Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2004
08/24/2004US6780709 Method for forming charge storage node
08/24/2004US6780708 Method of forming core and periphery gates including two critical masking steps to form a hard mask in a core region that includes a critical dimension less than achievable at a resolution limit of lithography
08/24/2004US6780707 Method of forming semiconductor device having contact pad on source/drain region in peripheral circuit area
08/24/2004US6780706 Semiconductor container structure with diffusion barrier
08/24/2004US6780705 Semiconductor device and its manufacture
08/24/2004US6780704 Conformal thin films over textured capacitor electrodes
08/24/2004US6780703 Method for forming a semiconductor device
08/24/2004US6780702 Method of reducing device parasitic capacitance using underneath crystallographically selective wet etching
08/24/2004US6780701 Method for manufacturing high-breakdown voltage transistor and low-breakdown voltage transistor on the same substrate
08/24/2004US6780700 Method of fabricating deep sub-micron CMOS source/drain with MDD and selective CVD silicide
08/24/2004US6780699 Semiconductor device and method for fabricating the same
08/24/2004US6780698 Semiconductor device and its production method
08/24/2004US6780697 Method of manufacturing lateral double-diffused metal oxide semiconductor device
08/24/2004US6780696 Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
08/24/2004US6780695 BiCMOS integration scheme with raised extrinsic base
08/24/2004US6780694 MOS transistor
08/24/2004US6780693 Method of fabricating polysilicon thin film transistor
08/24/2004US6780692 Laser annealing apparatus and method of fabricating thin film transistor
08/24/2004US6780691 Method to fabricate elevated source/drain transistor with large area for silicidation
08/24/2004US6780687 Method of manufacturing a semiconductor device having a heat absorbing layer
08/24/2004US6780686 Doping methods for fully-depleted SOI structures, and device comprising the resulting doped regions
08/24/2004US6780685 Semiconductor device and manufacturing method thereof
08/24/2004US6780682 Process for precise encapsulation of flip chip interconnects
08/24/2004US6780681 Process of manufacturing a semiconductor device
08/24/2004US6780679 Semiconductor device and method of manufacturing the same
08/24/2004US6780678 Cooling of optoelectronic elements
08/24/2004US6780677 Process for mounting electronic device and semiconductor device
08/24/2004US6780676 Method for fabricating a circuit device
08/24/2004US6780675 Connecting first substrate to second substrate, where first substrate has raised bond pads which make electrical contact (without attachment) with raised bond pads on the second substrate; thermal expansion stress resistance
08/24/2004US6780673 Method of forming a semiconductor device package using a plate layer surrounding contact pads
08/24/2004US6780671 Method of encapsulating conductive lines of semiconductor devices
08/24/2004US6780669 Method of forming overmolded chip scale package and resulting product
08/24/2004US6780668 Package of semiconductor device and method of manufacture thereof
08/24/2004US6780667 Solid-state image pickup apparatus and fabricating method thereof
08/24/2004US6780659 Stencil mask and method of producing the same, semiconductor device produced using the stencil mask and method of producing the semiconductor device
08/24/2004US6780658 Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing
08/24/2004US6780656 Correction of overlay offset between inspection layers
08/24/2004US6780655 Methods of forming magnetoresistive memory devices
08/24/2004US6780654 Methods of forming magnetoresistive memory device assemblies
08/24/2004US6780653 Methods of forming magnetoresistive memory device assemblies
08/24/2004US6780652 Self-aligned MRAM contact and method of fabrication
08/24/2004US6780574 Multiple exposure method
08/24/2004US6780563 Polymer, resist composition and patterning process
08/24/2004US6780552 Method for controlling the quality of a lithographic structuring step
08/24/2004US6780551 Charged particle processing for forming pattern boundaries at a uniform thickness
08/24/2004US6780547 Halftone phase shifting photomask and blanks for halftone phase shifting photomask therefor and a method for forming pattern by using the halftone phase shifting photomask
08/24/2004US6780532 Photodiode detector and fabrication method thereof
08/24/2004US6780517 For use in semiconductor devices
08/24/2004US6780499 Porous low dielectric film
08/24/2004US6780498 Semiconductor integrated circuit having a fast response can be produced by using the film formed from a polysiloxane crosslinked with a polycarbosilane
