Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2004
08/17/2004US6777807 Interconnect integration
08/17/2004US6777806 Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same
08/17/2004US6777787 Semiconductor device with warp preventing board joined thereto
08/17/2004US6777782 Method for fabricating base-emitter self-aligned heterojunction bipolar transistors
08/17/2004US6777781 Base-to-substrate leakage cancellation
08/17/2004US6777780 Trench bipolar transistor
08/17/2004US6777777 High density composite MIM capacitor with flexible routing in semiconductor dies
08/17/2004US6777776 Semiconductor device that includes a plurality of capacitors having different capacities
08/17/2004US6777775 Semiconductor integrated circuit, D-A converter device, and A-D converter device
08/17/2004US6777774 Low noise inductor using electrically floating high resistive and grounded low resistive patterned shield
08/17/2004US6777772 Semiconductor device having improved trench structure
08/17/2004US6777770 Films deposited at glancing incidence for multilevel metallization
08/17/2004US6777769 Window layer formed on the absorption layer; diffusion region; semiconductors
08/17/2004US6777767 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
08/17/2004US6777764 Low temperature vapor deposition of silicon oxide layer over wafer; nitriding
08/17/2004US6777763 Semiconductor device and method for fabricating the same
08/17/2004US6777762 Mask ROM structure having a coding layer between gates and word lines
08/17/2004US6777761 Semiconductor chip using both polysilicon and metal gate devices
08/17/2004US6777760 Device with recessed thin and thick spacers for improved salicide resistance on polysilicon gates
08/17/2004US6777759 Device structure and method for reducing silicide encroachment
08/17/2004US6777758 Semiconductor device
08/17/2004US6777756 Semiconductor device
08/17/2004US6777754 Bleeder resistance circuit having conductors, dielectrics, and doped thin film resistors
08/17/2004US6777752 Complementary MOS semiconductor device
08/17/2004US6777751 Semiconductor device and method for fabricating the same
08/17/2004US6777749 High-voltage transistor with multi-layer conduction region
08/17/2004US6777748 Bi-directional semiconductor component
08/17/2004US6777747 Thick buffer region design to improve IGBT self-clamped inductive switching (SCIS) energy density and device manufacturability
08/17/2004US6777745 Symmetric trench MOSFET device and method of making same
08/17/2004US6777744 Circuits and methods using vertical, complementary transistors
08/17/2004US6777743 P-type emitter layer, an n- and p-type base layers formed in sequence; plurality of trenches arranged in parallel; reducing voltage waveform oscillations
08/17/2004US6777742 Hexagonal gate structure for radiation resistant flash memory cell
08/17/2004US6777741 Non-volatile memory cells with selectively formed floating gate
08/17/2004US6777740 Capacitor for semiconductor memory device and method of manufacturing the same
08/17/2004US6777739 Multilayer electrode for a ferroelectric capacitor
08/17/2004US6777738 Semiconductor integrated circuit
08/17/2004US6777737 Vertical DRAM punchthrough stop self-aligned to storage trench
08/17/2004US6777736 Semiconductor device and method of manufacturing the same
08/17/2004US6777735 Semiconductor memory device having a metal plug or a landing pad
08/17/2004US6777734 Structure of SRAM having asymmetric silicide layer
08/17/2004US6777733 Method for forming dual workfunction high-performance support MOSFETs in EDRAM arrays
08/17/2004US6777732 Random access memory
08/17/2004US6777730 Antiparallel magnetoresistive memory cells
08/17/2004US6777729 Semiconductor photodiode with back contacts
08/17/2004US6777728 Semiconductor device and complementary semiconductor device
08/17/2004US6777727 Flexural plate wave systems
08/17/2004US6777726 MOSFET source, drain and gate regions in a trench between a semiconductor pillar and filling insulation
08/17/2004US6777725 NROM memory circuit with recessed bitline
08/17/2004US6777723 Semiconductor device having protection circuit implemented by bipolar transistor for discharging static charge current and process of fabrication
08/17/2004US6777722 Method and structure for double dose gate in a JFET
