Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/26/2013US20130248509 Heating device and semiconductor manufacturing apparatus
09/26/2013US20130248114 Chip bonding apparatus
09/26/2013US20130248113 Substantially non-oxidizing plasma treatment devices and processes
09/26/2013US20130248099 Method of manufacturing a semiconductor device and substrate separating apparatus
09/26/2013US20130247967 Gaseous ozone (o3) treatment for solar cell fabrication
09/26/2013US20130247943 Substrate cleaning method and substrate cleaning apparatus
09/26/2013US20130247937 Substrate processing apparatus and its maintenance method, substrate transfer method and program
09/26/2013US20130247935 Getter reticle
09/26/2013US20130247825 Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus
09/26/2013US20130247816 Film-forming apparatus for the formation of silicon carbide and film-forming method for the formation of silicon carbide
09/26/2013US20130247342 Capping system
09/26/2013DE112012000310T5 Silicium-Nanoröhren-Mosfet Silicon nanotube MOSFET
09/26/2013DE112012000306T5 Verfahren zum Herstellen eines Silizium-Einkristallwafers und eines thermisch behandelten Wafers A method for manufacturing a silicon single crystal wafer and a wafer thermally treated
09/26/2013DE112011103975T5 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelementes A semiconductor device and method of manufacturing a semiconductor device
09/26/2013DE112011103915T5 MOS-Transistor, welcher eine Struktur von kombinierter Quelle mit niedrigem Stromverbrauch aufweist und Verfahren zu seiner Herstellung MOS transistor having a structure of a combined source with low power consumption and process for its preparation
09/26/2013DE112011103730T5 Isolationsstrukturen mit anstossendem SOI-Übergang und Einheiten sowie Verfahren zur Herstellung Isolation structures with abutting SOI and transition units and methods of making
09/26/2013DE112011103569T5 Verfahren zum Herstellen eines SiC-Bipolarübergangstransistors und SiC-Bipolarübergangstransistor hieraus A method of manufacturing a SiC-SiC bipolar junction transistor and Bipolarübergangstransistors thereof
09/26/2013DE112011103491T5 Suszeptor und Verfahren zum Herstellen eines Epitaxialwafers Susceptor and method for manufacturing an epitaxial wafer
09/26/2013DE112011102518T5 Bidirektionaler, in Serie gegeneinander geschalteter, gestapelter SCR für Hochspannungs-Pin-ESD-Schutz, Verfahren zur Fertigung und Konstruktionsstrukturen Bidirectional of back-connected, stacked SCR for high voltage pin ESD protection, methods of manufacture and construction of structures
09/26/2013DE112010002747T5 Siliziumepitaxialwafer und Verfahren zur Herstellung desselben Siliziumepitaxialwafer and method of manufacturing the same
09/26/2013DE10217073B4 Miniatur-Halbleitergehäuse für optoelektronische Bauelemente Miniature semiconductor package for optoelectronic devices
09/26/2013DE102013203232A1 Bonden von Komponenten zur Herstellung von elektronischen Anordnungen und elektronische Anordnungen einschließlich gebondeter Komponenten Bonding of components for the production of electronic devices and electronic devices including bonded components
09/26/2013DE102013103099A1 Feldeffekt-Halbleitervorrichtung mit verringerten Spannungen und Verfahren zu ihrer Herstellung Field effect semiconductor device with reduced voltages and processes for their preparation
09/26/2013DE102013102893A1 Ein Schaltkreisgehäuse, ein elektronisches Schaltkreisgehäuse und Verfahren zum Verkapseln eines elektronischen Schaltkreises A circuit package, an electronic circuit package and method for encapsulating an electronic circuit
09/26/2013DE102013004942A1 Verfahren zur Herstellung von chemisch-mechanischen Polierschichten, die ein Fenster aufweisen Process for the preparation of chemical mechanical polishing layers having a window
09/26/2013DE102012223248A1 Abdecksystem Cover system
09/26/2013DE102012220822B4 Verfahren zur herstellung eines finfet und finfetstruktur mit verbesserter gate-planarität Process for the preparation of a FinFET gate and finfetstruktur with improved planarity
09/26/2013DE102012218304A1 Leistungshalbleitervorrichtungsmodul Power semiconductor device module
09/26/2013DE102012204539A1 Power transistor e.g. vertical MOSFET, has graphene layer that is formed on source regions and is partially overlapped with the gate electrode so that ducts are formed on graphene layer
09/26/2013DE102012105737A1 Bauelement und Verfahren zu dessen Herstellung Device and process for its preparation
09/26/2013DE102012105457B3 Layer system for manufacturing transparent electrode used in e.g. solar cell, has conductive oxide layer including surface structures with average height, which is larger is than average height of structures of base layer around factor
09/26/2013DE102012102565A1 Verfahren zur Herstellung eines elektrischen Bauteils, Kodepositionsanlage und elektrisches Bauteil A process for preparing an electrical component, electric component and Kodepositionsanlage
09/26/2013DE102012102465A1 Telescopic arm for transporting bi-directional translational substrate within vacuum treatment equipment for aircraft engine, has clutches provided inside main tube to move telescopic pipes parallel to thrust units relative to tube
09/26/2013DE102012102456A1 Anordnung und Verfahren zum Prüfen eines Solarmoduls Arrangement and method for testing a solar module
09/26/2013DE102006018898B4 Laserbearbeitungsverfahren Laser processing method
