Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/02/2013DE102012102847A1 Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements The light-emitting semiconductor device and method of manufacturing a light-emitting semiconductor component
10/02/2013DE102012006521A1 Handhabungseinheit für Waferscheiben sowie Verfahren zum Aufnehmen einer Waferscheibe Handling unit for wafers and method for receiving a wafer disk
10/02/2013DE102012006045A1 Production of electroconductive or semiconductive multilayer film used for manufacture of e.g. field effect transistor, involves coating precursor solution or dispersion containing organometallic compound(s) on substrate, and drying
10/02/2013DE102011016335B4 Nickelhaltige und ätzende druckbare Paste sowie Verfahren zur Bildung von elektrischen Kontakten beim Herstellen einer Solarzelle Nickel-containing corrosive and printable paste, as well as methods of forming electrical contacts in the manufacture of a solar cell
10/02/2013DE102009001919B4 Verfahren zum Herstellen einer Mehrzahl von integrierten Halbleiterbauelementen A method of manufacturing a plurality of integrated semiconductor components
10/02/2013DE102008051466B4 Bauelement, das einen Halbleiterchip mit mehreren Elektroden enthält und Verfahren zur Herstellung eines solchen Bauelements Component that includes a semiconductor chip having a plurality of electrodes and methods for producing such a component
10/02/2013DE102007038343B9 Verfahren zur Bearbeitung von Wafern A method for processing wafers
10/02/2013DE102006056598B4 Verfahren zur Herstellung eines Transistorbauelements für eine integrierte Schaltung A process for producing a transistor device for an integrated circuit
10/02/2013CN203225246U Wafer clamping rotating device and wafer cleaning groove
10/02/2013CN203225245U High-quality wafer ring
10/02/2013CN203225244U High-pass wafer position correcting system
10/02/2013CN203225243U Structure of quartz boat with skewed slots
10/02/2013CN203225242U Grabbing device used for conveying electronic elements
10/02/2013CN203225241U Grabbing device used for conveying wafer
10/02/2013CN203225240U 传送辊 Transport rollers
10/02/2013CN203225239U Groove type wet method device
10/02/2013CN203225238U Wafer breaker
10/02/2013CN203225237U Wafer waxing bench
10/02/2013CN203225236U Semiconductor product detection device
10/02/2013CN203225235U Anti-acid mold
10/02/2013CN103339749A Wafer-level light emitting diode package and method for manufacturing thereof
10/02/2013CN103339733A Method for producing semiconductor device, and semiconductor device
10/02/2013CN103339732A Vertical semiconductor device with thinned substrate
10/02/2013CN103339731A Sic bipolar junction transistor with overgrown emitter
10/02/2013CN103339728A Memory devices with a connecting region having a band gap lower than a band gap of a body region
10/02/2013CN103339725A Compliant interconnects in wafers
10/02/2013CN103339721A Triboelectric charge controlled electro-static clamp
10/02/2013CN103339720A System for wafer-level phosphor deposition
10/02/2013CN103339719A Pd-coated copper ball bonding wire
10/02/2013CN103339718A Method for manufacturing Sn alloy bump
10/02/2013CN103339717A Stacked microelectronic assembly with tsvs formed in stages and carrier above chip
10/02/2013CN103339716A Single layer BGA substrate process
10/02/2013CN103339715A 氧化物半导体膜以及半导体装置 An oxide semiconductor film and a semiconductor device
10/02/2013CN103339714A Coating liquid for forming metal oxide thin film, metal oxide thin film, field effect transistor, and method for producing the field effect transistor
10/02/2013CN103339713A Methods for reducing the metal content in the device layer of soi structures and soi structures produced by such methods
10/02/2013CN103339712A Laser annealing method and laser annealing apparatus
10/02/2013CN103339711A Imaging devices, methods of forming same, and methods of forming semiconductor device structures
10/02/2013CN103339710A Method for manufacturing SOI wafer
10/02/2013CN103339687A Electroconductive particles and anisotropic conductive material using same
10/02/2013CN103339569A Composition for forming resist underlayer films, containing silicon that bears diketone-structure-containing organic group
10/02/2013CN103339219A CMP polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material
10/02/2013CN103339206A 树脂组合物和半导体装置 The resin composition and a semiconductor device
10/02/2013CN103338891A Laser processing systems and methods for beam dithering and skiving
10/02/2013CN103337565A A high-temperature strong acid groove used for an LED chip sidewall corrosion technique
10/02/2013CN103337554A Solar cell sheet electric sheet-splitting device
10/02/2013CN103337523A Super potential barrier rectification device with inclined grooves, and manufacturing method thereof
10/02/2013CN103337522A Metal oxide thin film transistor array substrate and manufacturing method thereof
