Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2004
12/09/2004US20040248349 Manufacturing method for a semiconductor substrate comprising at least a buried cavity and devices formed with this method
12/09/2004US20040248348 Method of forming precision recessed gate structure
12/09/2004US20040248347 Laser beam irradiation method and method of manufacturing a thin film transistor
12/09/2004US20040248346 Inducing semiconductor crystallization using a capillary structure
12/09/2004US20040248345 [method of fabricating a polysilicon thin film]
12/09/2004US20040248344 Microelectromechanical systems, and methods for encapsualting and fabricating same
12/09/2004US20040248343 Method for protecting the redistribution layer on wafers/chips
12/09/2004US20040248342 Method for packaging integrated circuit chips
12/09/2004US20040248340 Process for large-scale production of cdte/cds thin film solar cells
12/09/2004US20040248338 Solution influenced alignment
12/09/2004US20040248336 Method and apparatus for manufacturing photovoltaic device
12/09/2004US20040248333 Liquid crystal display device and method for manufacturing the same
12/09/2004US20040248329 Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus
12/09/2004US20040248328 Transfer molding apparatus and method for manufacturing semiconductor devices
12/09/2004US20040248311 Using absorption spectrochemical analysis to determine extent of copper contamination of silicon semiconductor
12/09/2004US20040248047 Method of forming thin-film pattern
12/09/2004US20040248045 for forming thin line portion having a line width thinner than a minimum line width which can be optically resolved by a projection exposure system by slimming a line width of a pattern transferred on a semiconductor substrate
12/09/2004US20040248044 Method for manufacturing a semiconductor device, stencil mask and method for manufacturing a the same
12/09/2004US20040248040 method and apparatus for reforming an organic material film such as an interlayer insulating film; irradiated onto the organic material film through a hydrocarbon radical generating gas
12/09/2004US20040248039 Photoresist compositions and processes for preparing the same
12/09/2004US20040248033 Method for forming photoresist pattern and photoresist laminate
12/09/2004US20040248032 have non-carbon tetravalent species (Si, Ti, Ge, Zr, Sn) and photoresists that comprise such polymers; component of resists imaged at short wavelengths
12/09/2004US20040248030 Copolymer of an unsaturated carboxylic acid, an unsaturated carboxylic anhydride, an unsaturated epoxy group, and an olefinically unsaturated compound; and a 1,2-quinonediazide compound; flatness, transparency, developing performance, residual film rate, chemical resistance, heat resistance
12/09/2004US20040248020 Exposure mask and pattern exposure method
12/09/2004US20040248018 to produce patterns of substantially the same size but having different pitches, including fine pitches; can be selectively isotropically etched to form an undercut under the portion of the opaque layer that extends between the second and third transparent regions
12/09/2004US20040248017 Substrate for photomask, photomask blank and photomask
12/09/2004US20040247947 comprises sapphire single crystal substrate and contoured/flat underfilm; usable for semiconductor films constituting light-emitting diode or high velocity integrated circuit chip
12/09/2004US20040247897 Sol solution for producing glass coatings for electrically conductive materials that can be used in anodic bonding
12/09/2004US20040247894 Integrated circirts; doped semiconductor; recrystallization; annealing
12/09/2004US20040247852 Polishing sheet and polishing work method
12/09/2004US20040247844 Overcoating substrate by spin coating; rotation at various velocities
12/09/2004US20040247840 Electronic elements, method for manufacturing electronic elements, circuit substrates, method for manufacturing circuit substrates, electronic devices and method for manufacturing electronic devices
12/09/2004US20040247824 Optically transparent carrier having radiation absorption over visible band of electromagnetic spectrum; distribution of reflective microflakes comprising cholesteric liquid crystal (CLC) are suspended; inks, paints, crayons; super-white and additive-primary coloring media
12/09/2004US20040247799 Plasma enhanced chemical vapor deposition apparatus
12/09/2004US20040247797 Electroconductive film wiring on pattern area on a plate by liquid drop discharge; andsecond conductive film formed outside to be electrically separated; uniform thickness, quality
12/09/2004US20040247790 Filling a passage to dispose liquid droplets and conduit to supply solution to ejection head with purified water; dissolving with solvent; forming banks corresponding to film pattern; disposing drops into grooves; liquid crystal displays, color filters, electroluminescence; ink jets
12/09/2004US20040247788 Bulk tungsten deposition by positioning and exposing substrate surface to a diborane soak; nucleation by alternately pulsing tungsten compound borane, diborane, silane, and/or dichlorosilane; cyclical, chemical, or physical vapor deposition
12/09/2004US20040247782 Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
12/09/2004US20040247424 Device and method for the harmonized positioning of wafer disks
