| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/09/2004 | DE4342047B4 Halbleiterbauelement mit einer Diffusionsbarrierenschichtanordnung und Verfahren zu seiner Herstellung A semiconductor device comprising a diffusion barrier layer assembly and process for its preparation |
| 12/09/2004 | DE202004011369U1 MOSFET, has ratio of width of each insulator-filled well zone to width of drift zone set so that output capacitance of MOSFET is minimized |
| 12/09/2004 | DE19747777B4 Verfahren zum Herstellen eines Halbleiterbauteils A method of manufacturing a semiconductor device |
| 12/09/2004 | DE19744098B4 Verfahren zur Herstellung einer Matrix aus Dünnschichttransistoren für Flüssigkristallbildschirme A process for producing a matrix of thin film transistors for liquid-crystal screens |
| 12/09/2004 | DE19729600B4 Mustervergleichsüberprüfungssystem und -verfahren, die ein Grauwertpunktraster verwenden Pattern matching verification system and method using a grayscale bitmap |
| 12/09/2004 | DE19729578B4 Drahtsäge und Verfahren, bei denen die Drahtsäge eingesetzt wird Wire saw and methods in which the wire saw is used |
| 12/09/2004 | DE19549635B4 Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip A method of connecting a flexible substrate having a chip |
| 12/09/2004 | DE10360969A1 Verfahren zum Trockenätzen eines mehrlagigen Schichtmaterials A method for dry etching of a multilayer coating material |
| 12/09/2004 | DE10344315B3 Electrochemical etching process for removing foreign phases on the surface of a chalcopyrite semiconductor in an aqueous electrolyte comprises applying a potential profile to the working electrode in the positive potential region |
| 12/09/2004 | DE10323235A1 Silicon substrate for production of silicon pieces, containing at least one depression on one surface with profile reducing for largest to smallest depth |
| 12/09/2004 | DE10321742A1 Integrierte Schaltungsanordnung mit Isoliergraben und Feldeffekttransistor sowie Herstellungsverfahren An integrated circuit device with isolation trench and field effect transistor and manufacturing method |
| 12/09/2004 | DE10321740A1 Bitleitungsstruktur sowie Verfahren zu deren Herstellung Bit line structure as well as processes for their preparation |
| 12/09/2004 | DE10321739A1 Bitleitungsstruktur sowie Verfahren zu deren Herstellung Bit line structure as well as processes for their preparation |
| 12/09/2004 | DE10321494A1 Semiconductor production process for high aspect ratio memory circuits forms surfaces perpendicular and not perpendicular to substrate and ion implants to give selective wet etch |
| 12/09/2004 | DE10320877A1 Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device |
| 12/09/2004 | DE10320874A1 Integrated semiconductor memory has memory cell with inversion channel and small gate dielectric thickness permitting thermal majority carriers to tunnel to gate electrode |
| 12/09/2004 | DE10320854A1 Dispersion zum chemisch-mechanischen Polieren Dispersion for chemical mechanical polishing, |
| 12/09/2004 | DE10319976A1 Semiconductor chip especially a memory chip has an individualized electrical lead structure independent of the chip function |
| 12/09/2004 | DE10318074A1 Process for improving the mechanical properties of BOC module arrangements used in production of circuit boards comprises providing a wafer or chips after their separation and before their assembly on a circuit board with a casting compound |
| 12/09/2004 | DE10297450T5 Verfahren und Vorrichtung zur Verwendung integrierter Messdaten als Daten für eine Vorwärtskopplung Method and device for integrated use measurement data as data for a feedforward |
| 12/09/2004 | DE10297415T5 Testvorrichtung für Halbleiterbauelemente Test apparatus for semiconductor devices |
| 12/09/2004 | DE10297316T5 Gestapelte Baugruppen Stacked modules |
| 12/09/2004 | DE10296750T5 Faser-optische Wafer-Sonde Fiber-optic wafer probe |
