Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2005
01/06/2005US20050003675 Dielectric etch chamber with expanded process window
01/06/2005US20050003674 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
01/06/2005US20050003673 Thin film resistor etch
01/06/2005US20050003672 Method and apparatus for smoothing surfaces on an atomic scale
01/06/2005US20050003671 High density plasma chemical vapor deposition process
01/06/2005US20050003670 Manufacturing method of semiconductor integrated circuit device
01/06/2005US20050003669 HF vapor phase cleaning and oxide etching
01/06/2005US20050003668 Plasma assisted pre-planarization process
01/06/2005US20050003667 Method for fabricating optical interference display cell
01/06/2005US20050003666 CMP slurry and method of manufacturing semiconductor device
01/06/2005US20050003664 Method and apparatus for low temperature copper to copper bonding
01/06/2005US20050003663 Integrated circuit having barrier metal surface treatment prior to Cu deposition
01/06/2005US20050003662 Methods for forming aluminum containing films utilizing amino aluminum precursors
01/06/2005US20050003661 Polysulfone compositions exhibiting very low color and high light transmittance properties and articles made therefrom
01/06/2005US20050003660 Semiconductor device and production method therefor
01/06/2005US20050003659 Transparent inter-metal dielectric stack for CMOS image sensors
01/06/2005US20050003658 Methods for forming via plugs
01/06/2005US20050003657 Semiconductor device having multilevel interconnections and method of manufacturing the same
01/06/2005US20050003656 Metal interconnections for semiconductor devices including a buffer layer on a trench sidewall
01/06/2005US20050003655 MOCVD process using ozone as a reactant to deposit a metal oxide barrier layer
01/06/2005US20050003654 Method of producing semiconductor device
01/06/2005US20050003653 Production method for semiconductor device
01/06/2005US20050003652 Method and apparatus for low temperature copper to copper bonding
01/06/2005US20050003651 Process of forming bonding columns
01/06/2005US20050003650 Three-dimensional stacked substrate arrangements
01/06/2005US20050003649 Semiconductor device and manufacturing method thereof
01/06/2005US20050003648 Pasted wafer and method for producing pasted wafer
01/06/2005US20050003646 Semiconductor devices having DRAM cells and methods of fabricating the same
01/06/2005US20050003645 Forming process of thin film pattern and manufacturing process of device, electro-optical apparatus and electronic apparatus
01/06/2005US20050003641 Method for fabricating an epitaxial substrate
01/06/2005US20050003640 Method for fabricating thin film pattern, device and fabricating method therefor, method for fabricating liquid crystal display, liquid crystal display, method for fabricating active matrix substrate, electro-optical apparatus, and electrical apparatus
01/06/2005US20050003639 Method of forming a polysilicon layer
01/06/2005US20050003638 Method of manufacturing a semiconductor device
01/06/2005US20050003637 Damascene fabrication with electrochemical layer removal
01/06/2005US20050003636 Manufacturing method of semiconductor device
01/06/2005US20050003635 Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film
01/06/2005US20050003634 Semiconductor device separation using a patterned laser projection
01/06/2005US20050003633 Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment
01/06/2005US20050003632 Method for cutting a sapphire substrate for a semiconductor device
01/06/2005US20050003631 Method and apparatus for assembling an array of micro-devices
01/06/2005US20050003630 Trench isolation without grooving
01/06/2005US20050003629 Method for processing semiconductor substrate
01/06/2005US20050003628 Methods of etching intermediate silicon germanium layers using ion implantation to promote selectivity
01/06/2005US20050003627 Method of forming a field effect transistor
01/06/2005US20050003626 Control of buried oxide in SIMOX
01/06/2005US20050003625 Method of controlling the top width of a deep trench
01/06/2005US20050003623 Arrangement for preventing short-circuiting in a bipolar double-poly transistor and a method of fabricating such an arrangement
01/06/2005US20050003622 Structure and fabricating method with self-aligned bit line contact to word line in split gate flash
01/06/2005US20050003621 Semiconductor device and method for fabricating the same
01/06/2005US20050003620 Methods of forming quantum dots in semiconductor devices
01/06/2005US20050003619 Nonvolatile semiconductor memory and manufacturing method for the same
