| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/11/2013 | CN103442868A Method for cleaning mold with mold-releasing layer and method for producing mold with mold-releasing layer |
| 12/11/2013 | CN103442840A Laser removal of conductive seed layers |
| 12/11/2013 | CN103441194A LED epitaxial wafer, manufacturing method thereof and LED chip with same |
| 12/11/2013 | CN103441155A Solar battery integrating bypass diode and preparation method of solar battery |
| 12/11/2013 | CN103441152A Trench MOS barrier Schottky diode and manufacturing method |
| 12/11/2013 | CN103441149A Groove power device and manufacturing method thereof |
| 12/11/2013 | CN103441145A Semiconductor device and forming method, starting circuit and switching power source of semiconductor device |
| 12/11/2013 | CN103441144A HEMT device and manufacturing method thereof |
| 12/11/2013 | CN103441141A Ultra-wide temperature area high-thermal-stability microwave power SiGe heterojunction bipolar transistor |
| 12/11/2013 | CN103441138A Array substrate, manufacturing method of array substrate, and display device |
| 12/11/2013 | CN103441137A Electroluminescent display panel and its manufacturing method |
| 12/11/2013 | CN103441131A Partially-depleted silicon-on-insulator device structure |
| 12/11/2013 | CN103441130A Substrate with static electricity self-protection capability and manufacturing method thereof |
| 12/11/2013 | CN103441129A Array substrate, manufacturing method of array substrate and display device |
| 12/11/2013 | CN103441128A TFT array substrate and manufacturing method thereof |
| 12/11/2013 | CN103441127A Semiconductor memory device and method for manufacturing the same |
| 12/11/2013 | CN103441125A Surge protection circuit based on bidirectional thyristor and method for manufacturing same |
| 12/11/2013 | CN103441124A Stacking packaging method of voltage regulator and corresponding stacking packaging device |
| 12/11/2013 | CN103441118A Conductive barrier layer material for copper interconnection and preparation method of conductive barrier layer material |
| 12/11/2013 | CN103441116A Semiconductor package piece and manufacturing method thereof |
| 12/11/2013 | CN103441111A Three-dimensional packaging interconnection structure and manufacturing method thereof |
| 12/11/2013 | CN103441109A Semiconductor element, semiconductor package structure and manufacturing method thereof |
| 12/11/2013 | CN103441107A Semiconductor packaging piece and manufacturing method thereof |
| 12/11/2013 | CN103441105A Display panel and its manufacturing method |
| 12/11/2013 | CN103441104A 晶圆切割方法 Wafer Cutting Methods |
| 12/11/2013 | CN103441103A 晶圆切割方法 Wafer Cutting Methods |
| 12/11/2013 | CN103441102A Method for repairing thick film hybrid integrated circuit with ceramic thick film resistor unit |
| 12/11/2013 | CN103441101A Method for preparing full-color light emitting diode module |
| 12/11/2013 | CN103441100A Display substrate and manufacturing method and display device of display substrate |
| 12/11/2013 | CN103441099A Method for preventing metal circuits in organic light-emitting diode display device from being short-circuited |
| 12/11/2013 | CN103441098A Simple preparation method of wafer-level high-density wiring |
| 12/11/2013 | CN103441097A Etching method of silicon oxide insulating layer of bottom of deep hole |
| 12/11/2013 | CN103441096A Filling method of redundant graphs |
| 12/11/2013 | CN103441095A Method of manufacturing a semiconductor integrated circuit device |
| 12/11/2013 | CN103441094A Capacitor piece transmission guide device |
| 12/11/2013 | CN103441093A Slide glass structure for temporary bonding and manufacturing method of slide glass structure |
| 12/11/2013 | CN103441092A Battery silicon slice automatic dust removing device |
| 12/11/2013 | CN103441091A Manufacturing equipment and method for semiconductor apparatus |
| 12/11/2013 | CN103441090A Single-face corrosion device applicable to semiconductor chip |
| 12/11/2013 | CN103441089A Control method of wet etching process |
| 12/11/2013 | CN103441088A 自动化系统 Automation Systems |
| 12/11/2013 | CN103441087A Method and device for producing flexible substrate |
| 12/11/2013 | CN103441086A Method for detecting light resistance layer ion implantation stopping capacity |
| 12/11/2013 | CN103441085A Chip flip-mounting BGA encapsulating method |
| 12/11/2013 | CN103441084A Technology for manufacturing silicon slice alloy |
| 12/11/2013 | CN103441083A Temporary bonding method used for three-dimension integration |
| 12/11/2013 | CN103441082A Brand-novel integrated circuit packaging technology |
| 12/11/2013 | CN103441081A Semiconductor composite structure and semiconductor process |
| 12/11/2013 | CN103441080A Chip front-mounting BGA encapsulating method |
| 12/11/2013 | CN103441079A Preparation method of wafer-level high-density wiring |
