| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/19/2004 | US20040159633 Methods of etching articles via micro contact printing |
| 08/19/2004 | US20040159573 Method for safely storing an object and apparatus having a storage box and a stocker for storing an object |
| 08/19/2004 | US20040159557 Contains abrasive particles and electrolyte; oxidation of metal film surface; preventing defects; wear resistance |
| 08/19/2004 | US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices |
| 08/19/2004 | US20040159538 binary photo mask blank, a phase shifting photo mask blank or an extreme ultra violet photo mask blank having small structures; sputtering a target in a vacuum chamber by irradiating with a particle beam to deposit a first layer; high stability |
| 08/19/2004 | US20040159401 Vacuum chamber for plasma treatment; imparting mechanical oscillation to the apparatus and detecting oscillation generated |
| 08/19/2004 | US20040159400 Photoresist supply apparatus for preventing photoresist loss through drain line |
| 08/19/2004 | US20040159397 Method and apparatus for controlling photolithography overlay registration incorporating feedforward overlay information |
| 08/19/2004 | US20040159396 Method for manufacturing electronic component |
| 08/19/2004 | US20040159343 Substrate treatment method and substrate treatment apparatus |
| 08/19/2004 | US20040159341 Apparatus and method for photoresist stripping |
| 08/19/2004 | US20040159335 Radiation in the radio or microwave portion of the electromagnetic spectrum is applied to a substrate housed within a pressurized processing chamber to promote desirable chemical reactions involving the substrate; e.g., stripping doped photoresists |
| 08/19/2004 | US20040159333 moving the cleaning surface of a wafer holder cleaning device into contact with the head; and removing contaminants from the head; especially where either the cleaning device and wafer holder rotates |
| 08/19/2004 | US20040159316 Wire sawing device |
| 08/19/2004 | US20040159286 Plasma treatment device |
| 08/19/2004 | US20040159285 Gas gate for isolating regions of differing gaseous pressure |
| 08/19/2004 | US20040159284 System and method for performing semiconductor processing on substrate being processed |
| 08/19/2004 | US20040159005 Sub-atmospheric pressure delivery of liquids, solids and low vapor pressure gases |
| 08/19/2004 | US20040158980 Component built-in module and method for producing the same |
| 08/19/2004 | US20040158979 Method of manufacturing a semiconductor element-mounting board |
| 08/19/2004 | US20040158978 Molding method and mold for encapsulating both sides of PCB module with wafer level package mounted PCB |
| 08/19/2004 | DE202004008357U1 Sieve type printing template for solder printing, especially of SMD circuit boards or for wafer bumping, has a flexible template films with solder deposition holes and a rigid mask that supports the film outside the print area |
| 08/19/2004 | DE19861009B4 Packaged semiconductor device has a ball grid array substrate |
| 08/19/2004 | DE19727397B4 Verfahren zum Herstellen eines Flashspeicherelementes mit Hochspannungs-Transistorbereich und Niederspannungs-Transistorbereich A method of manufacturing a flash memory element having high-voltage transistor region and low-voltage transistor region |
| 08/19/2004 | DE10357990A1 Hochintegrierte Schaltung zur Verminderung der Hysterese einer Verzögerungseinheit Highly integrated circuit for reducing the hysteresis of a delay unit |
| 08/19/2004 | DE10357783A1 Nitrid-Lichtemissionsbauteil Nitride light emitting component |
| 08/19/2004 | DE10354744A1 Verfahren zum Bilden eines Metallspiegels eines Halbleiterbauelements A method of forming a metal mirror of a semiconductor device |
| 08/19/2004 | DE10345373A1 Lateraltransistor Lateral transistor |
| 08/19/2004 | DE10343526A1 Halbleitervorrichtung mit Anschlußfläche A semiconductor device having pad |
| 08/19/2004 | DE10341755A1 Semiconductor device has semiconductor substrate with first and second trenches that are filled by isolating separation films between which gate isolation film is provided |
| 08/19/2004 | DE10338049A1 Halbleiterspeichervorrichtung A semiconductor memory device |
