| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/12/2004 | US20040157361 Semiconductor substrate for build-up packages |
| 08/12/2004 | US20040157360 Fabricating stacked chips using fluidic templated-assembly |
| 08/12/2004 | US20040157359 Method for planarizing bumped die |
| 08/12/2004 | US20040157358 Group III nitride semiconductor film and its production method |
| 08/12/2004 | US20040157357 Compound semiconductor structure including an epitaxial perovskite layer and method for fabricating semiconductor structures and devices |
| 08/12/2004 | US20040157356 Grounded gate for reducing dark current in CMOS image sensors |
| 08/12/2004 | US20040157355 Group III nitride semiconductor device |
| 08/12/2004 | US20040157354 Semiconductor device and method of manufacturing the same |
| 08/12/2004 | US20040157352 Method for forming thin film and method for fabricating liquid crystal display using the same |
| 08/12/2004 | US20040157351 Method of producing photovoltaic element |
| 08/12/2004 | US20040157350 Method for forming photo-defined micro electrical contacts |
| 08/12/2004 | US20040157349 Phase control of megasonic RF generator for optimum operation |
| 08/12/2004 | US20040157348 System, method and apparatus for automatic control of an RF generator for maximum efficiency |
| 08/12/2004 | US20040157347 Device and method for monitoring process exhaust gas, semiconductor manufacturing device, and system and method for controlling semiconductor manufacturing device |
| 08/12/2004 | US20040157345 Method for fabricating ferroelectric memory cells |
| 08/12/2004 | US20040157183 Heating system, method for heating a deposition or oxidation reactor, and reactor including the heating system |
| 08/12/2004 | US20040157170 Plasma ashing process for removing photoresist and residues during ferroelectric device fabrication |
| 08/12/2004 | US20040157169 Micro pattern forming method and semiconductor device manufacturing method |
| 08/12/2004 | US20040157166 Lithographic process for multi-etching steps by using single reticle |
| 08/12/2004 | US20040157165 Methods for forming an air gap in a semiconductor metal line manufacturing process |
| 08/12/2004 | US20040157164 Method of manufacturing semiconductor integrated circuit devices |
| 08/12/2004 | US20040157163 Method of improving photoresist layer uniformity |
| 08/12/2004 | US20040157156 Fluorinated vinyl sulfonate compound for use as monomer |
| 08/12/2004 | US20040157155 Polymers, resist compositions and patterning process |
| 08/12/2004 | US20040157138 Manufacturing method and apparatus of phase shift mask blank |
| 08/12/2004 | US20040157137 Reticle for manufacturing a semiconductor device |
| 08/12/2004 | US20040156987 Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD) |
| 08/12/2004 | US20040156625 Radiant heating source |
| 08/12/2004 | US20040156539 Inspecting an array of electronic components |
| 08/12/2004 | US20040156255 Semiconductor memory device with memory cells arranged in high density |
| 08/12/2004 | US20040156247 Method of fabricating non-volatile memory device |
| 08/12/2004 | US20040156240 Method of erasing non-volatile semiconductor memory device and such non-volatile semiconductor memory device |
| 08/12/2004 | US20040156238 Nonvolatile semiconductor memory and operating method of the memory |
| 08/12/2004 | US20040156233 TFT-based random access memory cells comprising thyristors |
| 08/12/2004 | US20040156232 Magnetic memory |
| 08/12/2004 | US20040156231 Magnetic memory |
| 08/12/2004 | US20040156230 Semiconductor memory device |
| 08/12/2004 | US20040156225 Memory devices, and electronic systems comprising memory devices |
| 08/12/2004 | US20040156223 System and method for evaluating a semiconductor device pattern, method for controlling process of forming a semiconductor device pattern and method for monitoring a semiconductor device manufacturing process |
| 08/12/2004 | US20040156164 Novel gate dielectric |
| 08/12/2004 | US20040156052 Optical apparatus, measurement method, and semiconductor device manufacturing method |
| 08/12/2004 | US20040156042 System for detecting anomalies and/or features of a surface |
| 08/12/2004 | US20040156041 Method and apparatus for measuring optical characteristic, and projection exposure apparatus using the same |
| 08/12/2004 | US20040156030 Lithographic apparatus and method for optimizing an illumination source using photolithographic simulations |
| 08/12/2004 | US20040156027 Lithographic projection mask, device manufacturing method, and device manufactured thereby |
| 08/12/2004 | US20040155992 Method of manufacturing an array substrate for use in a LCD device |
| 08/12/2004 | US20040155846 Transparent active-matrix display |
| 08/12/2004 | US20040155829 Slot aray antenna and plasma processing apparatus |
| 08/12/2004 | US20040155719 Voltage controlled oscillating circuit |
| 08/12/2004 | US20040155709 Operational amplification circuit, overheat detecting circuit and comparison circuit |
| 08/12/2004 | US20040155636 Semiconductor integrated circuit device |
| 08/12/2004 | US20040155592 Magnetic mirror plasma source |
| 08/12/2004 | US20040155365 Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same |
| 08/12/2004 | US20040155364 Reworkable thermosetting resin compositions |
| 08/12/2004 | US20040155363 Resin-encapsulated semiconductor device and method for manufacturing the same |
