Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2013
12/12/2013US20130330886 Method of forming thin film poly silicon layer and method of forming thin film transistor
12/12/2013US20130330885 Side-gate defined tunable nanoconstriction in double-gated graphene multilayers
12/12/2013US20130330884 Methods for protecting electronic circuits operating under high stress conditions
12/12/2013US20130330883 Fabrication method of semiconductor package
12/12/2013US20130330881 Double-sided adhesive tape, semiconductor packages, and methods of fabricating the same
12/12/2013US20130330880 Three dimensional flip chip system and method
12/12/2013US20130330879 Manufacturing method of semiconductor integrated circuit device
12/12/2013US20130330878 Hermetically sealed mems device and method of fabrication
12/12/2013US20130330866 Light emitting device and fabrication method thereof
12/12/2013US20130330847 Method and system for semiconductor device pattern loading effect characterization
12/12/2013US20130330846 Test vehicles for encapsulated semiconductor device packages
12/12/2013US20130330845 Gas cluster ion beam process for opening conformal layer in a high aspect ratio contact via
12/12/2013US20130330844 Laser annealing systems and methods with ultra-short dwell times
12/12/2013US20130330843 Method of manufacturing scaled equivalent oxide thickness gate stacks in semiconductor devices and related design structure
12/12/2013US20130330674 Method of patterning self-organizing material, patterned substrate of self-organizing material and method of producing the same, and photomask using patterned substrate of self-organizing material
12/12/2013US20130330165 Accommodating device for retaining wafers
12/12/2013US20130330154 Support for semiconductor substrate
12/12/2013US20130329508 Methods And Devices For Determining Logical To Physical Mapping On An Integrated Circuit
12/12/2013US20130329483 Filamentary memory devices and methods
12/12/2013US20130329479 Arrays Of Nonvolatile Memory Cells And Methods Of Forming Arrays Of Nonvolatile Memory Cells
12/12/2013US20130329376 Electronic modules
12/12/2013US20130329222 Inspecting apparatus and method for manufacturing semiconductor device
12/12/2013US20130329209 Mask, exposure apparatus and device manufacturing method
12/12/2013US20130329158 Active matrix substrate, display device, and short circuit defect correction method for active matrix substrate
12/12/2013US20130328220 Integrated circuit packaging system with film assist and method of manufacture thereof
12/12/2013US20130328217 Method of marking semiconductor element, method of manufacturing semiconductor device, and semiconductor device
12/12/2013US20130328216 Integrated circuit packaging system with interposer and method of manufacture thereof
12/12/2013US20130328213 Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
12/12/2013US20130328210 Semiconductor device and method of manufacturing thereof
12/12/2013US20130328208 Dual damascene dual alignment interconnect scheme
12/12/2013US20130328207 Embedded semiconductive chips in reconstituted wafers, and systems containing same
12/12/2013US20130328205 Integrated circuits having a continuous active area and methods for fabricating same
12/12/2013US20130328203 Method for applying a final metal layer for wafer level packaging and associated device
12/12/2013US20130328201 Reliable interconnect for semiconductor device
12/12/2013US20130328199 Semiconductor device with spacers for capping air gaps and method for fabricating the same
12/12/2013US20130328196 Semiconductor device with multi-layered storage node and method for fabricating the same
12/12/2013US20130328195 Utilization of a metallization scheme as an etching mask
12/12/2013US20130328190 Methods and Apparatus of Packaging Semiconductor Devices
12/12/2013US20130328189 Bump-on-Lead Flip Chip Interconnection
12/12/2013US20130328186 Reduced stress tsv and interposer structures
12/12/2013US20130328185 Power Semiconductor Module, Method of Manufacturing Power Semiconductor Module, and Power Conversion Device
12/12/2013US20130328180 Packaged semiconductor device with an exposed metal top surface
12/12/2013US20130328179 Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof
12/12/2013US20130328177 Stack semiconductor package and manufacturing the same
12/12/2013US20130328176 Emi-shielded semiconductor devices and methods of making
12/12/2013US20130328175 Method for the hydrogen passivation of semiconductor layers
12/12/2013US20130328174 Edge Protection of Bonded Wafers During Wafer Thinning
12/12/2013US20130328172 Wafer-level flip chip device packages and related methods
12/12/2013US20130328170 Semiconductor element, manufacturing method thereof and operating method thereof
12/12/2013US20130328167 Self-aligned metal-insulator-metal (mim) capacitor
12/12/2013US20130328162 Homo-junction diode structures using fin field effect transistor processing
12/12/2013US20130328159 Implementing isolated silicon regions in silicon-on-insulator (soi) wafers using bonded-wafer technique
12/12/2013US20130328157 Spacer isolation in deep trench
