| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 08/19/2004 | WO2004070835A1 Method for producing microsystems |
| 08/19/2004 | WO2004070834A1 Method of manufacturing a semiconductor device and semiconductor device obtained by means of such a method |
| 08/19/2004 | WO2004070833A1 Method of manufacturing a semiconductor device with mos transistors comprising gate electrodes formed in a packet of metal layers deposited upon one another |
| 08/19/2004 | WO2004070831A1 Method of manufacturing a semiconductor device and semiconductor device obtained by using such a method |
| 08/19/2004 | WO2004070830A1 Sacrificial metal liner for copper interconnects |
| 08/19/2004 | WO2004070829A1 Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means |
| 08/19/2004 | WO2004070827A1 Method for interconnecting terminals and method for mounting semiconductor device |
| 08/19/2004 | WO2004070826A1 Method of forming electrode connection structure and electrode connection structure |
| 08/19/2004 | WO2004070825A1 Method for patterning densely packed metal segments in a semiconductor die and related structure |
| 08/19/2004 | WO2004070824A1 Method for removing crystal originated particles from single-crystal silicon wafer |
| 08/19/2004 | WO2004070823A1 Display manufacturing method |
| 08/19/2004 | WO2004070822A1 Methods for manufacturing semiconductor device and display |
| 08/19/2004 | WO2004070821A1 Display manufacturing method |
| 08/19/2004 | WO2004070820A1 Wiring fabricating method |
| 08/19/2004 | WO2004070819A1 Method for manufacturing display |
| 08/19/2004 | WO2004070818A1 Metal etching method for an interconnect structure and metal interconnect structure obtained by such method |
| 08/19/2004 | WO2004070817A2 Method of eliminating residual carbon from flowable oxide fill material |
| 08/19/2004 | WO2004070816A1 Plasma processing method, semiconductor substrate and plasma processing system |
| 08/19/2004 | WO2004070815A1 Method of plasma oxidation and semiconductor substrate |
| 08/19/2004 | WO2004070814A1 Vacuum treating device with lidded treatment container |
| 08/19/2004 | WO2004070813A1 Plasma processing apparatus and method |
| 08/19/2004 | WO2004070811A1 Semiconductor producing apparatus |
| 08/19/2004 | WO2004070809A1 Method for manufacturing display |
| 08/19/2004 | WO2004070808A1 Plasma treating device, and plasma treating device electrode plate, and electrode plate producing method |
| 08/19/2004 | WO2004070807A1 Substrate treating device and substrate treating method |
| 08/19/2004 | WO2004070805A1 Substrate drying device and substrate drying method |
| 08/19/2004 | WO2004070804A1 Method for forming nickel silicide film, method for manufacturing semiconductor device, and method for etching nickel silicide |
| 08/19/2004 | WO2004070803A1 Heater of chemical vapor deposition apparatus for manufacturing a thin film |
| 08/19/2004 | WO2004070802A1 Treating system and operating method for treating system |
| 08/19/2004 | WO2004070801A1 Fluid control device and heat treatment device |
| 08/19/2004 | WO2004070800A1 Semiconductor substrate, field-effect transistor, and their production methods |
| 08/19/2004 | WO2004070799A1 Mask processing device, mask processing method, program, and mask |
| 08/19/2004 | WO2004070798A1 Silicon semiconductor substrate and its manufacturing method |
| 08/19/2004 | WO2004070797A1 Random-period chip transfer apparatus |
| 08/19/2004 | WO2004070796A2 Tailoring nitrogen profile in silicon oxynitride using rapid thermal annealing with ammonia under ultra-low pressure |
| 08/19/2004 | WO2004070795A2 Radiation detector assembly |
| 08/19/2004 | WO2004070794A2 Method to deposit an impermeable film onto a porous low-k dielectric film |
| 08/19/2004 | WO2004070793A2 Method to plasma deposit onto an organic polymer dielectric film |
| 08/19/2004 | WO2004070792A2 Thin multiple semiconductor die package |
| 08/19/2004 | WO2004070788A2 Method for depositing a low dielectric constant film |
| 08/19/2004 | WO2004070785A2 Backside thinning of image array devices |
| 08/19/2004 | WO2004070778A2 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups |
| 08/19/2004 | WO2004070777A2 High value split poly p-resistor with low standard deviation |
| 08/19/2004 | WO2004070776A2 Methods for transferring supercritical fluids in microelectronic and other industrial processes |
| 08/19/2004 | WO2004070769A2 Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material |
| 08/19/2004 | WO2004070736A1 Ferroelectric film, semiconductor device, ferroelectric film manufacturing method, and ferroelectric film manufacturing apparatus |
| 08/19/2004 | WO2004070735A1 Quantum point made of electrically conducting carbon, production method, and application |
| 08/19/2004 | WO2004070730A1 A novel highly-integrated flash memory and mask rom array architecture |
