Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/19/2013US20130241087 Semiconductor apparatus and method for producing the same
09/19/2013US20130241085 Semiconductor device and method for fabricating the same
09/19/2013US20130241083 Joint Structure for Substrates and Methods of Forming
09/19/2013US20130241081 Combination for composite layered chip package
09/19/2013US20130241079 Novel conductor layout technique to reduce stress-induced void formations
09/19/2013US20130241077 Semiconductor Package and Methods of Formation Thereof
09/19/2013US20130241076 Electronic device with reduced non-device edge area
09/19/2013US20130241075 Contact or via critical dimension control with novel closed loop control system in chemical mechanical planarization process
09/19/2013US20130241073 Semiconductor device and manufacturing method of semiconductor device
09/19/2013US20130241072 Semiconductor device and manufacturing method of semiconductor device
09/19/2013US20130241071 Semiconductor Device and Method of Forming Compliant Conductive Interconnect Structure in Flipchip Package
09/19/2013US20130241068 Semiconductor device and method for forming the same
09/19/2013US20130241064 Semiconductor structure and method of forming the same
09/19/2013US20130241061 Semiconductor element and method of manufacturing same
09/19/2013US20130241060 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
09/19/2013US20130241057 Methods and Apparatus for Direct Connections to Through Vias
09/19/2013US20130241056 Well-through type diode element/component and manufacturing method for them
09/19/2013US20130241055 Multi-Chip Packages and Methods of Manufacturing the Same
09/19/2013US20130241054 Semiconductor apparatus and method of fabricating the same
09/19/2013US20130241053 Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereof
09/19/2013US20130241052 Methods and Apparatus for Solder on Slot Connections in Package on Package Structures
09/19/2013US20130241051 Controlled area solder bonding for dies
09/19/2013US20130241050 Integrated optoelectronic interconnects with side-mounted transducers
09/19/2013US20130241049 Methods and Apparatus of Guard Rings for Wafer-Level-Packaging
09/19/2013US20130241048 Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers
09/19/2013US20130241045 Packages and methods for packaging
09/19/2013US20130241041 Semiconductor packages with lead extensions and related methods
09/19/2013US20130241040 Semiconductor device and method of manufacturing the same
09/19/2013US20130241039 Semiconductor Device and Method of Mounting Cover to Semiconductor Die and Interposer with Adhesive Material
09/19/2013US20130241038 Structure and method for creating a reusable template for detachable thin film substrates
09/19/2013US20130241035 Strained Channel Dynamic Random Access Memory Devices
09/19/2013US20130241031 Programmable fuse structure and methods of forming
09/19/2013US20130241029 Semiconductor device and a method of manufacturing the same and designing the same
09/19/2013US20130241028 Silicon-on-insulator substrate and fabrication method
09/19/2013US20130241025 Electronic system having increased coupling by using horizontal and vertical communication channels
09/19/2013US20130241020 Solid image-pickup device with flexible circuit substrate
09/19/2013US20130241007 Use of band edge gate metals as source drain contacts
09/19/2013US20130241004 Semiconductor device and method of manufacturing the same
09/19/2013US20130241003 Finfet and fabricating method thereof
09/19/2013US20130241002 Resistor and manufacturing method thereof
09/19/2013US20130241001 Semiconductor device and method for fabricating the same
09/19/2013US20130241000 High-integration semiconductor memory device and method of manufacturing the same
09/19/2013US20130240999 Effecting selectivity of silicon or silicon-germanium deposition on a silicon or silicon-germanium substrate by doping
09/19/2013US20130240997 Contact bars for modifying stress in semiconductor device and related method
09/19/2013US20130240996 Semiconductor Device and Method of Manufacturing the Same
09/19/2013US20130240995 Thin-film transistor array substrate and manufacturing method thereof
09/19/2013US20130240994 Semiconductor device and method of manufacturing the same
09/19/2013US20130240986 Semiconductor Device Including Charged Structure and Methods for Manufacturing A Semiconductor Device
09/19/2013US20130240985 Semiconductor Device Including Auxiliary Structure and Methods for Manufacturing A Semiconductor Device
09/19/2013US20130240984 Transistor and method of manufacturing the same
09/19/2013US20130240980 Schottky diode integrated into LDMOS
09/19/2013US20130240976 Nonvolatile semiconductor memory device and manufacturing method thereof
09/19/2013US20130240970 Nonvolatile semiconductor memory device and method of manufacturing the same
09/19/2013US20130240969 Semiconductor device and method for fabricating semiconductor device
