Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/19/2013WO2013135302A1 Pressure transmitting device for bonding chips onto a substrate
09/19/2013WO2013135125A1 Tft array substrate, fabrication method thereof and display device
09/19/2013WO2013135062A1 Array substrate and manufacturing method thereof
09/19/2013WO2013135052A1 Z-axis lifting mechanism capable of balancing stressed state
09/19/2013WO2013135005A1 Semiconductor structure and method for forming the same
09/19/2013WO2013135002A1 Method for preparing composite substrate for gan growth
09/19/2013WO2013135001A1 Composite substrate used for gan growth
09/19/2013WO2013134997A1 Molecular glass photoresist with bisphenol a skeleton structure and preparation method and application thereof
09/19/2013WO2013134942A1 Method and system for transport control of liquid crystal panel substrate
09/19/2013WO2013134899A1 Semiconductor device and producing method for same
09/19/2013WO2013134898A1 Semiconductor device and producing method for same
09/19/2013WO2013106422A3 Hydrocarbon resource processing device including spirally wound electrical conductors and related methods
09/19/2013WO2013103379A3 N-metal film deposition with initiation layer
09/19/2013WO2013072525A3 Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure
09/19/2013WO2013064906A4 Ultrathin wafer debonding systems
09/19/2013WO2013010512A3 Apparatus and method of electrical testing for flip chip
09/19/2013WO2012106834A8 Semiconductor device and related fabrication methods
09/19/2013US20130245969 Method to detect wafer arcing in semiconductor manufacturing equipment
09/19/2013US20130245450 Method of manufacturing an ultrasound transducer and devices including an ultrasound transducer
09/19/2013US20130244922 Azeotropic compositions comprising methyl perfluoropentene ethers for cleaning applications
09/19/2013US20130244550 CO2 Nozzles
09/19/2013US20130244449 Methods and Apparatus For Patterning Photovoltaic Devices and Materials For Use With Such Devices
09/19/2013US20130244448 Precursors for CVD Silicon Carbo-Nitride Films
09/19/2013US20130244447 Oxidation of metallic films
09/19/2013US20130244446 Method for Forming Si-Containing Film Using Two Precursors by ALD
09/19/2013US20130244445 Method of Fabricating Semiconductor Device
09/19/2013US20130244444 Method of producing a semiconductor substrate product and etching liquid
09/19/2013US20130244443 Method of producing a semiconductor substrate product and etching liquid
09/19/2013US20130244442 Ultra high-speed wet etching apparatus
09/19/2013US20130244441 Composite showerhead electrode assembly for a plasma processing apparatus
09/19/2013US20130244440 Chamber filler kit for plasma etch chamber useful for fast gas switching
09/19/2013US20130244439 Removable templates for directed self assembly
09/19/2013US20130244438 Photolithographic methods
09/19/2013US20130244437 Methods of forming features on an integrated circuit product using a novel compound sidewall image transfer technique
09/19/2013US20130244436 Masking techniques and contact imprint reticles for dense semiconductor fabrication
09/19/2013US20130244435 Semiconductor device having an n-channel mos transistor, a p-channel mos transistor and a contracting film
09/19/2013US20130244434 Method of fabricating a semiconductor device
09/19/2013US20130244433 Cmp compositions selective for oxide and nitride with high removal rate and low defectivity
09/19/2013US20130244432 Cmp compositions selective for oxide and nitride with high removal rate and low defectivity
09/19/2013US20130244431 Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
09/19/2013US20130244430 Double Patterning Method for Semiconductor Devices
09/19/2013US20130244428 Method for manufacturing silicon carbide semiconductor device
09/19/2013US20130244427 Methods of making jogged layout routings double patterning compliant
09/19/2013US20130244426 Method for obtaining extreme selectivity of metal nitrides and metal oxides
09/19/2013US20130244425 Formation of a Masking Layer on a Dielectric Region to Facilitate Formation of a Capping Layer on Electrically Conductive Regions Separated by the Dielectric Region
09/19/2013US20130244424 Interconnect structures and methods of manufacturing of interconnect structures
09/19/2013US20130244423 Electroless gap fill
09/19/2013US20130244422 Methods of forming copper-based conductive structures on semiconductor devices
09/19/2013US20130244421 Methods of forming copper-based conductive structures on an integrated circuit device
09/19/2013US20130244420 Optimized annular copper tsv
09/19/2013US20130244419 Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same
09/19/2013US20130244418 Method of manufacturing a semiconductor component
