| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/26/2004 | WO2004073050A1 Radiant heating source |
| 08/26/2004 | WO2004073049A2 Methods and apparatus for processing semiconductor wafers with plasma processing chambers in a wafer track environment |
| 08/26/2004 | WO2004073047A2 Uv-blocking layer for reducing uv-induced charging of sonos dual-bit flash memory devices in beol processing |
| 08/26/2004 | WO2004073045A2 Epitaxial growth of a zirconium diboride layer on silicon substrates |
| 08/26/2004 | WO2004073044A2 Finfet device and method to make same |
| 08/26/2004 | WO2004073043A2 Semiconductor-on-insulator article and method of making same |
| 08/26/2004 | WO2004073036A2 High-pressure processing chamber for a semiconductor wafer |
| 08/26/2004 | WO2004073032A2 Integrally formed bake plate unit for use in wafer fabrication system |
| 08/26/2004 | WO2004073029A2 Vacuum chuck utilizing sintered material and method of providing |
| 08/26/2004 | WO2004073028A2 Method and apparatus for holding a substrate during high pressure processing |
| 08/26/2004 | WO2004073025A2 Methods of reducing photoresist distortion while etching in a plasma processing system |
| 08/26/2004 | WO2004073023A2 Low voltage nmos-based electrostatic discharge clamp |
| 08/26/2004 | WO2004073018A2 Sacrificial benzocyclobutene/norbornene polymers for making air gaps within semiconductor devices |
| 08/26/2004 | WO2004073015A2 Multiple conductive plug structure including at least one conductive plug region and at least one between-conductive-plug region for lateral rf mos devices |
| 08/26/2004 | WO2004073014A2 Metal reduction in wafer scribe area |
| 08/26/2004 | WO2004072983A1 Semiconductor device and method for controlling semiconductor device |
| 08/26/2004 | WO2004072979A2 Mram cells having magnetic write lines with a stable magnetic state at the end regions |
| 08/26/2004 | WO2004072978A2 High density and high programming efficiency mram design |
| 08/26/2004 | WO2004072959A2 Disk coating system |
| 08/26/2004 | WO2004072941A2 Display device with electrostatic discharge protection circuitry |
| 08/26/2004 | WO2004072735A1 Mask correcting method |
| 08/26/2004 | WO2004072667A1 Boundary scan controller, semiconductor device, method for identifying semiconductor circuit chip of semiconductor device, and method for controlling semiconductor circuit chip of semiconductor device |
| 08/26/2004 | WO2004072519A1 Valve for vacuum discharge system |
| 08/26/2004 | WO2004072517A1 Vacuum-feeding joint |
| 08/26/2004 | WO2004072332A1 Polishing fluid, method of polishing, and polishing apparatus |
| 08/26/2004 | WO2004072323A2 High reflectivity atmospheric pressure furnace for preventing contamination of a work piece |
| 08/26/2004 | WO2004072203A1 Process for producing polishing composition |
| 08/26/2004 | WO2004072133A1 Sacrificial styrene benzocyclobutene copolymers for making air gap semiconductor devices |
| 08/26/2004 | WO2004071938A2 Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency |
| 08/26/2004 | WO2004071700A2 Room temperature metal direct bonding |
| 08/26/2004 | WO2004071153A2 Method of forming sub-micron-size structures over a substrate |
| 08/26/2004 | WO2004053992A3 Shallow trench isolation in floating gate devices |
| 08/26/2004 | WO2004051711A3 Ferroelectric capacitor and process for its manufacture |
| 08/26/2004 | WO2004049403A3 Depositing nanowires on a substrate |
| 08/26/2004 | WO2004049062A3 Gas-expanded liquids, methods of use thereof, and systems using gas-expanded liquids for cleaning integrated circuits |
| 08/26/2004 | WO2004044958A3 Composition and method for low temperature deposition of silicon-containing films |
| 08/26/2004 | WO2004042791A3 Method and apparatus for monitoring integrated circuit fabrication |
| 08/26/2004 | WO2004040655A3 Semiconductor component and method of manufacture |
| 08/26/2004 | WO2004034467A3 Sublithographic nanoscale memory architecture |
| 08/26/2004 | WO2004034422A3 Wafer coating and singulation method |
| 08/26/2004 | WO2004030035A3 Via interconnect forming process and electronic component product thereof |
| 08/26/2004 | WO2004027837B1 Temperature-controlled substrate holder |
| 08/26/2004 | WO2004015742A3 High rate deposition in a batch reactor |
| 08/26/2004 | WO2004006297B1 Low dielectric materials and methods of producing same |
| 08/26/2004 | WO2004000928A3 Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings |
| 08/26/2004 | WO2003105191A3 Subpad having robust, sealed edges |
| 08/26/2004 | WO2003080887A3 Methods and apparatus for annealing in physical vapor deposition systems |
| 08/26/2004 | US20040168145 Service programmable logic arrays with low tunnel barrier interpoly insulators |
| 08/26/2004 | US20040168144 Method of designing semiconductor integrated circuit with accurate capacitance extraction |