| 12/09/2004 | DE102004023918A1 Vorrichtung und Verfahren zum Entfernen von Dünnfilmen Apparatus and method for removing thin films |
| 12/09/2004 | DE102004022800A1 MOSFET-Gate-Treiberschaltung MOSFET gate driver circuit |
| 12/09/2004 | DE102004022355A1 Halbleiterbaustein mit bidirektionalem Eingabe-/Ausgabeanschluss und zugehöriges Verfahren zum Ein- und Ausgeben von Daten Semiconductor device with bidirectional input / output port and associated method for inputting and outputting data |
| 12/09/2004 | DE102004020677A1 Semiconductor memory device for use as static random access memory, has memory cell storing data, where memory cell includes to inverters including load elements and driving elements having N channel metal oxide semiconductor transistors |
| 12/09/2004 | DE102004018434A1 Multi-chip package comprises package substrate having bond fingers, first chip having first bonding pads on its center portion, insulating support structures, bonding wire, and second chip with second bonding pads disposed over bonding wire |
| 12/09/2004 | DE102004015229A1 Elektronenstrahlbearbeitungsverfahren und -vorrichtung Electron beam processing method and apparatus |
| 12/09/2004 | DE102004002723A1 Halbleiterbauelement mit einem SOI-Aufbau A semiconductor device with a SOI structure |
| 12/09/2004 | DE102004002238A1 Verfahren zum Vereinzeln von Wafern A method for separating wafers |
| 12/09/2004 | DE102004001502A1 Halbleitervorrichtung Semiconductor device |
| 12/09/2004 | DE102004001023A1 Verfahren zum Isolieren von Speicherelementen in einem Array A method for isolating memory elements in an array |
| 12/08/2004 | EP1484953A1 Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device |
| 12/08/2004 | EP1484949A2 Processing low dielectric constant materials for high speed electronics |
| 12/08/2004 | EP1484946A2 Organic electroluminescent display panel, method of manufacturing it and display device equiped with the panel |
| 12/08/2004 | EP1484797A1 Inverter power device and method of making it |
| 12/08/2004 | EP1484796A2 Semiconductor device and manufacturing method of the same |
| 12/08/2004 | EP1484795A1 Method for manufacturing a chip scale package at wafer level |
| 12/08/2004 | EP1484794A1 A method for fabricating a carrier substrate |
| 12/08/2004 | EP1484793A1 Electronic circuit device and porduction method therefor |
| 12/08/2004 | EP1484792A1 Method for grinding rear surface of semiconductor wafer |
| 12/08/2004 | EP1484791A1 Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film |
| 12/08/2004 | EP1484790A1 Semiconductor device and method for fabricating the same |
| 12/08/2004 | EP1484789A1 Non-uniform minority carrier lifetime distributions in high performance silicon power devices |
| 12/08/2004 | EP1484788A1 High-frequency power supply structure and plasma cvd device using the same |
| 12/08/2004 | EP1484787A1 Holder for semiconductor production system |
| 12/08/2004 | EP1484786A2 Wafer processing apparatus and method |
| 12/08/2004 | EP1484767A2 Magnetic memory apparatus and method of manufacturing magnetic memory apparatus |
| 12/08/2004 | EP1484766A1 Magnetic storage unit using ferromagnetic tunnel junction element |
| 12/08/2004 | EP1484765A1 High density magnetoresistance memory and manufacturing method thereof |
| 12/08/2004 | EP1484644A2 Mould, pattern of nano wires, multiplexer/demultiplexer and method of making same |
| 12/08/2004 | EP1484429A1 Semiconductor or liquid crystal producing device |
| 12/08/2004 | EP1484354A1 Siloxane-based resin and interlayer insulating film for semiconductor device made using the same |
| 12/08/2004 | EP1484297A1 Method for manufacturing silicon carbide sintered compact jig and silicon carbide sintered compact jig manufactured by the method |
| 12/08/2004 | EP1483793A2 Schottky power diode comprising a sicoi substrate and the method of producing one such diode |
| 12/08/2004 | EP1483792A1 Detector arrangement, method for the detection of electrical charge carriers and use of an ono field effect transistor of r detection of an electrical charge |
