Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2004
08/17/2004US6776692 Closed-loop control of wafer polishing in a chemical mechanical polishing system
08/17/2004US6776691 Polishing/cleaning method as well as method of making a wiring section using a polishing apparatus
08/17/2004US6776688 Providing pad having embedded magnetorheological fluid, applying selective magnetic field to magnetorheological fluid to control stiffness of pad at selective regions to control polishing of object with pad
08/17/2004US6776622 Conductive contact structure and process for producing the same
08/17/2004US6776599 Method and apparatus for gate blocking X-outs during a molding process
08/17/2004US6776598 Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the same
08/17/2004US6776567 Valve/sensor assemblies
08/17/2004US6776399 Chip-scale package
08/17/2004US6776329 Applying paste comprising mixture of heat conducting metal powder and liquid to workpiece, contacting second workpiece, drying paste, sintering, compacting porous layer which has been sintered to workpieces by pressing workpieces together
08/17/2004US6776324 Wire bonding apparatus
08/17/2004US6776289 Wafer container with minimal contact
08/17/2004US6776173 Liquid processing apparatus
08/17/2004US6776170 Method and apparatus for plasma cleaning of workpieces
08/17/2004US6776118 Application of input waveforms having predetermined energy, frequency and amplitude to produce standing waves at predetermined positions at the interface between a pair of fluids within a container
08/17/2004US6776094 Kit For Microcontact Printing
08/17/2004US6776078 Cutting machine
08/17/2004US6775920 Method of fabricating semiconductor device comprising superposition inspection step
08/17/2004US6775918 Wafer cassette pod equipped with position sensing device
08/17/2004US6775906 Method of manufacturing an integrated circuit carrier
08/17/2004US6775879 Needle cleaning system
08/17/2004US6775876 Apparatus having scraping blades attached peripherally about annular mounting member and arranged parallel to longitudinal axis of chamber, reciprocable movement unit for rotating blades circumferentially back and forth along interior surface
08/17/2004CA2381597C Circuit pattern of resistance heating elements and substrate-treating apparatus incorporating the pattern
08/12/2004WO2004068925A1 Attaching-positioning device for attaching objects to substrates
08/12/2004WO2004068917A1 Plasma processor and plasma processing method
08/12/2004WO2004068912A1 Material for hole injection layer, organic el element and organic el display
08/12/2004WO2004068617A2 Trench mosfet technology for dc-dc converter applications
08/12/2004WO2004068607A1 Cpp-type giant manetoresistance effect element and magnetic component and magnetic device using it
08/12/2004WO2004068604A1 Heat switching device and method for manufacturing same
08/12/2004WO2004068595A1 Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device
08/12/2004WO2004068591A1 Method for fabricating semiconductor device and acceleration sensor
08/12/2004WO2004068589A1 Narrow fin finfet
08/12/2004WO2004068588A1 Semiconductor device and method for fabricating the same
08/12/2004WO2004068585A1 Strained channel finfet
08/12/2004WO2004068582A1 Semiconductor device and its fabricating method
08/12/2004WO2004068579A1 Soi structure comprising substrate contacts on both sides of the box, and method for the production of such a structure
08/12/2004WO2004068578A2 Method for producing bit lines for ucp flash memories
08/12/2004WO2004068576A2 Method of forming a catalyst containing layer over a patterned dielectric
08/12/2004WO2004068575A1 Trench isolation structure, semiconductor assembly comprising such a trench isolation, and method for forming such a trench isolation
08/12/2004WO2004068574A1 Soi contact structure(s) and corresponding production method
08/12/2004WO2004068573A1 Method for vertically mounting semi-conductor elements
08/12/2004WO2004068572A2 Method for producing a semiconductor component
08/12/2004WO2004068571A1 Tri-gate and gate around mosfet devices and methods for making same
08/12/2004WO2004068570A1 Cmp polishing compound and polishing method
08/12/2004WO2004068569A1 Method for manufacturing semiconductor wafer
08/12/2004WO2004068568A1 Structure, especially a semi-conductor structure, in addition to a method for the production said structure
08/12/2004WO2004068567A1 Thin-film semiconductor component and production method for said component
08/12/2004WO2004068565A1 Mask for charged particle exposure
08/12/2004WO2004068563A2 Methods and apparatus for transporting substrate carriers