10/02/2013CN103337520A Double-transconductance semiconductor switching device and manufacturing method thereof
10/02/2013CN103337519A 场效应晶体管及其形成方法 And method of forming a field effect transistor
10/02/2013CN103337518A Semiconductor device including charged structure and methods for manufacturing a semiconductor device
10/02/2013CN103337516A Enhanced switching device and manufacturing method thereof
10/02/2013CN103337513A 半导体结构及其形成方法 And a method for forming a semiconductor structure
10/02/2013CN103337508A Backside illuminated CMOS image sensor and manufacturing method thereof
10/02/2013CN103337506A Preparation technology of silicon epitaxial wafer for CCD device
10/02/2013CN103337501A Array substrate, manufacturing method thereof and flat panel display device
10/02/2013CN103337500A Active component array substrate and manufacturing method thereof
10/02/2013CN103337499A Integrated schottky diode for hemts
10/02/2013CN103337498A BCD semiconductor device and manufacturing method thereof
10/02/2013CN103337497A Array substrate, manufacturing method thereof and display device
10/02/2013CN103337493A Integrated through hole multilayer electronic structure extending in a direction in plane
10/02/2013CN103337492A Trimming structure for reducing fuse wire hillocks and manufacturing method thereof
10/02/2013CN103337491A Metal capacitor for all-directional connection and layout method
10/02/2013CN103337487A Method and apparatus for attachment of integrated circuits
10/02/2013CN103337483A Ultrathin VSOP (very thin small outline package) packaging part and production method thereof
10/02/2013CN103337482A Static random access memory transistor unit manufacturing method capable of adjusting threshold voltage
10/02/2013CN103337481A P-type IIB-VIA group iii v semiconductor nanowire schottky junction based non-volatile storage and preparation method thereof
10/02/2013CN103337480A Active element substrate, manufacture method thereof and manufacture method of display
10/02/2013CN103337479A Array substrate, display device and fabrication method of array substrate
10/02/2013CN103337478A Fabrication method of flexible organic electroluminescence diode display
10/02/2013CN103337477A Fabrication method of array substrate, array substrate and display apparatus
10/02/2013CN103337476A Method for reducing critical size of copper interconnection groove
10/02/2013CN103337475A Double-structure contact hole synchronous-etching technology
10/02/2013CN103337474A A manufacturing method for a semiconductor device
10/02/2013CN103337473A Method for protecting shallow trench isolation region
10/02/2013CN103337472A Pins with different heights for semiconductor coating device and use method thereof
10/02/2013CN103337471A Vacuum chuck for solar photovoltaic silicon cell
10/02/2013CN103337470A Transmitting boat for full-automatic loading machine
10/02/2013CN103337469A Method and system for in-situ deposition of barrier layer and seed crystal layer
10/02/2013CN103337468A Testing structure
10/02/2013CN103337467A Measuring method for removing amount of bottom metal layer of contact hole
10/02/2013CN103337466A Protection ring for preventing short circuit of test structure, and manufacturing method and package testing method thereof
10/02/2013CN103337465A Method for detecting etching residue
10/02/2013CN103337464A Novel metal diffusion bonding technology
10/02/2013CN103337463A Production method and structure of copper pillar micro bump
10/02/2013CN103337462A Preparation method of thin film transistor
10/02/2013CN103337461A Method for manufacturing nitride gradient energy gap resonance tunneling ohmic contact
10/02/2013CN103337460A Preparation method of E/D integrated GaN HEMT device
10/02/2013CN103337459A Gallium nitride semiconductor device with improved termination scheme
10/02/2013CN103337458A Method for improving electrical parameters of semiconductor devices
10/02/2013CN103337457A Annealing apparatus and annealing process
10/02/2013CN103337456A Method for improving breakdown voltage of capacitor
10/02/2013CN103337455A Preparation method of Si nanowire arrays
10/02/2013CN103337454A Design method of grooved MOS scribing groove
10/02/2013CN103337453A Apparatus for efficient removal of halogen residues from etched substrates
10/02/2013CN103337452A Process method for forming nickel salicide on silicon germanium layer
10/02/2013CN103337451A Growth method of electronic barrier layer of epitaxial structure and corresponding epitaxial structure
10/02/2013CN103337450A Ultraviolet light/ozone surface cleaning and oxidation modification vacuum equipment and using method thereof
10/02/2013CN103337449A Method for transplanting silicon nanowire array and preparing simple device thereof
10/02/2013CN103336396A Array substrate and manufacturing method thereof, as well as display device
10/02/2013CN103334091A Vacuum treatment device