| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/26/2004 | US20040165169 Lithographic apparatus, level sensor, method of inspection, device manufacturing method, and device manufactured thereby |
| 08/26/2004 | US20040165168 Lithographic apparatus and device manufacturing method |
| 08/26/2004 | US20040165166 Exposure apparatus and production method of device using the same |
| 08/26/2004 | US20040165161 Cooling mechanism |
| 08/26/2004 | US20040165160 Lithographic apparatus and device manufacturing method |
| 08/26/2004 | US20040165138 Drive IC and display device having the same |
| 08/26/2004 | US20040165121 Active matrix substrate and manufacturing method thereof |
| 08/26/2004 | US20040165071 Boundary scan device |
| 08/26/2004 | US20040165056 Scanning brush and method of use |
| 08/26/2004 | US20040164786 Semiconductor integrated circuit device |
| 08/26/2004 | US20040164778 Non-volatile latch circuit and a driving method thereof |
| 08/26/2004 | US20040164761 Method of measuring gate capacitance by correcting dissipation factor error |
| 08/26/2004 | US20040164760 Wireless radio frequency technique design and method for testing |
| 08/26/2004 | US20040164759 Prober |
| 08/26/2004 | US20040164756 Probe card transporting apparatus and to-be-connected body moving mechanism |
| 08/26/2004 | US20040164725 Apparatus and method for thin-layer metrology |
| 08/26/2004 | US20040164684 EL display device and electronic apparatus |
| 08/26/2004 | US20040164504 Universal substrate holder for treating objects in fluids |
| 08/26/2004 | US20040164470 Anti-vibration technique |
| 08/26/2004 | US20040164429 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film |
| 08/26/2004 | US20040164428 Method of manufacturing a semiconductor device and a semiconductor device |
| 08/26/2004 | US20040164426 Each electrically conductive adhesive bump connects a bonding pad and a corresponding bump pad, and has a smaller diameter at the central portion thereof than at the end portions thereof. |
| 08/26/2004 | US20040164425 one package includes a plurality of chips, each of which is capable of functioning as one memory chip; dicing line interposed between basic chips that configures a part of the memory chip; bump connecting the logic chip and the memory chip |
| 08/26/2004 | US20040164422 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size |
| 08/26/2004 | US20040164421 Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices |
| 08/26/2004 | US20040164420 Sputtering target compositions, and methods of inhibiting copper diffusion into a substrate |
| 08/26/2004 | US20040164419 Multilevel copper interconnects with low-k dielectrics and air gaps |
| 08/26/2004 | US20040164418 Semiconductor device having a pillar structure |
| 08/26/2004 | US20040164417 Semiconductor device and manufacturing method thereof |
| 08/26/2004 | US20040164416 Multi-layered unit |
| 08/26/2004 | US20040164415 Electrode employing nitride-based semiconductor of III-V group compound, and producing method thereof |
| 08/26/2004 | US20040164414 Semiconductor device package and method of making the same |
| 08/26/2004 | US20040164413 Underfilled, encapsulated semiconductor die assemblies and methods of fabrication |
| 08/26/2004 | US20040164411 Semiconductor package and method for fabricating the same |
| 08/26/2004 | US20040164410 Die package |
| 08/26/2004 | US20040164407 Semiconductor device, power amplifier device and PC card |
| 08/26/2004 | US20040164403 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
| 08/26/2004 | US20040164401 Module with adhesively attached heat sink |
| 08/26/2004 | US20040164399 Semiconductor device and manufacturing method therefor |
| 08/26/2004 | US20040164395 sealed in a resin package and having its terminals exposed on a bottom surface of the package. |
| 08/26/2004 | US20040164394 Multi-chip package and method for manufacturing the same |
| 08/26/2004 | US20040164390 [semiconductor package with a heat spreader] |
| 08/26/2004 | US20040164389 [chip package and process for forming the same] |
| 08/26/2004 | US20040164387 Semiconductor device fabricating apparatus and semiconductor device fabricating method |
| 08/26/2004 | US20040164386 Unmolded package for a semiconductor device |
| 08/26/2004 | US20040164380 Semiconductor and semiconductor substrate, method of manufacturing the same, and semiconductor device |
| 08/26/2004 | US20040164379 Ion implantation with multiple concentration levels |
| 08/26/2004 | US20040164378 Method for fabricating an NPN transistor in a BICMOS technology |
| 08/26/2004 | US20040164377 Semiconductor device including voltage conversion circuit having temperature dependency |
| 08/26/2004 | US20040164376 Semiconductor device and method for manufacturing the same |
| 08/26/2004 | US20040164375 Semiconductor integrated circuit device and a method of manufacturing the same |
| 08/26/2004 | US20040164374 Field effect transistor and method of manufacturing the same |
| 08/26/2004 | US20040164373 Shallow trench isolation structure for strained Si on SiGe |
| 08/26/2004 | US20040164372 Methods of sensing temperature of an electronic device workpiece |
| 08/26/2004 | US20040164370 Light-receiving device, method for manufacturing the same, and optoelectronic integrated circuit comprising the same |
