H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2004
12/02/2004	WO2004104699A1 Correction of pattern dimension
12/02/2004	WO2004104698A2 Dielectric materials to prevent photoresist poisoning
12/02/2004	WO2004104542A1 Integrated resistor network for multi-functional use in constant current or constant voltage operation of a pressure sensor
12/02/2004	WO2004104493A2 Methods of controlling uniformity of substrate temperature and self-contained heating unit and drug-supply unit employing same
12/02/2004	WO2004104492A2 Optically ignited or electrically ignited self-contained heating unit and drug-supply unit employing same
12/02/2004	WO2004104491A2 Percussively ignited or electrically ignited self-contained heating unit and drug-supply unit employing same
12/02/2004	WO2004104490A1 Self-contained heating unit and drug-supply unit employing same
12/02/2004	WO2004104276A1 Method for producing single crystal of multi- element oxide single crystal containing bismuth as constituting element
12/02/2004	WO2004104274A2 Zinc oxide crystal growth substrate
12/02/2004	WO2004103932A1 Piezoelectric material working method
12/02/2004	WO2004103636A2 Substrate polishing apparatus
12/02/2004	WO2004095552A3 Method for producing a tensioned layer on a substrate, and a layer structure
12/02/2004	WO2004092441A3 Methods for producing silicon nitride films by vapor-phase growth
12/02/2004	WO2004088731A3 Methods for fabricating three-dimensional all organic interconnect structures
12/02/2004	WO2004082111A3 Mosfet power transistors and methods
12/02/2004	WO2004082003A3 Apparatuses and methods for forming a substantially facet-free epitaxial film
12/02/2004	WO2004079815A3 Non volatile memory cell
12/02/2004	WO2004077527A3 Area-array device assembly with pre-applied underfill layers on printed wiring board
12/02/2004	WO2004077513A3 Packaging system for power supplies
12/02/2004	WO2004076575A3 Modular barrier removal polishing slurry
12/02/2004	WO2004073044A3 Finfet device and method to make same
12/02/2004	WO2004073015A3 Multiple conductive plug structure including at least one conductive plug region and at least one between-conductive-plug region for lateral rf mos devices
12/02/2004	WO2004072959A3 Disk coating system
12/02/2004	WO2004068541A3 Wafer handling apparatus
12/02/2004	WO2004064291A3 Method and apparatus for dual conduction analog programming
12/02/2004	WO2004052547A3 Coated and magnetic particles and applications thereof
12/02/2004	WO2004049432A3 Sealing porous structures
12/02/2004	WO2004049402A3 Zirconia toughened alumina esd safe ceramic composition, component, and methods for making same
12/02/2004	WO2004038870A3 Selectable area laser assisted processing of substrates
12/02/2004	WO2004030014A3 Optical window deposition shield in a plasma processing system
12/02/2004	WO2004021088A3 Lithographic method for small line printing
12/02/2004	WO2004021022A3 Integrated circuit with embedded identification code
12/02/2004	WO2004019391A3 Semiconductor heterostructures having reduced dislocation pile-ups and related methods
12/02/2004	WO2004019384B1 Semiconductor constructions with gated isolation regions having indium-doped sub-regions
12/02/2004	WO2004018348A3 Layer system comprising a silicon layer and a passivation layer, method for producing a passivation layer on a silicon layer and the use of said system and method
12/02/2004	WO2004013038A3 Etch stop control for mems device formation
12/02/2004	US20040243967 Semiconductor design layout pattern formation method and graphic pattern formation unit
12/02/2004	US20040243961 Integrated structure layout and layout of interconnections for an instruction execution unit of an integrated circuit chip
12/02/2004	US20040243959 Design method for semiconductor integrated circuit device
12/02/2004	US20040243957 Clocktree tuning shims and shim tuning method
12/02/2004	US20040243891 Failure analysis method of semiconductor device
12/02/2004	US20040243320 Visual inspection and verification system
12/02/2004	US20040243269 Performance evaluation method for plasma processing apparatus
12/02/2004	US20040242821 comprises pendant polysilsequioxanes which improve alkali solubility under the action of an acid; photoresists have improved resistance to etching
12/02/2004	US20040242820 preparing transparent films at 157 nm; solutions of perfluorodioxole polymers with stable, nonionic end groups in perfluorinated solvents are sintered and pelletized for infrared spectrum analysis
12/02/2004	US20040242798 Photoresist compositions and processes for preparing the same
12/02/2004	US20040242796 Unsaturated compounds containing silane, electron donor and electron acceptor functionality
12/02/2004	US20040242446 Cleaning agent including a corrosion inhibitor used in a process of forming a semiconductor device