| 08/19/2004 | WO2004070473A1 Radiation-sensitive resin composition, process for producing the same and process for producing semiconductor device therewith |
| 08/19/2004 | WO2004070472A1 Photomask blank, photomask, and pattern transfer method using photomask |
| 08/19/2004 | WO2004070471A2 Arc layer for semiconductor device |
| 08/19/2004 | WO2004070466A2 Pixel tft arrangement for active matrix display |
| 08/19/2004 | WO2004070363A1 Sample container |
| 08/19/2004 | WO2004070082A1 Method for the chemical treatment of a copper-alloy support for electronic components of the type used in the semiconductor industry |
| 08/19/2004 | WO2004070071A2 Method of coating microelectronic substrates |
| 08/19/2004 | WO2004069951A1 Pressure-sensitive adhesive tape for pasting wafer thereto |
| 08/19/2004 | WO2004069947A1 Method of polishing a silicon-containing dielectric |
| 08/19/2004 | WO2004069894A1 Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices |
| 08/19/2004 | WO2004069735A1 Templated cluster assembled wires |
| 08/19/2004 | WO2004069698A2 Transport system having shared load-lock front-end assembly |
| 08/19/2004 | WO2004069475A1 Wafer polishing with counteraction of centrifugal forces on polishing slurry |
| 08/19/2004 | WO2004060988A3 Carbon nanotubes |
| 08/19/2004 | WO2004057658A3 Mis transistor with self-aligned gate and method for making same |
| 08/19/2004 | WO2004053948A3 Air gap dual damascene process and structure |
| 08/19/2004 | WO2004047182A3 Field effect transistor structure, associated semiconductor storage cell, and corresponding production method |
| 08/19/2004 | WO2004044898A3 Nitridation of high-k dielectrics |
| 08/19/2004 | WO2004042771A3 Method of etching a silicon-containing dielectric material |
| 08/19/2004 | WO2004041658A3 Substrate process tank with acoustical source transmission and method of processing substrates |
| 08/19/2004 | WO2004038788A3 Method and apparatus for detecting endpoint during plasma etching of thin films |
| 08/19/2004 | WO2004030086A3 Integrated structure with microwave components |
| 08/19/2004 | WO2004030041B1 High selectivity and high planarity dielectric polishing |
| 08/19/2004 | WO2004027866A3 Method for creating a link in an integrated metal substrate |
| 08/19/2004 | WO2004025731A3 Method for the production of sonos memory cells, sonos memory cell, and memory cell field |
| 08/19/2004 | WO2004001808A8 Method and system for atomic layer removal and atomic layer exchange |
| 08/19/2004 | WO2003083928A3 A method for making nanoscale wires and gaps for switches and transistors |
| 08/19/2004 | WO2003076330A3 Silicon carbide microelectromechanical devices with electronic circuitry |
| 08/19/2004 | WO2003065131A3 Method and apparatus for electron density measurement and verifying process status |
| 08/19/2004 | WO2003028949A8 Method of machining substrates |
| 08/19/2004 | WO2003014416A3 Plating device and method |
| 08/19/2004 | US20040163071 Evaluation TEG for semiconductor device and method of evaluation |
| 08/19/2004 | US20040163068 Logic circuit diagram input device |
| 08/19/2004 | US20040163018 Error portion detecting method and layout method for semiconductor integrated circuit |
| 08/19/2004 | US20040162799 Method and apparatus for predicting sporting success conditions |
| 08/19/2004 | US20040162692 Method and apparatus for monitoring integrated circuit fabrication |
| 08/19/2004 | US20040162450 Process for producing perfluorocarbons and use thereof |
| 08/19/2004 | US20040162011 Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device |
| 08/19/2004 | US20040162008 Refrigerant supply apparatus |
| 08/19/2004 | US20040162007 Chemical mechanical polishing atomizing rinse system |
| 08/19/2004 | US20040162006 Abrasives for copper CMP and methods for making |
| 08/19/2004 | US20040161948 Method for preparing a semiconductor wafer surface |
| 08/19/2004 | US20040161947 Relaxed SiGe platform for high speed CMOS electronics and high speed analog circuits |
| 08/19/2004 | US20040161946 Method for fluorocarbon film depositing |
| 08/19/2004 | US20040161945 Method for fabricating semiconductor integrated circuit device |
| 08/19/2004 | US20040161944 Compositions including perhydro-polysilazane used in a semiconductor manufacturing process and methods of manufacturing semiconductor devices using the same |
| 08/19/2004 | US20040161943 Silicon parts having reduced metallic impurity concentration for plasma reaction chambers |
| 08/19/2004 | US20040161942 Method of manufacturing semiconductor device |
| 08/19/2004 | US20040161941 Aspect ratio controlled etch selectivity using time modulated DC bias voltage |
| 08/19/2004 | US20040161940 Semiconductor wafer processing method |
| 08/19/2004 | US20040161939 Method and apparatus for applying downward force on wafer during CMP |
| 08/19/2004 | US20040161938 Chemical-mechanical planarization using ozone |