Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/03/2013US20130256758 Integrated circuit structure having air-gap trench isolation and related design structure
10/03/2013US20130256757 Soi lateral bipolar junction transistor having a wide band gap emitter contact
10/03/2013US20130256751 Methods of producing free-standing semiconductors using sacrificial buffer layers and recyclable substrates
10/03/2013US20130256749 Passive devices for finfet integrated circuit technologies
10/03/2013US20130256748 Passive devices for finfet integrated circuit technologies
10/03/2013US20130256743 Production method for group iii nitride semiconductor and group iii nitride semiconductor
10/03/2013US20130256709 Method of manufacturing substrate for led module and substrate for led module manufactured by the same
10/03/2013US20130256700 Silicon carbide substrate, semiconductor device, and methods for manufacturing them
10/03/2013US20130256698 Low loss sic mosfet
10/03/2013US20130256690 Semiconductor device and method of fabricating the semiconductor device
10/03/2013US20130256686 Semiconductor device and method for manufacturing semiconductor device
10/03/2013US20130256685 Compound semiconductor device and method for manufacturing the same
10/03/2013US20130256680 Vertical Semiconductor Device and Manufacturing Method Thereof
10/03/2013US20130256679 High electron mobility transistor and method of forming the same
10/03/2013US20130256675 Method for Consuming Silicon Nanoparticle Film Oxidation
10/03/2013US20130256667 Method of forming a conductive pattern, method of manufacturing a display substrate using the method, and display substrate
10/03/2013US20130256664 MOS Device for Making the Source/Drain Region Closer to the Channel Region and Method of Manufacturing the Same
10/03/2013US20130256663 Surface tension modification using silane with hydrophobic functional group for thin film deposition
10/03/2013US20130256661 SYSTEM FOR ELECTRICAL TESTING OF THROUGH-SILICON VIAS (TSVs), AND CORRESPONDING MANUFACTURING PROCESS
10/03/2013US20130256659 Reduction of ocd measurement noise by way of metal via slots
10/03/2013US20130256654 Method of Forming P-Type ZnO Film
10/03/2013US20130256653 Thin film transistor having plural semiconductive oxides, thin film transistor array panel and display device including the same, and manufacturing method of thin film transistor
10/03/2013US20130256652 Thin film transistor, thin film transistor array panel including the same, and method of manufacturing the same
10/03/2013US20130256620 Semiconductor device and method of manufacturing thereof
10/03/2013US20130256566 Ion implantation apparatus and control method thereof
10/03/2013US20130256297 Ceramic heater, heater electrode, and method for manufacturing ceramic heater
10/03/2013US20130256293 Heat treatment system, heat treatment method, and non-transitory computer-readable recording medium
10/03/2013US20130256271 Methods and apparatuses for controlling plasma in a plasma processing chamber
10/03/2013US20130256186 Magazine for loading a lead frame
10/03/2013US20130255889 Method For Detaching A Semiconductor Chip From A Foil
10/03/2013US20130255887 High temperature sheet handling system and methods
10/03/2013US20130255882 Substrate treating apparatus
10/03/2013US20130255881 Internal member of a plasma processing vessel
10/03/2013US20130255784 Gas delivery systems and methods of use thereof
10/03/2013US20130255763 Carbon electrode, carbon electrode production method, and photoelectric conversion device
10/03/2013US20130255738 Phononic structures and related devices and methods
10/03/2013US20130255721 Concave nodule sponge brush
10/03/2013US20130255720 Conical sponge brush for cleaning semiconductor wafers
10/03/2013US20130255718 Substrate processing method and substrate processing apparatus
10/03/2013US20130255578 Chemical vapor deposition apparatus having susceptor
10/03/2013US20130255569 Film-forming apparatus and film-forming method
10/02/2013EP2645431A1 Manufacture of multijuntion solar cell devices
10/02/2013EP2645430A1 Manufacture of multijunction solar cell devices
10/02/2013EP2645429A1 Manufacture of multijunction solar cell devices
10/02/2013EP2645428A1 Manufacture of multijuntion solar cell devices
10/02/2013EP2645419A2 ROM arrays having memory cell transistors programmed using metal gates
