| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/12/2004 | US20040157471 Method for pretreating a substrate prior to application of a polymeric coat |
| 08/12/2004 | US20040157470 Functional device and production method therefor |
| 08/12/2004 | US20040157469 Semiconductor device and method of fabricating the same |
| 08/12/2004 | US20040157468 Method for fabricating semiconductor integrated circuit device |
| 08/12/2004 | US20040157467 Method for fabricating semiconductor intergrated circuit device |
| 08/12/2004 | US20040157466 Methods of forming polymer films and of using such polymer films to form structures on substrates |
| 08/12/2004 | US20040157465 Method for manufacturing an electronic device including removing a resist mask used in etching a substrate by ashing |
| 08/12/2004 | US20040157464 Manufacturing method of electronic device having wiring connection structure |
| 08/12/2004 | US20040157463 High-pressure processing chamber for a semiconductor wafer |
| 08/12/2004 | US20040157462 Method of removing etch residues |
| 08/12/2004 | US20040157461 Method for fabricating a wafer including dry etching the edge of the wafer |
| 08/12/2004 | US20040157460 Dual damascene etch processes |
| 08/12/2004 | US20040157459 Method of etching ferroelectric layers |
| 08/12/2004 | US20040157458 Methods for planarization of metal-containing surfaces using halogens and halides salts |
| 08/12/2004 | US20040157457 Methods of using polymer films to form micro-structures |
| 08/12/2004 | US20040157456 Surface defect elimination using directed beam method |
| 08/12/2004 | US20040157455 Selective base etching |
| 08/12/2004 | US20040157454 Chemical-mechanical polishing slurry and method |
| 08/12/2004 | US20040157453 Method of forming a low-K dual damascene interconnect structure |
| 08/12/2004 | US20040157452 Etching method and apparatus for semiconductor wafers |
| 08/12/2004 | US20040157451 Methods of fabricating non-volatile memory devices |
| 08/12/2004 | US20040157450 Waferlevel method for direct bumping on copper pads in integrated circuits |
| 08/12/2004 | US20040157448 Compositions and methods for removing etch residue |
| 08/12/2004 | US20040157447 Plasma processing method |
| 08/12/2004 | US20040157445 Method of and apparatus for tailoring an etch profile |
| 08/12/2004 | US20040157444 Photoresist intensive patterning and processing |
| 08/12/2004 | US20040157443 Semiconductor device and method for manufacturing the same |
| 08/12/2004 | US20040157442 Robust via structure and method |
| 08/12/2004 | US20040157441 Electroless plating liquid and semiconductor device |
| 08/12/2004 | US20040157440 Using stabilizers in electroless solutions to inhibit plating of fuses |
| 08/12/2004 | US20040157439 Methods of forming a contact hole in a semiconductor device |
| 08/12/2004 | US20040157437 Method for forming a dual damascene structure in a semiconductor device |
| 08/12/2004 | US20040157436 Mechanically reinforced highly porous low dielectric constant films |
| 08/12/2004 | US20040157435 Methods of forming metal lines in semiconductor devices |
| 08/12/2004 | US20040157434 Method of manufacturing SONOS flash memory device |
| 08/12/2004 | US20040157433 Plating metal caps on conductive interconnect for wirebonding |
| 08/12/2004 | US20040157432 Method of manufacturing a semiconductor device |
| 08/12/2004 | US20040157431 Barrier free copper interconnect by multi-layer copper seed |
| 08/12/2004 | US20040157430 Methods and apparatus for processing semiconductor wafers with plasma processing chambers in a wafer track environment |
| 08/12/2004 | US20040157429 Process for forming a diffusion barrier material nitride film |
| 08/12/2004 | US20040157428 Fill pattern generation for spin-on glass and related self-planarization deposition |
| 08/12/2004 | US20040157427 Nonvolatile magnetic memory device and manufucturing method thereof |
| 08/12/2004 | US20040157426 Fabrication of advanced silicon-based MEMS devices |
| 08/12/2004 | US20040157425 Multi-step process for forming a barrier film for use in copper layer formation |
| 08/12/2004 | US20040157424 Method of manufacturing electronic device |
| 08/12/2004 | US20040157423 Method for producing a semiconductor component, and semiconductor component produced by the same |
| 08/12/2004 | US20040157422 Methods for fabricating nonvolatile memory devices |
| 08/12/2004 | US20040157421 Methods of manufacturing mosfet devices |
| 08/12/2004 | US20040157420 Vacuum chuck utilizing sintered material and method of providing thereof |
| 08/12/2004 | US20040157419 Heat processing apparatus and heat processing method |
| 08/12/2004 | US20040157418 CMOS device having retrograde n-well and p-well |