| 12/11/2013 | CN103441078A Three-dimensional system-level chip normal installation stacking packaging structure formed by sealing first and then corroding and technique method |
| 12/11/2013 | CN103441077A Method for manufacturing shell of microwave high-power pipe |
| 12/11/2013 | CN103441076A Preparation method for forming side wall |
| 12/11/2013 | CN103441075A Method for manufacturing floating gate MOS transistor |
| 12/11/2013 | CN103441074A Method for manufacturing IGBT device integrated with diode |
| 12/11/2013 | CN103441073A Low-power-consumption MOS device grid electrode etching method and low-power-consumption MOS device manufacturing method |
| 12/11/2013 | CN103441072A Method for etching silicide-blocked oxide layer |
| 12/11/2013 | CN103441071A Method for shrinking critical size in polysilicon gate dry etching |
| 12/11/2013 | CN103441070A Texture surface making equipment of crystal silicon wafers and texture surface making method |
| 12/11/2013 | CN103441069A Method for improving active area |
| 12/11/2013 | CN103441068A Method for forming double patterning based on DARC mask structure |
| 12/11/2013 | CN103441067A Dual pattern forming method applied to grid line end cutting |
| 12/11/2013 | CN103441066A Grid electrode LELE dual graph forming method based on DARC mask structure |
| 12/11/2013 | CN103441065A Method for preparing P-type ohmic contact layer of high Al content AlGaN material and application of P-type ohmic contact layer |
| 12/11/2013 | CN103441064A Method for improving gate oxide surface uniformity |
| 12/11/2013 | CN103441063A Method for preparing silicon carbide micro-structures |
| 12/11/2013 | CN103441062A Method for preparing Ge component and bandwidth regulated SiGe nanobelt |
| 12/11/2013 | CN103441061A 电容器结构及其制作方法 Capacitor structure and manufacturing method thereof |
| 12/11/2013 | CN103439869A Method for measuring graphic density |
| 12/11/2013 | CN103439863A Exposure device and exposure method, maintenance method, and device manufacturing method |
| 12/11/2013 | CN103439862A 栅极lele双重图形成型方法 Lele double gate patterning method |
| 12/11/2013 | CN103438710A Substrate processing system |
| 12/11/2013 | CN103434180A Novel packaging hot-pressing head device |
| 12/11/2013 | CN103433450A Method for manufacturing chip integrated unit |
| 12/11/2013 | CN103026467B Wafer working tape |
| 12/11/2013 | CN102522365B Application of tellurium-based composite film as SOI (Semiconductor On Insulator) material and SOI power device |
| 12/11/2013 | CN102479690B Method for improving uniformity of working current on wafer during source drain annealing |
| 12/11/2013 | CN102468234B Method for forming side wall on designated area |
| 12/11/2013 | CN102446724B Method for manufacturing gate electrode |
| 12/11/2013 | CN102412202B Manufacture method of SON (single oligonucleotide nested) complementary type metallic oxide semiconductor with self-aligned void layers |
| 12/11/2013 | CN102403246B Method for detecting pollution of mask plate |
| 12/11/2013 | CN102386134B Method for making semiconductor device structure |
| 12/11/2013 | CN102386058B Method for forming monocrystalline silicon layer |
| 12/11/2013 | CN102326239B Method of producing semiconductor chip stack, and semiconductor device |
| 12/11/2013 | CN102299127B Bidirectional radiator used for packaged component and assembly method thereof |
| 12/11/2013 | CN102299111B Method for manufacturing complementary metal oxide semiconductor device structure |
| 12/11/2013 | CN102280452B Thin film transistor substrate, method of fabricating the same and flat display having the same |
| 12/11/2013 | CN102280411B Method for manufacturing semiconductor device structure |
| 12/11/2013 | CN102270643B Semiconductor device and method of manufacturing same |
| 12/11/2013 | CN102254856B Semiconductor device used in interconnection technology and manufacturing method thereof |
| 12/11/2013 | CN102239537B Method of manufacturing lamp and quartz bulb |
| 12/11/2013 | CN102224586B Structure and manufacture method for multi-row lead frame and semiconductor package |
| 12/11/2013 | CN102201420B Photoelectric conversion apparatus, image pickup system, and manufacturing method therefor |
| 12/11/2013 | CN102194650B Method for evaluating efficiency of processes for improving negative bias temperature instability effect |
| 12/11/2013 | CN102181232B Composition for low downforce chemically mechanical polishing of coppers in ULSI (Ultra Large Scale Integrated Circuit) multi-layered copper wiring |
| 12/11/2013 | CN102169846B Method for writing multi-dimensional variable password in parallel in process of testing integrated circuit wafer |
| 12/11/2013 | CN102169818B Improved method of texturing semiconductor substrates |
| 12/11/2013 | CN102163539B Device and method for processing substrate |
| 12/11/2013 | CN102148200B Method for forming active layer pattern of memory |
| 12/11/2013 | CN102137960B Method for manufacturing nitride substrate, and nitride substrate |