08/24/2004US6780476 Method of forming a film using chemical vapor deposition
08/24/2004US6780464 Rotation in gas flow; forming polycrystalline silicon
08/24/2004US6780374 Method and apparatus for processing a microelectronic workpiece at an elevated temperature
08/24/2004US6780353 Method for making micromolds
08/24/2004US6780350 Metal-carbon composite powders, methods for producing powders and devices fabricated from same
08/24/2004US6780342 Exposing layer of copper by etching layer of silicon nitride on copper layer with etching gas constituted of trifluoromethane and oxygen, oxygen suppressing oxidation of copper layer during etching
08/24/2004US6780337 Method for trench etching
08/24/2004US6780336 Methods of fabricating MEMS and microfluidic devices using latent masking technique
08/24/2004US6780278 Plasma processing apparatus with reduced parasitic capacity and loss in RF power
08/24/2004US6780277 Etching method and etching apparatus
08/24/2004US6780267 Electronic device of ceramic
08/24/2004US6780251 Substrate processing apparatus and method for fabricating semiconductor device
08/24/2004US6780250 System and method for integrated oxide removal and processing of a semiconductor wafer
08/24/2004US6780249 System for producing patterned deposition from compressed fluid in a partially opened deposition chamber
08/24/2004US6780245 Method and apparatus of producing thin film of metal or metal compound
08/24/2004US6780238 Argon/ammonia rapid thermal annealing for silicon wafers
08/24/2004US6780091 Machining strain removal apparatus
08/24/2004US6780088 Chemical mechanical polishing apparatus and a method of chemical mechanical polishing using the same
08/24/2004US6780083 Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
08/24/2004US6780082 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
08/24/2004US6780039 Connector packaging tray with supporting standoffs
08/24/2004US6780023 Printed wiring board having plurality of conductive patterns passing through adjacent pads, circuit component mounted on printed wiring board and circuit module containing wiring board with circuit component mounted thereon
08/24/2004US6780001 Forming tool for forming a contoured microelectronic spring mold
08/24/2004US6779962 Device for handling flat panels in a vacuum
08/24/2004US6779760 Safety system for overhead transport vehicle
08/24/2004US6779711 Self-aligned corrosion stop for copper C4 and wirebond
08/24/2004US6779702 Wire bonding apparatus with spurious vibration suppressing structure
08/24/2004US6779667 Modular carrier for semiconductor wafer disks and similar inventory
08/24/2004US6779650 Apparatus for levitating objects and apparatus for transporting objects
08/24/2004US6779534 Apparatus and method for drying washed objects
08/24/2004US6779483 Plasma CVD apparatus for large area CVD film
08/24/2004US6779482 Plasma deposition device for forming thin film
08/24/2004US6779378 Method of monitoring evaporation rate of source material in a container
08/24/2004US6779278 Compact rotating stage
08/24/2004US6779263 Method for molding a polymer surface that reduces particle generation and surface adhesion forces while maintaining a high heat transfer coefficient
08/24/2004US6779261 Integrated balun and transformer structures
08/24/2004US6779258 Semiconductor packages and methods for making the same
08/24/2004US6779226 Factory interface particle removal platform
08/24/2004CA2319018C Process for ashing organic materials from substrates
08/24/2004CA2197400C Fabrication of sub-micron silicide structures on silicon using resistless electron beam lithography
08/19/2004WO2004070968A1 Receiver system and method for reduced swing differential clock
08/19/2004WO2004070900A1 System and methods using migration enhanced epitaxy for flattening active layers and the mechanical stabilization of quantum wells associated with vertical cavity surface emitting lasers
08/19/2004WO2004070850A2 Improved photovoltaic cell and method of production thereof
08/19/2004WO2004070848A1 Transistor for active matrix display and a method for producing said transistor
08/19/2004WO2004070847A1 Field-effect transistor, its manufacturing method, and complementary field-effect transistor
08/19/2004WO2004070846A1 Semiconductor device, production method thereof and light-emitting device
08/19/2004WO2004070842A1 Method for manufacturing semiconductor device
08/19/2004WO2004070841A2 Storage cell and method for the production thereof
08/19/2004WO2004070838A2 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
08/19/2004WO2004070836A1 Hermetic sealing cap and method for producing same