| 08/26/2004 | US20040164369 Tilted array geometry for improved MRAM switching |
| 08/26/2004 | US20040164365 reliable gate dielectric having an equivalent oxide thickness thinner than attainable using SiO2; formed by ion assisted electron beam evaporation of TiO2 and electron beam evaporation of a lanthamide, particularly Nd, Tb, and Dy |
| 08/26/2004 | US20040164364 Semiconductor device and its manufacturing method |
| 08/26/2004 | US20040164363 depositing nanoparticles having relative dielectric constant greater than 10 coated with organic surfactant on a substrate to form a monolayer; controlling granularity and thickness of dielectric films; integration into high-density memory devices |
| 08/26/2004 | US20040164362 Reactive gate electrode conductive barrier |
| 08/26/2004 | US20040164361 Permanently on transistor implemented using a double polysilicon layer CMOS process with buried contact |
| 08/26/2004 | US20040164360 Semiconductor integrated circuit device and a method of manufacturing the same |
| 08/26/2004 | US20040164359 memory functional element on the semiconductor layer across the boundary of the first and second conductivity type regions; electrode in contact with the memory and on the first conductivity type region via an insulation film |
| 08/26/2004 | US20040164358 Method of manufacturing a dual gate semiconductor device with a poly-metal electrode |
| 08/26/2004 | US20040164357 Atomic layer-deposited LaAIO3 films for gate dielectrics |
| 08/26/2004 | US20040164356 Electrostatic discharge protection structures having high holding current for latch-up immunity |
| 08/26/2004 | US20040164353 upper side portion of a semiconductor layer is rounded to prevent a concentration of an electric field and a resultant lowering of a threshold voltage; generation of etching residue is prevented by a concavity of a U-shaped section |
| 08/26/2004 | US20040164352 Active matrix pixel device construction method |
| 08/26/2004 | US20040164350 Power mosfet device |
| 08/26/2004 | US20040164349 without sacrificing ON-voltage, switch-OFF characteristics, and miniaturization; relaxes electric fields in a semiconductor substrate without thickening thickness of a drift region |
| 08/26/2004 | US20040164348 minimum number of epitaxial deposition steps while allowing sufficient control of process parameters so that a high degree of charge compensation can be achieved in adjacent columns of opposite in the drift region |
| 08/26/2004 | US20040164347 Design and fabrication of rugged FRED |
| 08/26/2004 | US20040164345 Semiconductor memory with vertical charge-trapping memory cells and fabrication |
| 08/26/2004 | US20040164344 Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source |
| 08/26/2004 | US20040164343 Semiconductor storage device |
| 08/26/2004 | US20040164342 Integrated circuit memory device and method |
| 08/26/2004 | US20040164341 Operating a memory device |
| 08/26/2004 | US20040164340 Nonvolatile semiconductor memory device including improved gate electrode |
| 08/26/2004 | US20040164339 Capacitor and method of manufacturing a capacitor |
| 08/26/2004 | US20040164338 Semiconductor device and method for fabricating the same |
| 08/26/2004 | US20040164337 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device |
| 08/26/2004 | US20040164336 Films doped with carbon for use in integrated circuit technology |
| 08/26/2004 | US20040164335 Double sided container process used during the manufacture of a semiconductor device |
| 08/26/2004 | US20040164334 Hybrid bulk/silicon-on-insulator multiprocessors |
| 08/26/2004 | US20040164333 Semiconductor devices and methods for manufacturing the same |
| 08/26/2004 | US20040164332 Methods of manufacturing low cross-talk electrically programmable resistance cross point memory structures |
| 08/26/2004 | US20040164329 Semiconductor device and method of manufacturing the same |
| 08/26/2004 | US20040164328 Semiconductor device and method of manufacturing the same |
| 08/26/2004 | US20040164327 Method of horizontally growing carbon nanotubes and field effect transistor using the carbon nanotubes grown by the method |
| 08/26/2004 | US20040164326 Semiconductor memories |
| 08/26/2004 | US20040164323 Ferroelectric memory devices with enhanced ferroelectric properties and methods for fabricating such memory devices |
| 08/26/2004 | US20040164320 Method of activating polysilicon gate structure dopants after offset spacer deposition |
| 08/26/2004 | US20040164319 Gallium arsenide HBT having increased performance and method for its fabrication |
| 08/26/2004 | US20040164318 Structures with planar strained layers |
| 08/26/2004 | US20040164317 Heterojunction type compound semiconductor field effect transistor and its manufacturing method |
| 08/26/2004 | US20040164316 Pressure contact type semiconductor device having dummy segment |
| 08/26/2004 | US20040164315 Structure and device including a tunneling piezoelectric switch and method of forming same |
| 08/26/2004 | US20040164313 Trench capacitor with buried strap |
| 08/26/2004 | US20040164312 Method of fabricating semiconductor device and semiconductor device |
| 08/26/2004 | US20040164308 Method of manufacturing a semiconductor light emitting device, semiconductor light emitting device, method of manufacturing a semiconductor device, semiconductor device, method of manufacturing a device, and device |