H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2004
12/09/2004	US20040245636 Full removal of dual damascene metal level
12/09/2004	US20040245635 Methods for forming contacts in semiconductor devices having local silicide regions and semiconductor devices formed thereby
12/09/2004	US20040245634 Stacked device underfill and a method of fabrication
12/09/2004	US20040245633 Integrating chip scale packaging metallization into integrated circuit die structures
12/09/2004	US20040245631 Integrating chip scale packaging metallization into integrated circuit die structures
12/09/2004	US20040245630 Chip having a passivation layer with a recess; bonding pad exposed by the layer; redistribution layer; second passivation layer with an opening that exposes the redistribution layer above the recess; bump inside the opening and electrically connected to the redistribution layer above the recess
12/09/2004	US20040245628 Tape package having test pad on reverse surface and method for testing the same
12/09/2004	US20040245626 Semiconductor device, system device using it, and manufacturing method of a semiconductor device
12/09/2004	US20040245625 Semiconductor device, circuit board, electronic apparatus, and method for manufacturing semiconductor device
12/09/2004	US20040245623 Semiconductor device, circuit substrate and electronic instrument
12/09/2004	US20040245622 Semiconductor device
12/09/2004	US20040245621 Semiconductor wafer, semiconductor device, circuit board, electronic instrument, and method for manufacturing semiconductor device
12/09/2004	US20040245618 Integrated circuit and method for fabricating an integrated circuit
12/09/2004	US20040245616 Stacked device underfill and a method of fabrication
12/09/2004	US20040245614 Semiconductor package having semiconductor constructing body and method of manufacturing the same
12/09/2004	US20040245612 Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument
12/09/2004	US20040245611 Pre-applied thermoplastic reinforcement for electronic components
12/09/2004	US20040245609 Package structure for an integrated circuit
12/09/2004	US20040245608 Semiconductor package having conductive bumps on chip and method for fabricating the same
12/09/2004	US20040245607 Semiconductor integrated circuit device and method of manufacturing the same
12/09/2004	US20040245606 In-plane on-chip decoupling capacitors and method for making same
12/09/2004	US20040245605 Composite semiconductor wafer and a method for forming the composite semiconductor wafer
12/09/2004	US20040245602 Method of fabricating metal-insulator-metal capacitor (MIM) using lanthanide-doped HfO2
12/09/2004	US20040245601 Semiconductor device
12/09/2004	US20040245600 Semiconductor device and its manufacturing method
12/09/2004	US20040245599 Semiconductor device
12/09/2004	US20040245598 Semiconductor device
12/09/2004	US20040245596 Semiconductor device having trench isolation
12/09/2004	US20040245595 Semiconductor device
12/09/2004	US20040245594 Chemical sensor using chemically induced electron-hole production at a Schottky barrier
12/09/2004	US20040245587 Micromachine and production method thereof
12/09/2004	US20040245585 Integrated resistor network for multi-functional use in constant current or constant voltage operation of a pressure sensor
12/09/2004	US20040245584 Forming method and forming system for insulation film
12/09/2004	US20040245583 Semiconductor device and manufacturing method thereof
12/09/2004	US20040245582 Field effect transistor using vanadium dioxide layer as channel material and method of manufacturing the field effect transistor
12/09/2004	US20040245581 Semiconductor device including forming an amorphous silicon layer over and reacting with a silicide layer
12/09/2004	US20040245580 [chip structure with a passive device and method for forming the same]
12/09/2004	US20040245579 Complementary mis device
12/09/2004	US20040245578 Method of fabricating a CMOS device with dual metal gate electrodes
12/09/2004	US20040245577 SRAM devices, and electronic systems comprising SRAM devices
12/09/2004	US20040245574 ESD protection device with thick poly film and method for forming the same
12/09/2004	US20040245573 Semiconductor device serving as a protecting element
12/09/2004	US20040245572 Semiconductor integrated circuit device and cellular terminal using the same
12/09/2004	US20040245571 Semiconductor-on-insulator article and method of making same
12/09/2004	US20040245570 Semiconductor device, and production method for manufacturing such semiconductor device
12/09/2004	US20040245569 Device architecture and process for improved vertical memory arrays
12/09/2004	US20040245568 Non-volatile floating gate memory cell with floating gates formed in cavities, and array thereof, and method of formation
12/09/2004	US20040245567 Nonvolatile semiconductor memory device
12/09/2004	US20040245565 Polysilicon structure in a stacked gate region of a semiconductor device
12/09/2004	US20040245564 Semiconductor storage device, semiconductor device and their manufacturing methods, and portable electronic equipment, and IC card