| 08/12/2004 | US20040157416 Method of forming a non-volatile resistance variable device, and non-volatile resistance variable device |
| 08/12/2004 | US20040157415 Polymer sacrificial light absorbing structure and method |
| 08/12/2004 | US20040157413 Semiconductor film, semiconductor device, and method of manufacturing the same |
| 08/12/2004 | US20040157412 Method to produce germanium layers |
| 08/12/2004 | US20040157411 Integrated circuit package separator methods |
| 08/12/2004 | US20040157410 Semiconductor device, semiconductor module, electronic equipment, method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
| 08/12/2004 | US20040157409 Transfer of a thin layer from a wafer comprising a buffer layer |
| 08/12/2004 | US20040157408 Dual sided lithographic substrate imaging |
| 08/12/2004 | US20040157407 Room temperature metal direct bonding |
| 08/12/2004 | US20040157406 Method of fabricating semiconductor device |
| 08/12/2004 | US20040157405 Methods for forming a device isolating barrier and methods for forming a gate electrode using the same |
| 08/12/2004 | US20040157404 Method of forming a trench in a semiconductor device |
| 08/12/2004 | US20040157403 Method for fabricating AND-type flash memory cell |
| 08/12/2004 | US20040157402 Creation of high mobility channels in thin-body SOI devices |
| 08/12/2004 | US20040157401 Methods of fabricating silicon on insulator substrates for use in semiconductor devices |
| 08/12/2004 | US20040157399 Discontinuity prevention for SiGe deposition |
| 08/12/2004 | US20040157398 Method for fabricating a transistor |
| 08/12/2004 | US20040157397 Method of forming a pocket implant region after formation of composite insulator spacers |
| 08/12/2004 | US20040157396 Methods for forming double gate electrodes using tunnel and trench |
| 08/12/2004 | US20040157395 Method for fabricating nonvolatile memory device |
| 08/12/2004 | US20040157394 Semiconductor device and its manufacturing method |
| 08/12/2004 | US20040157393 Method for manufacturing embedded non-volatile memory with two polysilicon layers |
| 08/12/2004 | US20040157392 Capacitor in an interconnect system and method of manufacturing thereof |
| 08/12/2004 | US20040157391 Capacitor of semiconductor memory device that has composite Al2O3/HfO2 dielectric layer and method of manufacturing the same |
| 08/12/2004 | US20040157390 Method for fabricating a semiconductor structure |
| 08/12/2004 | US20040157389 Semiconductor memory cell and method for fabricating the memory cell |
| 08/12/2004 | US20040157388 Semiconductor memory device and method for fabricating the same |
| 08/12/2004 | US20040157387 Method for manufacturing self-aligned BiCMOS |
| 08/12/2004 | US20040157386 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
| 08/12/2004 | US20040157385 Method for manufacturing a semiconductor device by using a dry etching technique |
| 08/12/2004 | US20040157384 Power semiconductor device having a voltage sustaining region that includes doped columns formed with a single ion implantation step |
| 08/12/2004 | US20040157383 Method for forming short-channel transistors |
| 08/12/2004 | US20040157382 Buffer layer as a diffusion barrier layer is deposited between the silicon film and the glass substrate to obstruct the diffusion of the impurities |
| 08/12/2004 | US20040157381 Methods for forming a gate in a semiconductor device |
| 08/12/2004 | US20040157380 Method for fabricating a MOSFET having a very small channel length |
| 08/12/2004 | US20040157379 Method for making MOSFET anti-fuse structure |
| 08/12/2004 | US20040157378 Method of manufacturing a semiconductor device |
| 08/12/2004 | US20040157376 Method of manufacturing a semiconductor device and semiconductor device |
| 08/12/2004 | US20040157375 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween |
| 08/12/2004 | US20040157373 Stacked die module and techniques for forming a stacked die module |
| 08/12/2004 | US20040157371 Method for packaging a semiconductor device |
| 08/12/2004 | US20040157370 Inductors for integrated circuits, integrated circuit components, and integrated circuit packages |
| 08/12/2004 | US20040157369 Underfilling process in a molded matrix array package using flow front modifying solder resist |
| 08/12/2004 | US20040157368 Die bonding method and apparatus |
| 08/12/2004 | US20040157367 Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator |
| 08/12/2004 | US20040157365 Method for packaging a multi-chip module of a semiconductor device |
| 08/12/2004 | US20040157364 Manufacturing method of a microelectromechanical switch |
| 08/12/2004 | US20040157363 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 08/12/2004 | US20040157362 Methods of making microelectronic packages including electrically and/or thermally conductive element |