US20130237053 Film forming method and film forming apparatus
09/12/2013US20130237051 Method of manufacturing semiconductor device
09/12/2013US20130237050 Method of manufacturing semiconductor device
09/12/2013US20130237049 Method of fabricating a package substrate
09/12/2013US20130237048 Method of fabricating erasable programmable single-ploy nonvolatile memory
09/12/2013US20130237046 Semiconductor process
09/12/2013US20130237045 Methods of fabricating semiconductor devices and semiconductor devices formed thereby
09/12/2013US20130237044 Method of manufacturing metal gates
09/12/2013US20130237043 SiC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
09/12/2013US20130237042 Method of manufacturing semiconductor device
09/12/2013US20130237041 Defect capping method for reduced defect density epitaxial articles
09/12/2013US20130237040 Resin composition, laminate and process for production thereof, structure and process for production thereof, and process for production of electronic device
09/12/2013US20130237039 Two-step hydrogen annealing process for creating uniform non-planar semiconductor devices at aggressive pitch
09/12/2013US20130237038 Two-step hydrogen annealing process for creating uniform non-planar semiconductor devices at aggressive pitch
09/12/2013US20130237037 Crystalline aluminum carbide thin film, semiconductor substrate having the aluminum carbide thin film formed thereon and method of fabricating the same
09/12/2013US20130237036 Method for manufacturing nitride semiconductor layer
09/12/2013US20130237035 Method and apparatus for laser singulation of brittle materials
09/12/2013US20130237034 Glass Piece and Methods of Manufacturing Glass Pieces and Semiconductor Devices with Glass Pieces
09/12/2013US20130237033 Method for manufacturing semiconductor device
09/12/2013US20130237032 Method of Manufacturing Silicon-On-Insulator Wafers
09/12/2013US20130237031 Memory devices having reduced interference between floating gates and methods of fabricating such devices
09/12/2013US20130237026 Finfet device having a strained region
09/12/2013US20130237025 Method for fabricating non-volatile memory device
09/12/2013US20130237023 Methods Of Forming A Vertical Transistor And At Least A Conductive Line Electrically Coupled Therewith
09/12/2013US20130237019 Stacked memory device and method of fabricating same
09/12/2013US20130237017 Pressure-sensitive adhesive tape for resin encapsulation and method for producing resin encapsulation type semiconductor device
09/12/2013US20130237016 Semiconductor device and semiconductor device manufacturing method
09/12/2013US20130237015 Microfabricated pillar fins for thermal management
09/12/2013US20130237014 Method of manufacturing semiconductor device
09/12/2013US20130237010 Method for manufacturing a gate-control diode semiconductor memory device
09/12/2013US20130237009 Method for manufacturing a gate-control diode semiconductor device
09/12/2013US20130237005 Method for fabricating semiconductor layer having textured surface and method for fabricating solar cell
09/12/2013US20130236994 Non-Uniform Alignment of Wafer Bumps with Substrate Solders
09/12/2013US20130236993 Method of fabricating semiconductor package
09/12/2013US20130236992 Testing method, testing device, and manufacturing method for laser diode
09/12/2013US20130236991 Resin coating device and a resin coating method
09/12/2013US20130236990 Coating apparatus and manufacturing method of coated body
09/12/2013US20130236989 Sidewall and chamfer protection during hard mask removal for interconnect patterning
09/12/2013US20130236987 System, method and apparatus for mask structure for patterning a workpiece by ions
09/12/2013US20130236274 Moisture and/or electrically conductive remains detection for wafers after rinse / dry process
09/12/2013US20130236138 Photoelectric composite substrate and method of manufacturing the same
09/12/2013US20130235895 Laser light source, laser processing device, and semiconductor processing method
09/12/2013US20130235668 Semiconductor device
09/12/2013US20130235666 Nonvolatile semiconductor memory device and method for manufacuring the same
09/12/2013US20130235654 Method, system, and device for base contact layout, such as for memory
09/12/2013US20130235652 Structure and method for a sram circuit
09/12/2013US20130235507 Electrostatic chuck
09/12/2013US20130235506 Method and Apparatus for Chuck Thermal Calibration
09/12/2013US20130234761 Charge Compensation Semiconductor Device
09/12/2013US20130234344 Flip-chip packaging techniques and configurations
09/12/2013US20130234343 Through-hole substrate and method of producing the same
09/12/2013US20130234341 Interposer substrate manufacturing method and interposer substrate
09/12/2013US20130234339 Semiconductor device and method of manufacturing same, and management system of semiconductor device
09/12/2013US20130234338 Semiconductor device and method for manufacturing the same
09/12/2013US20130234337 Semiconductor package and fabrication method thereof
09/12/2013US20130234336 Processes for forming integrated circuits and integrated circuits formed thereby
09/12/2013US20130234335 Hno3 single wafer clean process to strip nickel and for mol post etch
09/12/2013US20130234333 Copper interconnects having a titanium-titanium nitride assembly between copper and compound semiconductor
09/12/2013US20130234332 Semiconductor device and method for manufacturing the same
09/12/2013US20130234330 Semiconductor Packages and Methods of Formation Thereof
09/12/2013US20130234326 Semiconductor apparatus and method for manufacturing the same
09/12/2013US20130234321 Semiconductor device and method for manufacturing the same
09/12/2013US20130234320 Chip stack structure and method for fabricating the same
09/12/2013US20130234319 Semiconductor constructions
09/12/2013US20130234318 Semiconductor Device and Method of Forming Non-Linear Interconnect Layer with Extended Length for Joint Reliability
09/12/2013US20130234317 Packaging Methods and Packaged Semiconductor Devices
09/12/2013US20130234316 Self-aligned polymer passivation/aluminum pad
09/12/2013US20130234315 Structures and methods for detecting solder wetting of pedestal sidewalls
09/12/2013US20130234313 Grown carbon nanotube die attach structures, articles, devices, and processes for making them
09/12/2013US20130234310 Flip chip package and method of manufacturing the same
09/12/2013US20130234308 Method of manufacturing semiconductor device, semiconductor integrated device and method of manufacturing the same
09/12/2013US20130234306 Lead frame for assembling semiconductor device
09/12/2013US20130234305 3d transmission lines for semiconductors
09/12/2013US20130234303 Metal shield for integrated circuits
09/12/2013US20130234301 Patterned structure of semiconductor device and fabricating method thereof
09/12/2013US20130234299 Semiconductor device and method for manufacturing the same
09/12/2013US20130234297 Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devices
09/12/2013US20130234294 Semiconductor structure and fabrication method
09/12/2013US20130234288 Trench Structure for an MIM Capacitor and Method for Manufacturing the Same
09/12/2013US20130234287 High precision capacitor with low voltage coefficient of capacitance and method for manufacturing the same
09/12/2013US20130234284 Fuse and Integrated Conductor
09/12/2013US20130234283 Semiconductor Packages and Methods of Forming The Same
09/12/2013US20130234280 Shallow trench isolation in dynamic random access memory and manufacturing method thereof
09/12/2013US20130234279 Semiconductor device with buried word line structures and method of manufacturing the same
09/12/2013US20130234278 Schottky contact
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