12/09/2004US20040247418 Transferring apparatus, carrying apparatus, and transferring method
12/09/2004US20040247417 Intermediate product transferring apparatus and carrying system having the intermediate product transferring apparatus
12/09/2004US20040247361 Lithographic apparatus, substrate holder and method of manufacturing
12/09/2004US20040247172 Pattern measuring apparatus, pattern measuring method, and manufacturing method of semiconductor device
12/09/2004US20040247077 X-ray exposure method
12/09/2004US20040246803 Nonvolatile semiconductor memory device and method for fabricating the same
12/09/2004US20040246795 SOI substrate and manufacturing method thereof
12/09/2004US20040246794 Apparatus for mounting semiconductors
12/09/2004US20040246788 Magnetoresistive device and magnetic memory device
12/09/2004US20040246787 Semiconductor integrated circuit and method for fabricating the same
12/09/2004US20040246780 Semiconductor device
12/09/2004US20040246777 Magnetic recording element and method of manufacturing magnetic recording element
12/09/2004US20040246773 Test mode decoder in a flash memory
12/09/2004US20040246765 Integrated circuit, semiconductor device comprising the same, electronic device having the same, and driving method of the same
12/09/2004US20040246761 Data reading method, data writing method, and semiconductor memory device
12/09/2004US20040246690 Printed circuit board, method for producing same and semiconductor device
12/09/2004US20040246647 Monolithic integrated circuit arrangement
12/09/2004US20040246631 Spin valve magnetoresistive device with enhanced performance
12/09/2004US20040246481 Differential numerical aperture methods
12/09/2004US20040246472 Method and apparatus for defect detection
12/09/2004US20040246459 Lithographic support structure
12/09/2004US20040246458 Lithographic linear motor, lithographic apparatus, and device manufacturing method
12/09/2004US20040246456 Exposure apparatus
12/09/2004US20040246455 Alignment apparatus and exposure apparatus
12/09/2004US20040246454 Projecting exposure apparatus
12/09/2004US20040246427 Display device
12/09/2004US20040246337 Self-test executable integrated circuit, a design apparatus thereof, and a scan chain design apparatus
12/09/2004US20040246309 Table device, film-forming apparatus, optical element, semiconductor element, and electric apparatus
12/09/2004US20040246243 Electro-optical device and electronic apparatus
12/09/2004US20040246043 Power element protection circuit and semiconductor device incorporating it
12/09/2004US20040246041 Feedback control system and method
12/09/2004US20040246035 Semiconductor integrated circuit
12/09/2004US20040246019 Inspection device and inspection method for active matrix panel, and manufacturing method for active matrix organic light emitting diode panel
12/09/2004US20040246018 TFT array inspection device
12/09/2004US20040246012 Article transfer system
12/09/2004US20040246011 Method and apparatus for inspecting wire breaking of integrated circuit
12/09/2004US20040245979 Semiconductor integrated circuit
12/09/2004US20040245956 Methods and apparatus for positioning a substrate relative to a support stage
12/09/2004US20040245936 Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
12/09/2004US20040245935 Plasma-processing apparatus
12/09/2004US20040245924 Organic EL display device, electronic equipment, and method for manufacturing the same
12/09/2004US20040245896 Piezoelectric device and manufacturing method therefor
12/09/2004US20040245893 Ultrasonic transducer assembly
12/09/2004US20040245861 Linear motor, stage device having this linear motor, exposure device, and device manufacturing method
12/09/2004US20040245656 Semiconductor integrated circuit device
12/09/2004US20040245655 Semiconductor device, its manufacturing method, and radio communication device
12/09/2004US20040245654 Flip-chip attach structure and method
12/09/2004US20040245653 Flip chip package having protective cap and method of fabricating the same
12/09/2004US20040245652 Semiconductor device, electronic device, electronic appliance, and method of manufacturing a semiconductor device
12/09/2004US20040245651 Semiconductor device and method for fabricating the same
12/09/2004US20040245650 Semiconductor contact structure and method of forming the same
12/09/2004US20040245648 Bonding material and bonding method
12/09/2004US20040245647 Three-dimensional percolated layer is a metallic mesoporous conductive structure of nanoparticles; the interconnection or connection is produced by tunneling; cavities house luminescent particles
12/09/2004US20040245646 Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same
12/09/2004US20040245645 Semiconductor integrated circuit device having multilevel interconnection
12/09/2004US20040245644 Low K film application for interlevel dielectric and method of cleaning etched features
12/09/2004US20040245643 Semiconductor device and method of manufacturing the same
12/09/2004US20040245642 Semiconductor device
12/09/2004US20040245641 Semiconductor device, electro-optical unit, and electronic apparatus
12/09/2004US20040245639 Structure for reducing stress-induced voiding in an interconnect of integrated circuits
12/09/2004US20040245637 Method for supporting a bond pad in a multilevel interconnect structure and support structure formed thereby