09/26/2013DE102005033953B4 Waferteilungsverfahren und -vorrichtung Wafer dividing method and apparatus
09/25/2013EP2642529A1 Method for producing photovoltaic cell
09/25/2013EP2642528A1 Method for producing solar cell
09/25/2013EP2642527A1 Method for producing photovoltaic cell
09/25/2013EP2642520A2 Embedded flash memory
09/25/2013EP2642516A2 Method of manufacturing semiconductor element
09/25/2013EP2642515A2 Semiconductor element and method of manufacturing same
09/25/2013EP2642514A1 Silicon carbide semiconductor device
09/25/2013EP2642513A2 Techniques for processing a substrate
09/25/2013EP2642512A2 Techniques for processing a substrate
09/25/2013EP2642511A1 Member for mounting and temperature controlled mounting device
09/25/2013EP2642510A2 Composition for forming ferroelectric thin film, method for forming ferroelectric thin film, ferroelectric thin film, and complex electronic component
09/25/2013EP2642175A1 Luminaire and manufacturing method of the same
09/25/2013EP2642001A1 Method for producing epitaxial silicon carbide single crystal substrate
09/25/2013EP2641271A1 STRUCTURE AND METHOD FOR Vt TUNING AND SHORT CHANNEL CONTROL WITH HIGH K/METAL GATE MOSFETs
09/25/2013EP2641268A2 Polishing pad comprising transmissive region
09/25/2013EP2641267A1 Semiconductor wafer comprising gallium nitride layer having one or more silicon nitride interlayer therein
09/25/2013EP2641266A1 Direct current ion implantation for solid phase epitaxial regrowth in solar cell fabrication
09/25/2013EP2641265A1 Electronic device for radiofrequency or power applications and process for manufacturing such a device
09/25/2013EP2641264A1 Shallow heavily doped semiconductor layer by cyclic selective epitaxial deposition process
09/25/2013EP2641259A1 Improved simultaneous multiple ion implantation process and apparatus semiconductor structure made using same
09/25/2013EP2641258A1 Semiconductor structure made using improved multiple ion implantation process
09/25/2013EP2641257A1 Semiconductor structure made using improved pseudo-simultaneous multiple ion implantation process
09/25/2013CN203218245U Mechanical hand capable of automatically taking and placing wafer
09/25/2013CN203218244U Clamp for wet chemical corrosion technology
09/25/2013CN203218243U Positioning pad pasting plate suitable for semiconductor power device wafer
09/25/2013CN203218242U Optical wand sticking positioning device
09/25/2013CN203218241U Substrate locator
09/25/2013CN203218240U Drawer-type mechanism for transferring cell string
09/25/2013CN203218239U Track of semiconductor packaging chip sorting machine
09/25/2013CN203218238U Adjustable material box
09/25/2013CN203218237U Device for disposing wafers
09/25/2013CN203218236U Fixture structure of rotary drying machine
09/25/2013CN203218235U Insert and electroplating chamber apparatus
09/25/2013CN203218234U Wet etching machine
09/25/2013CN203218233U Film sticking roller clamping tool assembly
09/25/2013CN203218232U Device for sticking blue film on surface of wafer
09/25/2013CN203218231U Substrate aligning component and substrate aligning device
09/25/2013CN203218230U Pressing claw handle for semiconductor encapsulation aluminium wire bonding
09/25/2013CN203218229U Copper wire bonding structure between chip pad points
09/25/2013CN203218228U Bonding tool for semiconductor module
09/25/2013CN203218227U Tool for bonding wire machine in chip packaging
09/25/2013CN203218226U Steel nozzle for PDFN chip aluminium tape bonding
09/25/2013CN203218225U Rib punching system for DIP plastic packaging framework
09/25/2013CN203218224U Fluid supply box and etching device
09/25/2013CN203210645U Intelligent temperature switching system for semiconductor plastic packaging press
09/25/2013CN203210458U Mold for reducing cracking of products in integrated circuit package rib cutting technology
09/25/2013CN203209863U Material-stacking-prevention mechanism of discharging portion of weld line device in integrated circuit package
09/25/2013CN1983661B Transparent polymeric electrode for electro-optical structures
09/25/2013CN1914626B 半导体器件 Semiconductor devices
09/25/2013CN103329633A Spray member for use in semiconductor manufacture, and plasma treatment apparatus having same
09/25/2013CN103329295A System and method for manufacturing light emitting element, and system and method for manufacturing light emitting element package
09/25/2013CN103329276A Method for manufacturing nitride semiconductor element
09/25/2013CN103329275A Thin film semiconductor device and method for manufacturing same
09/25/2013CN103329274A Selective germanium P-contact metalization through trench
09/25/2013CN103329273A 半导体装置及其制造方法 Semiconductor device and manufacturing method
09/25/2013CN103329270A Memory devices having source lines directly coupled to body regions and methods
09/25/2013CN103329269A Pulse method of oxidizing sidewall dielectrics for high capacitance applications
09/25/2013CN103329268A Semiconductor device and manufacturing method therefor
09/25/2013CN103329259A Plasma treatment of silicon nitride and silicon oxynitride
09/25/2013CN103329258A Wafer transport robot
09/25/2013CN103329257A Conveyance mechanism for article being processed
09/25/2013CN103329256A Semiconductor devices with back surface isolation
09/25/2013CN103329255A Method for manufacturing reverse-blocking semiconductor element
09/25/2013CN103329254A Substrate having etching mask and method for producing same