Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2004
08/31/2004US6784045 Microchannel formation for fuses, interconnects, capacitors, and inductors
08/31/2004US6784042 Integration process on a SOI substrate of a semiconductor device comprising at least a dielectrically isolated well
08/31/2004US6784041 Semiconductor device and method of manufacturing the same
08/31/2004US6784040 Nonvolatile semiconductor memory device and method for fabricating the same
08/31/2004US6784039 Method to form self-aligned split gate flash with L-shaped wordline spacers
08/31/2004US6784038 Process for producing semiconductor integrated circuit device and semiconductor integrated circuit device
08/31/2004US6784037 Semiconductor device and manufacturing method therefor
08/31/2004US6784036 Method for making semiconductor device
08/31/2004US6784035 Field effect transistor having source and/or drain forming Schottky or Schottky-like contact with strained semiconductor substrate
08/31/2004US6784034 Method for fabricating a thin film transistor
08/31/2004US6784033 Method for the manufacture of an insulated gate field effect semiconductor device
08/31/2004US6784031 Method for forming thin films of semiconductor devices
08/31/2004US6784028 Methods of making electromechanical three-trace junction devices
08/31/2004US6784026 Microelectronic die including low RC under-layer interconnects
08/31/2004US6784025 Semiconductor package with a die attach adhesive having silane functionality
08/31/2004US6784024 Die attach curing method for semiconductor device
08/31/2004US6784023 Method of fabrication of stacked semiconductor devices
08/31/2004US6784022 Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits
08/31/2004US6784021 Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus
08/31/2004US6784020 Package structure and method for making the same
08/31/2004US6784018 Method of forming chalcogenide comprising devices and method of forming a programmable memory cell of memory circuitry
08/31/2004US6784017 Method of creating a high performance organic semiconductor device
08/31/2004US6784015 Solid state image sensor and method for fabricating the same
08/31/2004US6784011 Method for manufacturing thin-film structure
08/31/2004US6784009 Electrode patterning in OLED devices
08/31/2004US6784006 Semiconductor device, method of manufacturing semiconductor device, and system for evaluating electrical characteristics of semiconductor device
08/31/2004US6784005 Photoresist reflow for enhanced process window for random, isolated, semi-dense, and other non-dense contacts
08/31/2004US6784004 Method of determining post-etch offset in exposed-to-embedded overlay
08/31/2004US6784003 Quick turn around time system and method of use
08/31/2004US6784002 Method to make wafer laser marks visable after bumping process
08/31/2004US6784001 Automated variation of stepper exposure dose based upon across wafer variations in device characteristics, and system for accomplishing same
08/31/2004US6784000 Method for measurement of electromigration in semiconductor integrated circuits
08/31/2004US6783999 Subtractive stud formation for MRAM manufacturing
08/31/2004US6783998 Conductive thin film, a capacitor using the same and a method of manufacturing thereof
08/31/2004US6783997 Gate structure and method
08/31/2004US6783996 Capacitor of semiconductor device and fabrication method thereof
08/31/2004US6783995 Protective layers for MRAM devices
08/31/2004US6783994 Method of fabricating a self-aligned magnetic tunneling junction and via contact
08/31/2004US6783921 Method for etching laminated assembly including polyimide layer
08/31/2004US6783917 High resolution, dimensional stability; electronic devices with smaller feature sizes
08/31/2004US6783916 Hydroxyl-containing polymer, amino cross-linking agent, thermal acid generator; for use as undercoat layer in deep uv lithography
08/31/2004US6783912 Photoacid generators and photoresists comprising same
08/31/2004US6783905 Exposure region is divided into a plurality of grating regions. a pattern density is obtained for one of the plurality of grating regions. a backward scattering coefficient is determined in accordance with the pattern
08/31/2004US6783868 Halogen addition for improved adhesion of CVD copper to barrier
08/31/2004US6783863 Substrate with a surface spray coating of yttrium oxide (Y2O3); resistance to chemical corrosion and plasma erosion by halogen gas
08/31/2004US6783862 Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures
08/31/2004US6783814 Graft polymer of porous polymer and interpenetrating polymer network
08/31/2004US6783811 Uv light irradiation process on a metal oxide film in vacuum or in an atmosphere of reducing gas at a temperature maintained between 25 degrees c. and 300 degrees c to reduce resistance