| 08/19/2004 | DE10322772A1 Holding and positioning arrangement for object e.g. semiconductor disks, has carrier ring that has carrier side with air outlet and has rotary table for object arranged on carrier side |
| 08/19/2004 | DE10313584A1 Trough filling by means of a high density plasma (HDP) process useful in semiconductor production |
| 08/19/2004 | DE10308872B3 Integrated semiconductor memory circuit has additional word lines and associated blind contact structures for compensation of parasitic capacitances between bit line contacts and word lines |
| 08/19/2004 | DE10304777A1 Verfahren zur Herstellung eines Chipnutzens mittels eines Hitze- und Druckprozesses unter Verwendung eines thermoplastischen Materials A process for producing a chip by means of a utility heat and pressure process using a thermoplastic material |
| 08/19/2004 | DE10304722A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 08/19/2004 | DE10304654A1 Speicherzelle, Speicherzellen-Anordnung und Verfahren zum Herstellen einer Speicherzelle Memory cell, memory cell arrangement and method of manufacturing a memory cell |
| 08/19/2004 | DE10303926A1 Verbesserte Technik zur Herstellung von Kontakten für vergrabene dotierte Gebiete in einem Halbleiterelement Improved technology for the manufacture of contacts for buried doped regions in a semiconductor element |
| 08/19/2004 | DE10303925A1 Dielektrische Barrierenschicht für eine Kupfermetallisierungsschicht mit einer über die Dicke hinweg variierenden Siliziumkonzentration Dielectric barrier layer for a copper metallization with a varying across the thickness silicon concentration |
| 08/19/2004 | DE10303875A1 Struktur, insbesondere Halbleiterstruktur, sowie Verfahren zur Herstellung einer Struktur Structure, in particular semiconductor structure, as well as methods for manufacturing a structure |
| 08/19/2004 | DE10303738A1 Storage capacitor has first and second electrodes formed by column of several metal parts and are so arranged that lateral capacity is formed between the electrodes |
| 08/19/2004 | DE10303683A1 Verfahren zum Verringern der durch Kontamination hervorgerufenen Prozessfluktuationen während des Ionenimplantierens A method of reducing the contamination caused by process fluctuations during the ion implanting |
| 08/19/2004 | DE10303642A1 Integrated circuit, on and in a silicon-on-insulator semiconductor wafer, has active components on the leading side electrically connected to structures in the substrate by metal connections through the insulation |
| 08/19/2004 | DE10303459A1 Verfahren und Vorrichtung zum Kontrollieren des Randes eines scheibenförmigen Gegenstandes Method and apparatus for controlling the edge of a disc-shaped object |
| 08/19/2004 | DE10302653A1 Vorrichtung zur Thermomigration Apparatus for thermo-migration |
| 08/19/2004 | DE10292343T5 Maske, Verfahren zur Herstellung der Maske und Verfahren zur Herstellung eines Halbleiterbauelements Mask, method for producing the mask and method for manufacturing a semiconductor device |
| 08/19/2004 | DE10261364A1 Deposition of a temperable multilayer contact coating onto a semiconductor material useful for production of light emitting semiconductor chips |
| 08/19/2004 | DE10260286A1 Doping semiconducting body for manufacturing high voltage components involves forming defects by ion implantation of non-doping ions, processing with hydrogen and then annealing |
| 08/19/2004 | DE10258423A1 Verfahren und Maske zur Charakterisierung eines Linsensystems Process and mask for the characterization of a lens system |
| 08/19/2004 | DE102004005274A1 Multikristallines Siliciumsubstrat und Prozess zum Aufrauhen einer Oberfläche hiervon Multicrystalline silicon substrate and process for roughening a surface thereof |
| 08/19/2004 | DE10018138B4 Verfahren zum Herstellen von Elektronikkomponenten A method of manufacturing of electronic components |
| 08/19/2004 | CA2515105A1 Templated cluster assembled wires |
| 08/19/2004 | CA2514616A1 Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means |
| 08/19/2004 | CA2514454A1 Sacrificial metal liner for copper interconnects |
| 08/19/2004 | CA2458134A1 Nitride semiconductor device |