| 08/26/2004 | US20040168143 Semiconductor integrated circuit, method of designing semiconductor integrated circuit, and device for designing the same |
| 08/26/2004 | US20040167755 Simulator for a chemical mechanical polishing |
| 08/26/2004 | US20040167743 System and method for on-the-fly eccentricity recognition |
| 08/26/2004 | US20040167722 Database interpolation method for optical measurement of diffractive microstructures |
| 08/26/2004 | US20040167656 Production managing system of semiconductor device |
| 08/26/2004 | US20040167322 Novel sulfonyldiazomethanes, photoacid generators, resist compositions, and patterning process |
| 08/26/2004 | US20040167047 Cleaning solution for substrates of electronic materials |
| 08/26/2004 | US20040167035 Multi-layered unit |
| 08/26/2004 | US20040166789 Method of sealing wafer backside for full-face processing |
| 08/26/2004 | US20040166783 Polishing apparatus and method |
| 08/26/2004 | US20040166782 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
| 08/26/2004 | US20040166773 Polishing apparatus |
| 08/26/2004 | US20040166771 Methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 08/26/2004 | US20040166698 Semiconductor device with dual gate oxides |
| 08/26/2004 | US20040166697 Method and apparatus for processing substrates in a system having high and low pressure areas |
| 08/26/2004 | US20040166696 Method of making a silicon nitride film that is transmissive to ultraviolet light |
| 08/26/2004 | US20040166695 For facilitating the deposition and patterning of organic materials onto substrates utilizing the vapor transport mechanism of carrier gas streams |
| 08/26/2004 | US20040166694 High density plasma chemical vapor deposition process |
| 08/26/2004 | US20040166693 Sputtering target compositions, and methods of inhibiting copper diffusion into a substrate |
| 08/26/2004 | US20040166691 Method of etching a metal line |
| 08/26/2004 | US20040166690 Methods of forming semiconductor constructions |
| 08/26/2004 | US20040166689 Method of fabrication of semiconductor integrated circuit device |
| 08/26/2004 | US20040166687 Method for forming a polycide gate and structure of the same |
| 08/26/2004 | US20040166686 Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP |
| 08/26/2004 | US20040166684 Silicon wafer and method for manufacturing the same |
| 08/26/2004 | US20040166683 Reduced cross-contamination between chambers in a semiconductor processing tool |
| 08/26/2004 | US20040166682 Semiconductor device for charge-up damage evaluation and charge-up damage evaluation method |
| 08/26/2004 | US20040166681 High efficiency, monolithic multijunction solar cells containing lattice-mismatched materials and methods of forming same |
| 08/26/2004 | US20040166680 Method of manufacturing semiconductor device |
| 08/26/2004 | US20040166679 System and method for monitoring contamination |
| 08/26/2004 | US20040166678 Wet clean method for PZT capacitors |
| 08/26/2004 | US20040166677 Process to suppress lithography at a wafer edge |
| 08/26/2004 | US20040166676 Method and apparatus for forming damascene structure, and damascene structure |
| 08/26/2004 | US20040166675 Manufacturing method of electro line for semiconductor device |
| 08/26/2004 | US20040166674 Method for making damascene interconnect with bilayer capping film |
| 08/26/2004 | US20040166673 Scaffold-organized clusters and electronic devices made using such clusters |
| 08/26/2004 | US20040166672 Oxidative conditioning compositions for metal oxide layer and applications thereof |
| 08/26/2004 | US20040166671 Methods for forming ruthenium films with beta-diketone containing ruthenium complexes and method for manufacturing metal-insulator-metal capacitor using the same |
| 08/26/2004 | US20040166670 Method for forming three-dimensional structures on a substrate |
| 08/26/2004 | US20040166669 Method of manufacturing semiconductor device having dual damascene structure |
| 08/26/2004 | US20040166668 Method for fabricating semiconductor device |
| 08/26/2004 | US20040166667 Method for manufacturing a semiconductor device |
| 08/26/2004 | US20040166666 Semiconductor device and method of manufacturing the same |
| 08/26/2004 | US20040166665 Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition |
| 08/26/2004 | US20040166664 Thin film-structure and a method for producing the same |
| 08/26/2004 | US20040166662 MEMS wafer level chip scale package |
| 08/26/2004 | US20040166661 Method for forming copper bump antioxidation surface |
| 08/26/2004 | US20040166660 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 08/26/2004 | US20040166659 Top layers of metal for high performance IC's |
| 08/26/2004 | US20040166658 Conductors created by metal deposition using a selective passivation layer and related methods |
| 08/26/2004 | US20040166657 Semiconductor device and its manufacturing method |