01/06/2005US20050003618 Method of manufacturing semiconductor device having oxide films with different thickness
01/06/2005US20050003617 Template padding method for padding edges of holes on semiconductor masks
01/06/2005US20050003616 Self aligned non-volatile memory cell and process for fabrication
01/06/2005US20050003615 Semiconductor devices, methods of manufacturing semiconductor devices, circuit substrates and electronic devices
01/06/2005US20050003614 Semiconductor memory device including a flash memory cell array and a mask read-only memory cell array
01/06/2005US20050003613 Method for fabricating a semiconductor memory having charge trapping memory cells and semiconductor substrate
01/06/2005US20050003612 Sram cell
01/06/2005US20050003611 Methods of fabricating double-sided hemispherical silicon grain electrodes and capacitor modules
01/06/2005US20050003610 Dual-damascene bit line structures for microelectronic devices and methods of fabricating microelectronic devices
01/06/2005US20050003609 Method for forming a storage cell capacitor compatible with high dielectric constant materials
01/06/2005US20050003608 Method for eliminating inverse narrow width effects in the fabrication of DRAM device
01/06/2005US20050003607 Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages
01/06/2005US20050003606 Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
01/06/2005US20050003605 Cmos performance enhancement using localized voids and extended defects
01/06/2005US20050003604 CMOS performance enhancement using localized voids and extended defects
01/06/2005US20050003601 Polysilicon gate doping level variation for reduced leakage current
01/06/2005US20050003600 Gas treating device and gas treating method
01/06/2005US20050003599 Mosfet device with a strained channel
01/06/2005US20050003598 Low dose super deep source/drain implant
01/06/2005US20050003597 Method of forming a gate oxide layer in a semiconductor device and method of forming a gate electrode having the same
01/06/2005US20050003596 Process sequence and mask layout to reduce junction leakage for a dual gate MOSFET device
01/06/2005US20050003595 Field effect transistor having source and/or drain forming Schottky or Schottky-like contact with strained semiconductor substrate
01/06/2005US20050003594 Laser doping processing method and method for manufacturing semiconductor device
01/06/2005US20050003593 Semiconductor device and method of manufacture
01/06/2005US20050003592 All-around MOSFET gate and methods of manufacture thereof
01/06/2005US20050003591 Method of and apparatus for manufacturing semiconductor thin film, and method of manufacturing thin film transistor
01/06/2005US20050003590 Method for defining a source and a drain and a gap inbetween
01/06/2005US20050003589 Structure and method to fabricate ultra-thin Si channel devices
01/06/2005US20050003588 Method for patching up thin-film transistor circuits on a display panel by local thin-film deposition
01/06/2005US20050003587 Method of manufacturing semiconductor device and method of manufacturing electronics device
01/06/2005US20050003586 Manufacturing method of a semiconductor device
01/06/2005US20050003584 System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
01/06/2005US20050003583 Micro lead frame package and method to manufacture the micro lead frame package
01/06/2005US20050003582 Semiconductor device and method of manufacturing the device
01/06/2005US20050003581 Thin stacked package and manufacturing method thereof
01/06/2005US20050003580 Stacked chip semiconductor device and method for manufacturing the same
01/06/2005US20050003579 Imaging system
01/06/2005US20050003578 Method of fabricating organic electroluminescence panel package
01/06/2005US20050003577 Semiconductor package production method and semiconductor package
01/06/2005US20050003576 Semiconductor device manufacturing method
01/06/2005US20050003575 Apparatus, systems and methods relating to the reconstruction of semiconductor wafers for wafer-level processing and reconstructed semiconductor wafers
01/06/2005US20050003574 Method of creating a high performance organic semiconductor device
01/06/2005US20050003573 Field-effect type semiconductor device for power amplifier
01/06/2005US20050003572 Method for fabricating a plurality of semiconductor chips
01/06/2005US20050003570 Semiconductor device fabrication method
01/06/2005US20050003568 Semiconductor device and method for forming the same
01/06/2005US20050003567 Manufacturing method of organic electroluminescence display device
01/06/2005US20050003566 Micromachine production method
01/06/2005US20050003563 Method for manufacturing semiconductor device