| 08/18/2004 | EP1448042A1 OPTIMALIZATION APPARATUS, MOUNTING APPARATUS, AND ELECTRONIC PART MOUNTING SYSTEM |
| 08/18/2004 | EP1448034A1 Method and device for mounting electronic component on circuit board |
| 08/18/2004 | EP1448033A1 Method and device for mounting electronic component on a circuit board |
| 08/18/2004 | EP1448029A2 Apparatus and method for producing gaseous ions by use of x-rays, and various apparatuses and structures using them |
| 08/18/2004 | EP1447902A2 Linear motor, stage apparatus, exposure apparatus and device manufacturing method |
| 08/18/2004 | EP1447877A1 Transmission line having photonic band gap coplanar waveguide structure and method for fabricating power divider using the same |
| 08/18/2004 | EP1447863A2 Etching mask |
| 08/18/2004 | EP1447855A2 Electro-magnetic transducers |
| 08/18/2004 | EP1447851A1 Semiconductor storage device, its manufacturing method and operating method, and portable electronic apparatus |
| 08/18/2004 | EP1447850A2 Electronic parts packaging structure and method of manufacturing the same |
| 08/18/2004 | EP1447848A2 Semi conductor integrated circuit including anti-fuse and method for manufacturing the same |
| 08/18/2004 | EP1447847A2 Lead frame for an electronic component package |
| 08/18/2004 | EP1447846A2 Socket and method for connecting electronic components |
| 08/18/2004 | EP1447844A2 Reinforced semiconductor wafer |
| 08/18/2004 | EP1447842A1 Bonding wire |
| 08/18/2004 | EP1447840A1 Polishing pad and polishing method |
| 08/18/2004 | EP1447839A1 SEMICONDUCTOR SUBSTRATE, FIELD−EFFCT TRANSISTOR, AND THEIR MANUFACTURING METHODS |
| 08/18/2004 | EP1447838A2 System and method to reduce the effect of reactive forces on a stage using a balance mass |
| 08/18/2004 | EP1447811A1 Ferroelectric storage device, drive method and drive circuit thereof |
| 08/18/2004 | EP1447786A1 Active matrix substrate, electro-optical apparatus, and electronic device |
| 08/18/2004 | EP1447718A2 Exposure apparatus and method |
| 08/18/2004 | EP1447717A2 Exposure apparatus, cooling method and device manufacturing method |
| 08/18/2004 | EP1447716A2 Lithographic apparatus with gas flushing system |
| 08/18/2004 | EP1447711A2 Photomask, pattern formation method using photomask and mask data creation method |
| 08/18/2004 | EP1447440A1 Composition for cleaning |
| 08/18/2004 | EP1446991A1 Circuit formation by laser ablation of ink |
| 08/18/2004 | EP1446840A1 MULTI−STATE NON−VOLATILE INTEGRATED CIRCUIT MEMORY SYSTEMS THAT EMPLOY DIELECTRIC STORAGE ELEMENTS |
| 08/18/2004 | EP1446839A2 Trench dmos device with improved drain contact |
| 08/18/2004 | EP1446836A1 Silicon on insulator device with improved heat removal and method of manufacture |
| 08/18/2004 | EP1446832A2 Electrode structure for use in an integrated circuit |
| 08/18/2004 | EP1446831A2 Method for producing thin metal-containing layers having a low electrical resistance |
| 08/18/2004 | EP1446830A2 Manufacturing process of integrated circuits in flip-chip technology |
| 08/18/2004 | EP1446829A2 Method for forming a structure in a semiconductor substrate |
| 08/18/2004 | EP1446828A2 Reduced footprint tool for automated processing of substrates |
| 08/18/2004 | EP1446827A2 Single wafer dryer and drying method |
| 08/18/2004 | EP1446826A2 Storage device |
| 08/18/2004 | EP1446825A1 Apparatus and method for improving etch rate uniformity |
| 08/18/2004 | EP1446824A2 Integrated semiconductor component for conducting high-frequency measurements and the use thereof |
| 08/18/2004 | EP1446813A2 Reflective x-ray microscope and inspection system for examining objects with wavelengths of= 100nm |
| 08/18/2004 | EP1446806A1 A ferroelectric or electret memory circuit |
| 08/18/2004 | EP1446805A1 ELECTRODES, METHOD AND APPARATUS FOR MEMORY STRUCTURE |
| 08/18/2004 | EP1446702A2 Maskless printer using photoelectric conversion of a light beam array |
| 08/18/2004 | EP1446700A2 ANTI-REFLECTIVE COATING COMPOSITIONS FOR USE WITH LOW k DIELECTRIC MATERIALS |
| 08/18/2004 | EP1446698A1 An interferometer system for a semiconductor exposure system |
| 08/18/2004 | EP1446672A1 Apparatus and method for handling and testing of wafers |