| 08/12/2004 | US20040155362 improved mold die which of a semiconductor chip in a chip-array molding process; reduces the likelihood of shorts between bonding wires near those regions in which opposing flows of mold resin meet |
| 08/12/2004 | US20040155361 thickness is further reduced and the stress applied to lead members in an encapsulation resin is reduced, thereby realizing a high reliability |
| 08/12/2004 | US20040155360 thermally conductive material is in physical contact with at least one of the die first surface, second surface and sidewall surface to alleviate overheating |
| 08/12/2004 | US20040155358 First and second level packaging assemblies and method of assembling package |
| 08/12/2004 | US20040155355 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 08/12/2004 | US20040155354 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 08/12/2004 | US20040155353 Semiconductor device and method of manufacturing semiconductor device |
| 08/12/2004 | US20040155352 Direct build-up layer on an encapsulated die package having a moisture barrier structure |
| 08/12/2004 | US20040155351 Semiconductor device and manufacturing method of that |
| 08/12/2004 | US20040155350 Semiconductor device having multi-layer interconnection structure |
| 08/12/2004 | US20040155348 Barrier structure for copper metallization and method for the manufacture thereof |
| 08/12/2004 | US20040155346 poor quality photo resist patterns are prevented because the focus area is confined to an exposure region |
| 08/12/2004 | US20040155345 configured by a logic circuit and a memory circuit and changing in function every certain time interval |
| 08/12/2004 | US20040155344 Semiconductor device and manufacturing method thereof |
| 08/12/2004 | US20040155342 Semiconductor device and manufacturing method thereof |
| 08/12/2004 | US20040155341 Implantating ions in shallow trench isolation structures |
| 08/12/2004 | US20040155340 Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device |
| 08/12/2004 | US20040155339 Method and packaging structure for optimizing warpage of flip chip organic packages |
| 08/12/2004 | US20040155335 Surface mount solder method and apparatus for decoupling capacitance and process of making |
| 08/12/2004 | US20040155334 Epoxy resin composition and semiconductor device |
| 08/12/2004 | US20040155333 Integrated circuit devices with an auxiliary pad for contact hole alignment |
| 08/12/2004 | US20040155330 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
| 08/12/2004 | US20040155327 entire die stack is attached to the substrate with one motion thereby reducing the number of iterations as compared to the typical method |
| 08/12/2004 | US20040155326 Semiconductor devices, and manufacturing methods, circuit substrates and electronic equipments for the same |
| 08/12/2004 | US20040155324 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 08/12/2004 | US20040155323 Semiconductor device |
| 08/12/2004 | US20040155322 multi-layered pattern leads with intervening insulating peripheral sealing portions formed between layers of the pattern leads allows pattern leads on different layers to cross, thereby increasing the flexibility in the arrangement of chip pads |
| 08/12/2004 | US20040155321 enabling solder package leads with pre-plated pure tin, while maintaining a palladium layer in the localized areas intended for wire bonding with its significant cost advantage over the traditional silver spot plated inner leads |
| 08/12/2004 | US20040155320 Method and apparatus for deposited hermetic cover for digital X-ray panel |
| 08/12/2004 | US20040155319 Fill pattern generation for spin-on glass and related self-planarization deposition |
| 08/12/2004 | US20040155318 plurality of contiguous semiconductor devices each separated by a scribe lane; signal line; and a plurality of electrical connections, each electrically coupling a different semiconductor devices to said signal line |
| 08/12/2004 | US20040155317 Transistor constructions and electronic devices |
| 08/12/2004 | US20040155316 Evaluation wiring pattern and evaluation method for evaluating reliability of semiconductor device, and semiconductor device having the same pattern |
| 08/12/2004 | US20040155313 Semiconductor device in which punchthrough is prevented |
| 08/12/2004 | US20040155307 Method for manufacture of magneto-resistive bit structure |
| 08/12/2004 | US20040155304 Semiconductor device and method for fabricating the same |
| 08/12/2004 | US20040155300 Low voltage NMOS-based electrostatic discharge clamp |
| 08/12/2004 | US20040155299 Memory devices and electronic systems comprising integrated bipolar and FET devices |
| 08/12/2004 | US20040155298 Memory devices and electronic systems comprising integrated bipolar and FET devices |
| 08/12/2004 | US20040155297 Semiconductor device and manufacturing method for the same |
| 08/12/2004 | US20040155296 Metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions and methods of fabricating the same |
| 08/12/2004 | US20040155295 Thin film transistor and display using the same |
| 08/12/2004 | US20040155291 Electrostatic discharge device |
| 08/12/2004 | US20040155290 Chip level hermetic and biocompatible electronics package using SOI wafers |
| 08/12/2004 | US20040155289 DRAM having increased capacity |