10/02/2013EP2645415A2 Lead frame, semiconductor device, and method for manufacturing lead frame
10/02/2013EP2645411A2 Semiconductor device
10/02/2013EP2645410A1 Device for processing wafers
10/02/2013EP2645409A1 Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate
10/02/2013EP2645408A1 Binding material, binding body, and binding method
10/02/2013EP2645407A2 Illumination optical apparatus and projection exposure apparatus
10/02/2013EP2645406A2 Illumination optical apparatus and projection exposure apparatus
10/02/2013EP2645405A2 Illumination optical apparatus and projection exposure apparatus
10/02/2013EP2645404A1 Exposure apparatus
10/02/2013EP2645403A2 Method of manufacturing ferroelectric thin film
10/02/2013EP2645371A1 Double-gate electronic memory cell and method for manufacturing same
10/02/2013EP2644740A2 Method for producing a thin coating on a substrate
10/02/2013EP2644669A1 Heat-peelable pressure-sensitive adhesive sheet
10/02/2013EP2644654A1 Resin composition, insulating film, film forming method, and electronic component
10/02/2013EP2644284A1 Group 2 Imidazolate Formulations for Direct Liquid Injection
10/02/2013EP2643851A1 A method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
10/02/2013EP2643850A1 Substrate holder for the surface treatment of substrates, and use of the substrate holder
10/02/2013EP2643849A1 Using low pressure epi to enable low rdson fet
10/02/2013EP2643848A2 Process for fabricating a field-effect transistor device implemented on a network of vertical nanowires, the resulting transistor device, an electronic device comprising such transistor devices and a processor comprising at least one such device
10/02/2013EP2643847A2 Method for reducing the range in resistivities of semiconductor crystalline sheets grown in a multi-lane furnace
10/02/2013EP2643795A1 Conductor track arrangement for portable data storage medium
10/02/2013DE112012000264T5 Halbleiter-auf-Isolator-Einheit mit asymmetrischer Struktur Semiconductor-on-insulator device with asymmetric structure
10/02/2013DE112012000255T5 Struktur und Verfahren zur Hartmaskenentfernung auf einem SOI-Substrat ohne Anwendung eines CMP-Verfahrens Structure and process for removing the hard mask on an SOI substrate without the application of a CMP method
10/02/2013DE112011104610T5 Verfahren und Vorrichtung zum Polieren eines Werkstücks Method and apparatus for polishing a workpiece
10/02/2013DE112011103675T5 Halbleitervorrichtung und Herstellungsverfahren hierfür A semiconductor device and manufacturing method thereof
10/02/2013DE10393853B4 Verfahren zur Herstellung einesTrench-MIS-Bauteiles mit einem implantierten Drain-Drift-Bereich und einem dicken Bodenoxid und Trench-MIS-Bauteil A process for producing a trench MIS component with an implanted drain-drift region and a thick bottom oxide and trench MIS component
10/02/2013DE102013205644A1 Method for forming chips i.e. semiconductor chips, with adhesive films, involves attaching adhesive film to rear of wafer, and separating wafer from adhesive film to obtain individual chips such that each chip is mounted on rear side film
10/02/2013DE102013103465A1 Längliche Bumps in integrierten Schaltungen Elongated bumps in integrated circuits
10/02/2013DE102013103140A1 Integrierte 3-D-Schaltungen und Verfahren zu deren Bildung 3-D integrated circuits and methods for their formation
10/02/2013DE102013103138A1 Gedrehte Halbleiterbauelementgehäuse auf Wafer-Ebene vom Fan-Out-Typ und Verfahren zum Herstellen gedrehter Halbleiterbauelementgehäuse auf Wafer-Ebene vom Fan-Out-Typ Turned semiconductor device package wafer-level fan-out type and method of manufacturing semiconductor device package turned on wafer-level fan-out type
10/02/2013DE102013103132A1 Eine Chipanordnung, ein Verfahren zum Bilden einer Chipanordnung, ein Chipgehäuse, ein Verfahren zum Bilden eines Chipgehäuses A chip arrangement, a method of forming a die assembly, a die package, a method of forming a chip package
10/02/2013DE102013103100A1 Verfahren zum Ablösen eines Halbleiterchips von einer Folie Method for detaching a semiconductor chip from a foil
10/02/2013DE102013103085A1 Mehrfachchip-Leistungshalbleiterbauteil Multi-chip power semiconductor component