12/09/2004	US20040245562 Stack gate with tip vertical memory and method for fabricating the same
12/09/2004	US20040245561 Compositions for thin-film capacitive device, high-dielectric constant insulating film, thin-film capacitance device, and thin-film multilayer ceramic capacitor
12/09/2004	US20040245560 Methods of forming rugged electrically conductive surfaces and layers
12/09/2004	US20040245559 Capacitor constructions
12/09/2004	US20040245558 Trench capacitor and corresponding method of production
12/09/2004	US20040245555 Semiconductor storage device
12/09/2004	US20040245553 Magnetoresistive effect element and magnetic memory device
12/09/2004	US20040245552 Production method for semiconductor substrate and production method for field effect transistor and semiconductor substrate and field effect transistor
12/09/2004	US20040245550 Organic field-effect transistor and method of making same based on polymerizable self-assembled monolayers
12/09/2004	US20040245549 Thin film transistor and fabrication method thereof
12/09/2004	US20040245547 Ultra low-cost solid-state memory
12/09/2004	US20040245540 Semiconductor device and method of fabricating the same
12/09/2004	US20040245527 Terminal and thin-film transistor
12/09/2004	US20040245526 Flat panel display device with polycrystalline silicon thin film transistor
12/09/2004	US20040245524 Thin film transistor and manufacturing method thereof
12/09/2004	US20040245519 Thin film transistor device and method of manufacturing same
12/09/2004	US20040245492 ABO3 with an A-site compensation component that compensates for a vacancy of an A site, and a B-site compensation component which compensates for a vacancy of a B site; film having hysteresis characteristics with excellent squareness loop which can be used for the simple matrix type ferroelectric memory
12/09/2004	US20040245489 Methods and apparatus for sealing an opening of a processing chamber
12/09/2004	US20040245480 Substrate positioning system
12/09/2004	US20040245476 Ion implantation ion source, system and method
12/09/2004	US20040245314 Wire bonder
12/09/2004	US20040245237 Thermal treatment equipment and thermal treatment method
12/09/2004	US20040245217 Conductive etch stop for etching a sacrificial layer
12/09/2004	US20040245216 Devices and method of their manufacture
12/09/2004	US20040245214 Electroless plating apparatus and post-electroless plating cleaning method
12/09/2004	US20040245213 Process for making circuit board or lead frame
12/09/2004	US20040245112 Apparatus and method for plating a substrate
12/09/2004	US20040245111 Plating tank for wire patterns on film carrier; prevent bubble adhesion
12/09/2004	US20040245110 Overcoating substrate with film; electrolysis plating; overlapping film; preferential removing segments of film; wet etching
12/09/2004	US20040245109 Film carrier tape for mounting electronic devices thereon, production method thereof and plating apparatus
12/09/2004	US20040245091 Etching, depositing cycles using hydrogen and helium gases; reducing sputtering; high density plasma vapor deposition
12/09/2004	US20040244949 Temperature controlled shield ring
12/09/2004	US20040244945 Cooling apparatus for wafer baking plate
12/09/2004	US20040244915 Semiconductor apparatus with multiple delivery devices for components
12/09/2004	US20040244912 Method and apparatus for photomask fabrication
12/09/2004	US20040244911 Sluury composition for use in chemical mechanical polishing of metal wiring
12/09/2004	US20040244906 Laminated structure
12/09/2004	US20040244823 Cleaning solution and cleaning method of a semiconductor device
12/09/2004	US20040244821 Cleaning method, storage method, pattern formation method, device manufacturing method, electro-optical device, and electronic apparatus
12/09/2004	US20040244818 System and method for cleaning of workpieces using supercritical carbon dioxide
12/09/2004	US20040244695 Holder for Use in Semiconductor or Liquid-Crystal Manufacturing Device and Semiconductor or Liquid-Crystal Manufacturing Device in Which the Holder Is Installed
12/09/2004	US20040244694 Processing unit and processing method
12/09/2004	US20040244688 Plasma processing apparatus
12/09/2004	US20040244687 Etching method and apparatus
12/09/2004	US20040244685 Pretreated gas distribution plate
12/09/2004	US20040244684 System and method of deposition of magnetic multilayer film, method of evaluation of film deposition, and method of control of film deposition
12/09/2004	US20040244672 Substituted donor atoms in silicon crystal for quantum computer
12/09/2004	US20040244512 System operating unit
12/09/2004	US20040244384 Heating medium circulating device and thermal, treatment equipment using the device
12/09/2004	US20040244300 Metals such as copper, tantalum; high speed, efficiency; storage stability, nonprecipitating; mixture of anionic surfactant, abrasive, metal compound and water

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