12/02/2004	US20040242400 Carbon-containing aluminum nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductor
12/02/2004	US20040242136 Air platen for leading edge and trailing edge control
12/02/2004	US20040242132 Polishing element, cmp polishing device and productionj method for semiconductor device
12/02/2004	US20040242127 Apparatus and method for feeding slurry
12/02/2004	US20040242126 CMP apparatus, CMP polishing method, semiconductor device and its manufacturing method
12/02/2004	US20040242124 Apparatus methods for controlling wafer temperature in chemical mechanical polishing
12/02/2004	US20040242123 Method for monitoring a substrate during chemical mechanical polishing
12/02/2004	US20040242121 Substrate polishing apparatus
12/02/2004	US20040242112 Manufacturing method and structure of copper lines for a liquid crystal panel
12/02/2004	US20040242027 Integrated circuit device and wiring board
12/02/2004	US20040242024 Film forming method for semiconductor device
12/02/2004	US20040242023 Polymeric structures, particularly microstructures, and methods for making same
12/02/2004	US20040242022 Production method for semiconductor device
12/02/2004	US20040242021 Method and apparatus for plasma nitridation of gate dielectrics using amplitude modulated radio-frequency energy
12/02/2004	US20040242020 Semiconductor device and production method therefor
12/02/2004	US20040242019 Combined etching and doping substances
12/02/2004	US20040242018 Etching process
12/02/2004	US20040242017 Etchant for signal wire and method of manufacturing thin film transistor array panel using etchant
12/02/2004	US20040242016 Compositions for dissolution of low-k dielectric films, and methods of use
12/02/2004	US20040242015 Etching compositions for silicon germanium and etching methods using the same
12/02/2004	US20040242014 Method of manufacturing a semiconductor integrated circuit device
12/02/2004	US20040242013 Siloxane-based resin and interlayer insulating film for a semiconductor device made using the same
12/02/2004	US20040242012 Method of plasma treatment
12/02/2004	US20040242011 Etching method and semiconductor device fabricating method
12/02/2004	US20040242010 Sti stress modification by nitrogen plasma treatment for improving performance in small width devices
12/02/2004	US20040242008 Method of forming contact holes and electronic device formed thereby
12/02/2004	US20040242007 Process for producing aluminum-filled contact holes
12/02/2004	US20040242006 SiGe lattice engineering using a combination of oxidation, thinning and epitaxial regrowth
12/02/2004	US20040242004 Substrate treating method and apparatus
12/02/2004	US20040242003 Method for thinning wafer by grinding
12/02/2004	US20040242002 Wafer back surface treating method and dicing sheet adhering apparatus
12/02/2004	US20040242001 Notched compound semiconductor wafer
12/02/2004	US20040242000 Etchant and array substrate having copper lines etched by the etchant
12/02/2004	US20040241999 Method and apparatus for controlling material removal from semiconductor substrate using induced current endpointing
12/02/2004	US20040241998 System for processing a workpiece
12/02/2004	US20040241997 Method for manufacturing quartz oscillator
12/02/2004	US20040241996 Apparatus and method for preventing substrates from being contaminated by condensed liquid
12/02/2004	US20040241995 Etching apparatus and etching method
12/02/2004	US20040241994 Microelectromechanical device and method for producing it
12/02/2004	US20040241993 Method for forming double density wordline
12/02/2004	US20040241992 Silicon monocrystal wafer processing device, and method of manufacturing silicon monocrystal wafer and silicon epitaxial wafer
12/02/2004	US20040241991 Method and device for processing substrate, and apparatus for manufacturing semiconductor device
12/02/2004	US20040241989 Method of using multiple, different slurries in a CMP polishing process via a pad conditioning system
12/02/2004	US20040241988 Chemical vapor deposition metallization processes and chemical vapor deposition apparatus used therein
12/02/2004	US20040241987 Contact portion of semiconductor device, and thin film transistor array panel for display device including the contact portion
12/02/2004	US20040241986 Processing methods of forming an electrically conductive plug to a node location
12/02/2004	US20040241985 Substrate processing method and apparatus
12/02/2004	US20040241984 Method of adjusting etch selectivity by adapting aspect ratios in a multi-level etch process
12/02/2004	US20040241983 Method for manufacturing metal line of semiconductor device
12/02/2004	US20040241982 Method of manufacturing semiconductor device
12/02/2004	US20040241981 STRUCTURE AND METHOD TO FABRICATE ULTRA-THIN Si CHANNEL DEVICES
12/02/2004	US20040241980 Method for manufacturing semiconductor device

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