10/02/2013DE102013103015A1 Gitter-Gehäuse auf Wafer-Ebene vom Fan-Out-Typ und Verfahren zum Herstellen eines Gitter-Gehäuses auf Wafer-Ebene vom Fan-Out-Typ Grid housing at the wafer level fan-out type and method of manufacturing a curtain housing at the wafer level fan-out type
10/02/2013DE102013103011A1 Eine Chipanordnung und ein Verfahren zum Bilden einer Chipanordnung A chip assembly and a method for forming a chip assembly
10/02/2013DE102013102973A1 Halbleiterpackages und Verfahren zu deren Ausbildung Semiconductor packages and methods of training
10/02/2013DE102013102797A1 Tunnel furnace for heat treatment of material to be treated, has transport element lubricants and turnable and/or transferable stocks or supporting items or rolling elements are provided between carrier and furnace main portion
10/02/2013DE102013102720A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
10/02/2013DE102013101919A1 Metallgate-Halbleitervorrichtung und Verfahren zu ihrer Herstellung Metal gate semiconductor device and process for their preparation
10/02/2013DE102013100857A1 Finnenstruktur für ein FinFET-Bauteil Fin structure for a FinFET device
10/02/2013DE102013004464A1 Gate-überspannungsschutz für verbindungshalbleitertransistoren Gate overvoltage protection for compound semiconductor transistors
10/02/2013DE102012205375A1 Mehrschicht-Rückelektrode für eine photovoltaische Dünnschichtsolarzelle, Verwen-dung der Mehrschicht-Rückelektrode für die Herstellung von Dünnschichtsolarzellen und -modulen, photovoltaische Dünnschichtsolarzellen und -module enthaltend die Mehrschicht-Rückelektrode sowie ein Verfahren zur Herstellung photovoltaischer Dünnschichtsolarzellen und -module Multi-layer rear electrode for a photovoltaic thin film solar cell, Verwen-tion of the multi-layer rear electrode for the production of thin film solar cells and modules, thin film photovoltaic solar cells and modules comprising the multi-layer rear electrode and a process for production of photovoltaic thin-film solar cells and modules
10/02/2013DE102012205268A1 Verfahren zum Herstellen von zumindest einer Kontaktierungsfläche eines Bauelementes und Sensor zum Aufnehmen einer Richtungskomponente einer gerichteten Messgröße A method for producing at least one bonding pad of a component and the sensor for receiving a direction component directed to a measurand
10/02/2013DE102012205254A1 Tempering band-shaped substrate, comprises guiding and transporting substrate band along transport path and is tempered by guide segment, with thermal band as heat exchangers, by which guide segment leads thermal band along transport path
10/02/2013DE102012205252A1 Processing station e.g. screen printing for planar substrate e.g. blank solar cell wafer, has two interchange points that are respectively arranged in regions of processing units between transportation lines and linear transport units
10/02/2013DE102012205249A1 Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten Processing station for area substrates and methods for processing flat substrates
10/02/2013DE102012205240A1 Method for manufacturing substrate for power semiconductor component e.g. MOSFET for power converter, involves arranging electroplating ridges in recesses formed in bottom metallization layer of insulating material portion
10/02/2013DE102012205181A1 Messvorrichtung zum Vermessen einer Beleuchtungseigenschaft Measuring device for measuring a lighting feature
10/02/2013DE102012205045A1 Optisches System einer mikrolithographischen Projektionsbelichtungsanlage The optical system of a microlithography projection exposure apparatus
10/02/2013DE102012204835A1 Sensor, Verfahren zum Herstellen eines Sensors und Verfahren zum Montieren eines Sensors Sensor, method of manufacturing a sensor and method for mounting a sensor
10/02/2013DE102012111082A1 Gate-Stapel eines Fin-Feldeffekttransistors Gate stack of a fin field effect transistor
10/02/2013DE102012109338A1 Verbindungsstruktur und Verfahren zur Ausbildung derselben Connection structure and method of forming same
10/02/2013DE102012107757A1 Verfahren zum Herstellen einer lithographischen Maske A method of manufacturing a lithographic mask,
10/02/2013DE102012103330A1 Vorrichtung zum Entfernen einer Beschichtung von einem Substrat und Verfahren An apparatus for removing a coating from a substrate and methods
1 ... 468 469 470 471 472 473 474 475 476 477 478 479 480 481 482 483 484 485 486 487 488 ... 6590