08/12/2004WO2004068562A1 Packaging integrated circuits
08/12/2004WO2004068561A2 Method for polishing a shallow trench isolation using an amorphous carbon polish-stop layer
08/12/2004WO2004068556A2 Semiconductor structures with structural homogeneity
08/12/2004WO2004068555A2 Repair and restoration of damaged dielectric materials and films
08/12/2004WO2004068554A2 Analysis and monitoring of stresses in embedded lines and vias integrated on substrates
08/12/2004WO2004068551A2 Patterning layers comprised of spin-on ceramic films
08/12/2004WO2004068550A2 Interconnect structures incorporating low-k dielectric barrier films
08/12/2004WO2004068545A2 Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
08/12/2004WO2004068541A2 Wafer handling apparatus
08/12/2004WO2004068540A2 Hardmask with high selectivity for ir barriers for ferroelectric capacitor manufacturing
08/12/2004WO2004068539A2 Sidewall structure and method of fabrication for reducing oxygen diffusion to contact plugs during cw hole reactive ion etch processing
08/12/2004WO2004068536A2 A thin film semiconductor device and method of manufacturing a thin film semiconductor device
08/12/2004WO2004068516A1 Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet
08/12/2004WO2004068242A1 Resist composition
08/12/2004WO2004068227A1 Heating apparatus
08/12/2004WO2004068155A1 Probe device and display substrate testing apparatus using same
08/12/2004WO2004067799A1 Susceptor device for semiconductor processing, film forming apparatus, and film forming method
08/12/2004WO2004067666A1 Adhesive sheet and layered product
08/12/2004WO2004067660A1 Selective barrier metal polishing solution
08/12/2004WO2004067445A1 Formation of silicon nanostructures
08/12/2004WO2004067244A1 Semiconductor-sealing-purpose epoxy resin compound producing method
08/12/2004WO2004067234A1 Vacuum suction head
08/12/2004WO2004067192A1 Electroless plating solution and process
08/12/2004WO2004057667A3 Method for re-routing lithography-free microelectronic devices
08/12/2004WO2004057653A3 A method and apparatus for forming a high quality low temperature silicon nitride layer
08/12/2004WO2004053947A3 Titanium silicon nitride (tisin) barrier layer for copper diffusion
08/12/2004WO2004051712A3 Novel field effect transistor and method of fabrication
08/12/2004WO2004042802A3 A method of rapidly thermally annealing multilayer wafers with an edge
08/12/2004WO2004040644A3 Memory cell, memory cell arrangement, structuring arrangement and method for production of a memory cell
08/12/2004WO2004034470A3 Dual-port memory cell and layout design
08/12/2004WO2004034445A3 A method for plasma etching performance enhancement
08/12/2004WO2004034426A3 Non-volatile memory device and method for forming
08/12/2004WO2004027841A3 Semiconductor memory cells
08/12/2004WO2004025725A3 Method for producing a memory cell field comprising memory transistors that are located in trenches
08/12/2004WO2004025697A3 Thermal process station with heated lid
08/12/2004WO2004019404A3 Recycling a wafer comprising a buffer layer, after having taken off a thin layer therefrom
08/12/2004WO2004019403A3 Mechanical recycling of a wafer comprising a buffer layer, after having taken a layer therefrom
08/12/2004WO2004006418A3 Medium for storing and reading information, and device for storing and reading of information on and from the medium
08/12/2004WO2003107396B1 Substrate processing apparatus and related systems and methods
08/12/2004WO2003107395A3 Protected dual-voltage microcircuit power arrangement
08/12/2004US20040158805 Parasitic capacitance extracting device and method for semiconductor integrated circuit
08/12/2004US20040158803 Integrated circuit, integrated circuit design method and hardware description generation method to generate hardware behavior description of integrated circuit
08/12/2004US20040158421 Crosstalk checking method
08/12/2004US20040158409 Defect analyzer
08/12/2004US20040158347 Transfer apparatus and method for semiconductor process and semiconductor processing system
08/12/2004US20040158344 Mask management device in semiconductor wafer production process
08/12/2004US20040158047 Method for producing cobalt-protein complex
08/12/2004US20040157536 Method of backgrinding wafers while leaving backgrinding tape on a chuck
08/12/2004US20040157476 Perimeter sealed high density multi-pin connector
08/12/2004US20040157475 Support member assembly for electroconductive contact members
08/12/2004US20040157473 Method for fabricating semiconductor device
08/12/2004US20040157472 Deposition method, deposition apparatus, insulating film and semiconductor integrated circuit