09/19/2013US20130240968 Semiconductor device and method of manufacturing the same
09/19/2013US20130240965 Semiconductor device having buried bit line, and method for fabricating the same
09/19/2013US20130240963 STT-MRAM Reference Layer Having Substantially Reduced Stray Field and Consisting of a Single Magnetic Domain
09/19/2013US20130240958 Semiconductor structure and method for forming the same
09/19/2013US20130240957 Method of forming gate dielectric layer and method of fabricating semiconductor device
09/19/2013US20130240956 Semiconductor device and method for fabricating the same
09/19/2013US20130240952 Plasma protection diode for a hemt device
09/19/2013US20130240919 Semiconductor device and a manufacturing method thereof
09/19/2013US20130240909 Semiconductor device and method for manufacturing semiconductor device
09/19/2013US20130240906 Sic semiconductor device and manufacturing method thereof
09/19/2013US20130240905 Silicon Carbide Rectifier
09/19/2013US20130240903 Method and system for ultra miniaturized packages for transient voltage suppressors
09/19/2013US20130240902 Semiconductor Arrangement
09/19/2013US20130240900 Semiconductor device and method for producing the same
09/19/2013US20130240894 Overvoltage Protection Device for Compound Semiconductor Field Effect Transistors
09/19/2013US20130240892 Method for converting semiconductor layers
09/19/2013US20130240888 Method of fabricating thin film transistor substrate and organic light emitting display device using the same
09/19/2013US20130240883 Contact Test Structure and Method
09/19/2013US20130240882 Die, wafer and method of processing a wafer
09/19/2013US20130240871 Process for production of functional device, process for production of ferroelectric material layer, process for production of field effect transistor, thin film transistor, field effect transistor, and piezoelectric inkjet head
09/19/2013US20130240836 FinFET Having Superlattice Stressor
09/19/2013US20130240830 Direct and sequential formation of monolayers of boron nitride and graphene on substrates
09/19/2013US20130240829 Quantum dot structure, method for forming quantum dot structure, wavelength conversion element, light-light conversion device, and photoelectric conversion device
09/19/2013US20130240821 Three dimensional rram device, and methods of making same
09/19/2013US20130240759 Method and Apparatus for Clamping and Cooling a Substrate for ION Implantation
09/19/2013US20130240729 Sample analysis apparatus and sample analysis program
09/19/2013US20130240637 Showerhead for cvd depositions
09/19/2013US20130240632 Card Lamination
09/19/2013US20130240378 Nanopore device with improved sensitivity and method of fabricating the same
09/19/2013US20130240363 Methods for fabricating thin film solar cells
09/19/2013US20130240147 Methods and apparatus for selectively modulating azimuthal non-uniformity in a plasma processing system
09/19/2013US20130240146 Plasma apparatus and method for producing the same
09/19/2013US20130240127 Method for fabricating a semiconductor device and semiconductor production apparatus
09/19/2013US20130240113 Device and method for processing wafers
09/19/2013US20130239893 Stabilization method of film forming apparatus and film forming apparatus
09/19/2013US20130239887 Coating treatment method, coating treatment apparatus, and computer-readable storage medium
09/19/2013US20130239883 Arrangement for the production of structured substrates
09/19/2013US20130239591 Thermal electric cooler and method
09/19/2013DE112011104446T5 Chemische Gasphasenabscheidungsvorrichtung und Verfahren zum Herstellen von lichtemittierenden Vorrichtungen mit derselben Chemical vapor deposition apparatus and method of producing light emitting devices with the same
09/19/2013DE10297658B4 Verfahren und System zum Reparieren defekter Photomasken Method and system for repairing defective photomasks
09/19/2013DE102013204344A1 Halbleitervorrichtung und Verfahren zum Herstellen selbiger A semiconductor device and method of manufacturing Selbiger
09/19/2013DE102013204275A1 Halbleiteranordnung Semiconductor device
09/19/2013DE102013204252A1 Halbleiterbauelement Semiconductor device
09/19/2013DE102013102786A1 Halbleiterpackage und Verfahren zu dessen Ausbildung Semiconductor package and method of training
09/19/2013DE102013102574A1 Method for manufacturing back contact solar cell, involves diffusing second type dopant containing paste into solar cell substrate in common-emitter type impurity regions by sintering second type dopant containing paste
09/19/2013DE102013102573A1 Method for manufacturing solar cell e.g. interdigitated-back contact solar cell, involves cleaning cell substrate, and diffusing boron from boron source layer and diffusing phosphorus into solar cell substrate in common diffusion step
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