| 12/08/2004 | EP1483791A1 Trench dmos transistor having improved trench structure |
| 12/08/2004 | EP1483789A2 Semiconductor device having a wire bond pad and method therefor |
| 12/08/2004 | EP1483787A2 Semiconductor device having a bond pad and method therefor |
| 12/08/2004 | EP1483786A1 Method and resulting structure for manufacturing semiconductor substrate |
| 12/08/2004 | EP1483785A1 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
| 12/08/2004 | EP1483784A2 Method for forming thin film layers by simultaneous doping and sintering |
| 12/08/2004 | EP1483783A2 Strained si based layer made by uhv-cvd; and devices therein |
| 12/08/2004 | EP1483782A1 Production method of sic monitor wafer |
| 12/08/2004 | EP1483781A2 Diagnostic system and method for integrated remote tool access, data collection, and control |
| 12/08/2004 | EP1483780A2 Device and method for anisotropically plasma etching a substrate |
| 12/08/2004 | EP1483779A2 System and method for design, procurement and manufacturing collaboration |
| 12/08/2004 | EP1483778A1 A METHOD FOR THE WET TREATMENT OF DISK−LIKE OBJECTS |
| 12/08/2004 | EP1483762A2 Magnetic flux concentrating cladding material on conductive lines of mram |
| 12/08/2004 | EP1483723A1 Methods and apparatus for fabricating chip-on-board modules |
| 12/08/2004 | EP1483722A1 Memory module assembly using partially defective chips |
| 12/08/2004 | EP1483712A2 Management system, method and apparatus for licensed delivery and accounting of electronic circuits |
| 12/08/2004 | EP1483637A1 System for brokering fault detection data |
| 12/08/2004 | EP1483628A1 Full phase shifting mask in damascene process |
| 12/08/2004 | EP1483627A2 Position detecting method, surface shape estimating method, and exposure apparatus and device manufacturing method using the same |
| 12/08/2004 | EP1483626A2 Refractive projection lens |
| 12/08/2004 | EP1483625A1 High-aperture projection lens |
| 12/08/2004 | EP1483614A2 Objective lens consisting of crystal lenses |
| 12/08/2004 | EP1483596A1 Integrated circuit with test circuit |
| 12/08/2004 | EP1483595A2 High resolution scanning magnetic microscope operable at high temperature |
| 12/08/2004 | EP1483570A1 Mutli-detector defect detection system and a method for detecting defects |
| 12/08/2004 | EP1483559A2 Moir method and measuring system for measuring the distortion of an optical imaging system |
| 12/08/2004 | EP1483419A2 Lead−free tin−silver−copper alloy solder composition |
| 12/08/2004 | EP1483349A1 Anionic abrasive particles treated with positively-charged polyelectrolytes for cmp |
| 12/08/2004 | EP1483320A2 Printing of organic conductive polymers containing additives |
| 12/08/2004 | EP1483196A1 Deflectable microstructure and method of manufacturing the same through bonding of wafers |
| 12/08/2004 | EP1483182A2 Reinforced chemical mechanical planarization belt |
| 12/08/2004 | EP1483179A1 Wafer carrier door with form fitting mechanism cover |
| 12/08/2004 | EP1483063A1 Method and device for the decontamination of optical surfaces |
| 12/08/2004 | EP1399966B1 Power pads for application of high current per bond pad in silicon technology |
| 12/08/2004 | EP1390309A4 Method for producing titania-doped fused silica extreme ultraviolet lithography substrates glass |
| 12/08/2004 | EP1309639A4 Compositions and methods for thermosetting molecules in organic compositions |
| 12/08/2004 | EP1222323A4 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 12/08/2004 | EP1192419A4 Integrated and multi-axis sensor assembly and packaging |
| 12/08/2004 | EP1090414B1 Resin molded article for chamber liner |
| 12/08/2004 | EP0925609B1 Stacked read-only memory |
| 12/08/2004 | EP0870319B1 A method for the manufacturing of micromachined structures |
| 12/08/2004 | EP0843901B1 Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom |
| 12/08/2004 | CN2662449Y Base plate stack type packaging structure |