09/19/2013US20130244417 Template Wafer Fabrication Process for Small Pitch Flip-Chip Interconnect Hybridization
09/19/2013US20130244415 Floating gate flash cell device and method for partially etching silicon gate to form the same
09/19/2013US20130244412 Replacement metal gate transistors with reduced gate oxide leakage
09/19/2013US20130244411 Diodes with a dog bone or cap-shaped junction profile to enhance esd performance, and other substructures, integrated circuits and processes of manufacture and testing
09/19/2013US20130244410 Methods of forming bulk iii-nitride materials on metal-nitride growth template layers, and structures formed by such methods
09/19/2013US20130244409 Schottky barrier diode and method for making the same
09/19/2013US20130244408 Systems And Methods For Growing A Non-Phase Separated Group-III Nitride Semiconductor Alloy
09/19/2013US20130244407 Manufacturing method of semiconductor device
09/19/2013US20130244406 Fabrication method and fabrication apparatus of group iii nitride crystal substance
09/19/2013US20130244405 Method of manufacturing semiconductor device
09/19/2013US20130244404 Method of singulating a thin semiconductor wafer
09/19/2013US20130244403 Method and device for cutting semiconductor wafers
09/19/2013US20130244402 Adhesive Composition, An Adhesive Sheet and a Production Method of a Semiconductor Device
09/19/2013US20130244401 Adhesive Composition, An Adhesive Sheet and a Production Method of a Semiconductor Device
09/19/2013US20130244400 Method and apparatus for temporary bonding of ultra thin wafers
09/19/2013US20130244399 Method of forming a laminated semiconductor film
09/19/2013US20130244398 Method of manufacturing semiconductor memory device
09/19/2013US20130244397 Multi-drain semiconductor power device and edge-termination structure thereof
09/19/2013US20130244394 Method for fabricating capacitor with high aspect ratio
09/19/2013US20130244392 Method of fabricating fin-field effect transistors (finfets) having different fin widths
09/19/2013US20130244388 Methods for fabricating integrated circuits with reduced electrical parameter variation
09/19/2013US20130244387 Methods for fabricating integrated circuits
09/19/2013US20130244384 Soldering relief method and semiconductor device employing same
09/19/2013US20130244383 Curable protectant for electronic assemblies
09/19/2013US20130244382 High precision self aligning die for embedded die packaging
09/19/2013US20130244381 Manufacturing method of semiconductor device
09/19/2013US20130244379 Semiconductor package and method of fabricating the same
09/19/2013US20130244378 Underfill curing method using carrier
09/19/2013US20130244377 Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape
09/19/2013US20130244376 Fully molded fan-out
09/19/2013US20130244369 Cleaning method of silicon substrate and manufacturing method of solar battery
09/19/2013US20130244352 Method of manufacturing nozzle plate
09/19/2013US20130244350 Substrate bonding apparatus and substrate bonding method
09/19/2013US20130244349 Impurity analysis device and method
09/19/2013US20130244348 Fine tuning highly resistive substrate resistivity and structures thereof
09/19/2013US20130244347 Laser annealing method, laser annealing apparatus, and method for manufacturing thin film transistor
09/19/2013US20130244346 Packaging Methods, Material Dispensing Methods and Apparatuses, and Automated Measurement Systems
09/19/2013US20130244342 Reverse Partial Etching Scheme for Magnetic Device Applications
09/19/2013US20130243893 Molded leadframe substrate semiconductor package
09/19/2013US20130243560 Locking gate device
09/19/2013US20130243550 Substrate Processing Apparatus, Method of Processing Substrate, Method of Manufacturing Semiconductor Device and Non Transitory Computer Readable Recording Medium on which Program for Performing Method of Manufacturing Semiconductor Device is Recorded
09/19/2013US20130242654 Memory devices including vertical pillars and methods of manufacturing and operating the same
09/19/2013US20130242649 Method, system, and device for storage cell, such as for memory
09/19/2013US20130242648 Approach for phase change memory cells targeting different device specifications
09/19/2013US20130242646 Magnetoresistive random access memory (mram) die including an integrated magnetic security structure
09/19/2013US20130242527 Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
09/19/2013US20130242394 Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method with two optical elements having different thicknesses
09/19/2013US20130242280 Illumination optical apparatus and projection exposure apparatus
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