12/12/2013US20130328155 Generation of additional shapes on a photomask for a multiple exposure process
12/12/2013US20130328151 Integrated circuit structure, back side illumination image sensor and integrated circuit process thereof
12/12/2013US20130328142 Integrated circuit with pressure sensor and manufacturing method
12/12/2013US20130328137 Modified high-k gate dielectric stack
12/12/2013US20130328132 Power semiconductor device and method therefor
12/12/2013US20130328131 Semiconductor Devices, Methods of Manufacture Thereof, and Methods of Forming Resistors
12/12/2013US20130328127 SiGe SRAM BUTTED CONTACT RESISTANCE IMPROVEMENT
12/12/2013US20130328126 Epitaxial formation of source and drain regions
12/12/2013US20130328124 Gated diode structure for eliminating rie damage from cap removal
12/12/2013US20130328123 Semiconductor device
12/12/2013US20130328122 Split trench-gate mosfet with integrated schottky diode
12/12/2013US20130328121 Mosfet with improved performance through induced net charge region in thick bottom insulator
12/12/2013US20130328119 Non-volatile memory and manufacturing method thereof
12/12/2013US20130328117 Floating gate non-volatile memory bit cell
12/12/2013US20130328116 Dram with a nanowire access transistor
12/12/2013US20130328112 Semiconductor devices having improved gate height uniformity and methods for fabricating same
12/12/2013US20130328111 Recessing and capping of gate structures with varying metal compositions
12/12/2013US20130328068 Devices, systems, and methods related to distributed radiation transducers
12/12/2013US20130328064 Method and system for transient voltage suppressors
12/12/2013US20130328061 Normally-off gallium nitride transistor with insulating gate and method of making the same
12/12/2013US20130328059 Method Of Manufacturing Gallium Nitride Substrate And Gallium Nitride Substrate Manufactured Thereby
12/12/2013US20130328054 Gallium nitride based semiconductor device and method of manufacturing the same
12/12/2013US20130328049 Thin-film transistor substrate and method of manufacturing the same
12/12/2013US20130328048 Composite substrate, electronic component, and method of manufacturing composite substrate and electronic component
12/12/2013US20130328046 Semiconductor device and a method of manufacturing the same
12/12/2013US20130328020 Method of repairing short circuit defect, and display apparatus and organic light emitting display apparatus manufactured according to the repairing method
12/12/2013US20130328015 Extreme high mobility cmos logic
12/12/2013US20130328014 Gaas/ingaas axial heterostructure formation in nanopillars by catalyst-free selective area mocvd
12/12/2013US20130327977 Composition and method for polishing molybdenum
12/12/2013US20130327939 Semiconductor inspecting apparatus
12/12/2013US20130327641 Protective offset sputtering
12/12/2013US20130327392 Chemically Linked Colloidal Crystals and Methods Related Thereto
12/12/2013US20130327391 Apparatus and method for improving efficiency of thin-film photovoltaic devices
12/12/2013US20130327365 Substrate cleaning method and substrate cleaning apparatus
12/12/2013US20130327363 Substrate processing apparatus and substrate processing method
12/12/2013US20130327274 Substrate support and semiconductor manufacturing apparatus
12/12/2013US20130327272 Diagnostic and control systems and methods for substrate processing systems using dc self-bias voltage
12/12/2013DE112012001195T5 Unabhängig spannungsgesteuertes Siliciumvolumen auf einem Silicium-auf-Isolator-Chip Independently voltage-controlled volume silicon on a silicon-on-insulator chip
12/12/2013DE112012001049T5 Getriebesteuervorrichtung und elektronische Schaltungsvorrichtung Transmission control apparatus, and electronic circuit device
12/12/2013DE112012000850T5 Ausbilden eines randlosen Kontakts für Transistoren in einem Ersatzmetall-Gate-Prozess Forming a borderless contact for transistors in a replacement metal gate process
12/12/2013DE112012000833T5 Aushärtbare Nanoprägezusammensetzung, mittels Nanoprägelithografie hergestelltes Formprodukt und Verfahren zur Ausbildung einer Strukturiereung Curable nanoimprint composition produced by Nanoimprint lithography molded product and method for forming a Strukturiereung
12/12/2013DE112010003495B4 Tunnelfeldeffekttransistor-Struktur und Verfahren zur Herstellung Tunnel field-effect transistor structure, and process for preparing
12/12/2013DE112006000916B4 Gaslagerspindeln Gas bearing spindles
12/12/2013DE112005003802B4 Verfahren zum Herstellen eines elektronischen Bauteils A method of manufacturing an electronic component
12/12/2013DE102013210551A1 Aufteiler für plattenförmiges Objekt Allocation for disc-shaped object
12/12/2013DE102013204566A1 Substratträger und Halbleiterherstellungsvorrichtung Carrier substrate and semiconductor manufacturing apparatus
12/12/2013DE102013106049A1 Wärmeausdehnungskoeffizient-Anpassung in einem Halbleitergehäuse Thermal expansion coefficient adjustment in a semiconductor body
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