08/31/2004US6783801 Methods for making a paste of materials to form bumps for screen print processes
08/31/2004US6783695 Acid blend for removing etch residue
08/31/2004US6783694 Remove materials in the presence of cobalt silicide
08/31/2004US6783658 Electropolishing method
08/31/2004US6783643 Exposure surface to flux; controlling concentration
08/31/2004US6783640 A reactive sputtering process employing a plasma emission monitor
08/31/2004US6783639 Coils for generating a plasma and for sputtering
08/31/2004US6783634 Manufacturing method and apparatus of phase shift mask blank
08/31/2004US6783630 Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling
08/31/2004US6783628 Plasma processing apparatus
08/31/2004US6783627 Reactor with remote plasma system and method of processing a semiconductor substrate
08/31/2004US6783626 Treatment and evaluation of a substrate processing chamber
08/31/2004US6783599 Applying a fluid to the surface; lowering the temperature of the fluid so as to form a solid layer of the fluid over the surface and entrapping impurities within the layer, applying sonic energy which separates layer including impurities
08/31/2004US6783596 Wafer handling device
08/31/2004US6783592 Lateral movement of screw dislocations during homoepitaxial growth and devices yielded therefrom free of the detrimental effects of screw dislocations
08/31/2004US6783591 Laser thermal annealing method for high dielectric constant gate oxide films
08/31/2004US6783590 Method of growing a thin film onto a substrate
08/31/2004US6783446 Chemical mechanical polishing apparatus and method of chemical mechanical polishing
08/31/2004US6783445 Polishing apparatus
08/31/2004US6783440 Polishing apparatus
08/31/2004US6783436 Polishing pad with optimized grooves and method of forming same
08/31/2004US6783434 Cerium oxide slurry containing cerium oxide particles, a dispersant polymer containing ammonium acrylate as a copolymerized ingredient, a polyammonium-acrylate or a polyamine-acrylate, and water
08/31/2004US6783427 Polishing system with air exhaust system
08/31/2004US6783299 Latch for detachably attaching and mounting a semiconductor wafer to a support ring
08/31/2004US6783274 Device for measuring temperature of semiconductor integrated circuit
08/31/2004US6783118 Vaporizing reactant liquids for chemical vapor deposition film processing
08/31/2004US6782907 Gas recirculation flow control method and apparatus for use in vacuum system
08/31/2004US6782901 Sulfuric acid recycle apparatus
08/31/2004US6782900 Methods and apparatus for cleaning and/or treating a substrate using CO2
08/31/2004US6782897 Method of protecting a passivation layer during solder bump formation
08/31/2004US6782883 Cutting device for breaking fragile materials such as semiconductor wafers or the like
08/31/2004US6782843 Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system
08/31/2004US6782677 Tablet detecting system for molding tablet supplying apparatus
08/31/2004US6782613 Interposer structures having formed thereon a plurality of conductive pillars or recesses that are adapted to make electrical contact with the leads of an integrated circuit package
08/31/2004US6782610 Method for fabricating a wiring substrate by electroplating a wiring film on a metal base
08/26/2004WO2004073363A1 Plasma generating apparatus, plasma generating method, and remote plasma processing apparatus
08/26/2004WO2004073362A1 Plasma generating apparatus and plasma etching apparatus
08/26/2004WO2004073118A1 Perimeter sealed high density multi-pin connector
08/26/2004WO2004073073A1 Method for manufacturing semiconductor device and apparatus for manufacturing semiconductor device
08/26/2004WO2004073072A1 Mis semiconductor device and method for manufacturing mis semiconductor device
08/26/2004WO2004073071A1 Semiconductor integrated circuit device and its production method
08/26/2004WO2004073070A1 Compound semiconductor epitaxial substrate and method for manufacturing same
08/26/2004WO2004073063A1 Electronic device and semiconductor device
08/26/2004WO2004073062A2 Method of manufacturing a reinforced semiconductor wafer
08/26/2004WO2004073061A1 Sacrificial benzocyclobutene copolymers for making air gap semiconductor devices
08/26/2004WO2004073060A1 Polishing apparatus and two-step method of polishing a metal layer of an integrated circuit
08/26/2004WO2004073059A1 Method for planarizing bumped die
08/26/2004WO2004073058A2 Flash memory devices
08/26/2004WO2004073057A1 Method for manufacturing silicon wafer
08/26/2004WO2004073056A1 Method for cleaning substrate processing apparatus and substrate processing apparatus
08/26/2004WO2004073054A1 Cooling device for vacuum treatment device
08/26/2004WO2004073051A1 Purged heater-susceptor for an ald/cvd reactor