08/17/2004US6777716 Semiconductor display device and method of manufacturing therefor
08/17/2004US6777714 Crystalline silicon semiconductor device and method for fabricating same
08/17/2004US6777713 Irregular semiconductor film, having ridges of convex portion
08/17/2004US6777707 Semiconductor integrated circuit with voltage down converter adaptable for burn-in testing
08/17/2004US6777698 Electron beam exposure apparatus exposing method using an electron beam
08/17/2004US6777697 Charged-particle beam exposure apparatus and device manufacturing method using the same
08/17/2004US6777694 Electron beam exposure system and electron lens
08/17/2004US6777687 Substrate positioning system
08/17/2004US6777677 Method of inspecting pattern and inspecting instrument
08/17/2004US6777648 Method and system to manufacture stacked chip devices
08/17/2004US6777645 High-speed, precision, laser-based method and system for processing material of one or more targets within a field
08/17/2004US6777642 Method and apparatus for cleaning surfaces
08/17/2004US6777612 Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
08/17/2004US6777565 Organometallic compounds and their use as precursors for forming films and powders of metal or metal derivatives
08/17/2004US6777478 Connecting integrated circuits; blend of thermoplastic resin and curing agent
08/17/2004US6777464 Circuit connecting material, and structure and method of connecting circuit terminal
08/17/2004US6777380 Stripping photoresists
08/17/2004US6777355 Manufacturing apparatus and manufacturing method for semiconductor device
08/17/2004US6777354 Semiconductor device and method of manufacturing the same
08/17/2004US6777353 Process for producing oxide thin films
08/17/2004US6777352 Variable flow deposition apparatus and method in semiconductor substrate processing
08/17/2004US6777351 Masking without photolithography during the formation of a semiconductor device
08/17/2004US6777350 Method and device of forming a film using a coating material and method of manufacturing a semiconductor device
08/17/2004US6777349 Hermetic silicon carbide
08/17/2004US6777348 Method of forming oxynitride film
08/17/2004US6777347 Method to produce porous oxide including forming a precoating oxide and a thermal oxide
08/17/2004US6777346 Planarization using plasma oxidized amorphous silicon
08/17/2004US6777345 Patterning methods for fabricating semiconductor devices
08/17/2004US6777344 Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applications
08/17/2004US6777343 Method of forming contacts for a bit line and a storage node in a semiconductor device
08/17/2004US6777342 Method of plasma etching platinum
08/17/2004US6777341 Method of forming a self-aligned contact, and method of fabricating a semiconductor device having a self-aligned contact
08/17/2004US6777340 Method of etching a silicon containing layer using multilayer masks
08/17/2004US6777339 Method for planarizing deposited film
08/17/2004US6777338 Spraying beveling nozzle; rotation; for semiconductors
08/17/2004US6777337 Planarizing method of semiconductor wafer and apparatus thereof
08/17/2004US6777336 Method of forming a shallow trench isolation structure
08/17/2004US6777335 Polishing method
08/17/2004US6777334 Method for protecting a wafer backside from etching damage
08/17/2004US6777333 Method for fabricating semiconductor device
08/17/2004US6777332 Method for forming wiring structure
08/17/2004US6777331 Multilayered copper structure for improving adhesion property
08/17/2004US6777330 Chemistry for chemical vapor deposition of titanium containing films
08/17/2004US6777329 Method to form C54 TiSi2 for IC device fabrication
08/17/2004US6777328 Method of forming multilayered conductive layers for semiconductor device
08/17/2004US6777327 Method of barrier metal surface treatment prior to Cu deposition to improve adhesion and trench filling characteristics
08/17/2004US6777326 Method for forming multi-layer metal line of semiconductor device
08/17/2004US6777325 Semiconductor manufacturing method for low-k insulating film
08/17/2004US6777324 Multi-layer interconnection structure in semiconductor device and method for fabricating same
08/17/2004US6777323 Lamination structure with copper wiring and its manufacture method